ES2733806T3 - Láser de diodos de alta potencia y procedimiento para la fabricación de un láser de diodos de alta potencia - Google Patents

Láser de diodos de alta potencia y procedimiento para la fabricación de un láser de diodos de alta potencia Download PDF

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Publication number
ES2733806T3
ES2733806T3 ES10173278T ES10173278T ES2733806T3 ES 2733806 T3 ES2733806 T3 ES 2733806T3 ES 10173278 T ES10173278 T ES 10173278T ES 10173278 T ES10173278 T ES 10173278T ES 2733806 T3 ES2733806 T3 ES 2733806T3
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ES
Spain
Prior art keywords
layer
high power
power diode
diode laser
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES10173278T
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English (en)
Spanish (es)
Inventor
Marc Kelemen
Rudolf Moritz
Jürgen Gilly
Patrick Friedmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dilas Diodenlaser GmbH
Original Assignee
Dilas Diodenlaser GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dilas Diodenlaser GmbH filed Critical Dilas Diodenlaser GmbH
Application granted granted Critical
Publication of ES2733806T3 publication Critical patent/ES2733806T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/0014Measuring characteristics or properties thereof
    • H01S5/0021Degradation or life time measurements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/028Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/0201Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • H01S5/0202Cleaving
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/028Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
    • H01S5/0282Passivation layers or treatments
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/028Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
    • H01S5/0282Passivation layers or treatments
    • H01S5/0283Optically inactive coating on the facet, e.g. half-wave coating

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
ES10173278T 2009-08-28 2010-08-18 Láser de diodos de alta potencia y procedimiento para la fabricación de un láser de diodos de alta potencia Active ES2733806T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009028985 2009-08-28
DE102009054912A DE102009054912A1 (de) 2009-08-28 2009-12-17 Hochleistungs-Diodenlaser und Verfahren zum Herstellen eines Hochleistungs-Diodenlasers

Publications (1)

Publication Number Publication Date
ES2733806T3 true ES2733806T3 (es) 2019-12-03

Family

ID=42989237

Family Applications (1)

Application Number Title Priority Date Filing Date
ES10173278T Active ES2733806T3 (es) 2009-08-28 2010-08-18 Láser de diodos de alta potencia y procedimiento para la fabricación de un láser de diodos de alta potencia

Country Status (4)

Country Link
US (1) US9450375B2 (de)
EP (1) EP2290766B1 (de)
DE (1) DE102009054912A1 (de)
ES (1) ES2733806T3 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9972968B2 (en) * 2016-04-20 2018-05-15 Trumpf Photonics, Inc. Passivation of laser facets and systems for performing the same
DE102017112610A1 (de) * 2017-06-08 2018-12-13 Osram Opto Semiconductors Gmbh Kantenemittierender Halbleiterlaser und Betriebsverfahren für einen solchen Halbleiterlaser
JP7296934B2 (ja) * 2018-02-14 2023-06-23 ヌヴォトンテクノロジージャパン株式会社 窒化物半導体レーザ素子及び照明光源モジュール
US10418781B1 (en) 2018-07-06 2019-09-17 Ii-Vi Delaware, Inc. Quantum well passivation structure for laser facets
CN109659810B (zh) * 2018-12-24 2021-10-08 香港中文大学(深圳) 一种降低微腔半导体激光器阈值的方法
JP7672258B2 (ja) * 2021-03-26 2025-05-07 古河電気工業株式会社 半導体レーザ素子および半導体レーザ素子の製造方法
JP7802468B2 (ja) * 2021-06-29 2026-01-20 ヌヴォトンテクノロジージャパン株式会社 窒化物半導体発光素子
CN115915817A (zh) * 2021-09-30 2023-04-04 Tcl科技集团股份有限公司 发光器件及其制备方法、显示装置
EP4475361A4 (de) * 2022-02-01 2025-05-28 Panasonic Holdings Corporation Halbleiterlaserelement

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55115386A (en) * 1979-02-26 1980-09-05 Hitachi Ltd Semiconductor laser unit
JPS5955077A (ja) * 1982-09-22 1984-03-29 Sanyo Electric Co Ltd 光起電力装置
US4563368A (en) 1983-02-14 1986-01-07 Xerox Corporation Passivation for surfaces and interfaces of semiconductor laser facets or the like
DE68915763T2 (de) 1989-09-07 1994-12-08 Ibm Verfahren zur Spiegelpassivierung bei Halbleiterlaserdioden.
US5144634A (en) 1989-09-07 1992-09-01 International Business Machines Corporation Method for mirror passivation of semiconductor laser diodes
DE69006353T2 (de) 1990-05-25 1994-06-23 Ibm Verfahren und Vorrichtung zum Spalten von Halbleiterplatten und Bekleiden der gespalteten Facetten.
JPH0432285A (ja) * 1990-05-29 1992-02-04 Omron Corp 端面出射型半導体発光素子
EP0637862A3 (de) * 1993-08-05 1995-05-24 Hitachi Ltd Halbleiterlaservorrichtung und Herstellungsverfahren.
FR2742926B1 (fr) * 1995-12-22 1998-02-06 Alsthom Cge Alcatel Procede et dispositif de preparation de faces de laser
US5939732A (en) * 1997-05-22 1999-08-17 Kulite Semiconductor Products, Inc. Vertical cavity-emitting porous silicon carbide light-emitting diode device and preparation thereof
US6396864B1 (en) * 1998-03-13 2002-05-28 Jds Uniphase Corporation Thermally conductive coatings for light emitting devices
US6618409B1 (en) 2000-05-03 2003-09-09 Corning Incorporated Passivation of semiconductor laser facets
JP2003078199A (ja) * 2001-09-03 2003-03-14 Fuji Photo Film Co Ltd 半導体レーザ装置
DE10221952B4 (de) 2002-05-13 2007-07-12 Forschungsverbund Berlin E.V. Verfahren zur Passivierung der Spiegelflächen von optischen Halbleiterbauelementen
KR20090121361A (ko) * 2007-02-27 2009-11-25 식스트론 어드밴스드 머티리얼즈 인코포레이티드 기판상에 막을 형성하는 방법

Also Published As

Publication number Publication date
US20110051767A1 (en) 2011-03-03
EP2290766A2 (de) 2011-03-02
DE102009054912A1 (de) 2011-03-10
US9450375B2 (en) 2016-09-20
EP2290766B1 (de) 2019-04-03
EP2290766A3 (de) 2015-04-22

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