ES2872875T3 - Sistemas de refrigeración líquida para dispositivos generadores de calor - Google Patents

Sistemas de refrigeración líquida para dispositivos generadores de calor Download PDF

Info

Publication number
ES2872875T3
ES2872875T3 ES18704312T ES18704312T ES2872875T3 ES 2872875 T3 ES2872875 T3 ES 2872875T3 ES 18704312 T ES18704312 T ES 18704312T ES 18704312 T ES18704312 T ES 18704312T ES 2872875 T3 ES2872875 T3 ES 2872875T3
Authority
ES
Spain
Prior art keywords
fins
barrier walls
coolant
cold plate
channels
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES18704312T
Other languages
English (en)
Spanish (es)
Inventor
Peter Lykke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asetek AS
Original Assignee
Asetek AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asetek AS filed Critical Asetek AS
Application granted granted Critical
Publication of ES2872875T3 publication Critical patent/ES2872875T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/0207—Wire harnesses
    • B60R16/0215—Protecting, fastening and routing means therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
    • F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
    • F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H05K5/0052—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by joining features of the housing parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239—Electronic boxes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
ES18704312T 2017-02-03 2018-01-31 Sistemas de refrigeración líquida para dispositivos generadores de calor Active ES2872875T3 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762454321P 2017-02-03 2017-02-03
US201762534316P 2017-07-19 2017-07-19
PCT/IB2018/050616 WO2018142310A1 (en) 2017-02-03 2018-01-31 Liquid cooling systems for heat generating devices

Publications (1)

Publication Number Publication Date
ES2872875T3 true ES2872875T3 (es) 2021-11-03

Family

ID=61189495

Family Applications (1)

Application Number Title Priority Date Filing Date
ES18704312T Active ES2872875T3 (es) 2017-02-03 2018-01-31 Sistemas de refrigeración líquida para dispositivos generadores de calor

Country Status (8)

Country Link
US (1) US20180228040A1 (pl)
EP (1) EP3577406B1 (pl)
CN (1) CN110268217A (pl)
DK (1) DK3577406T3 (pl)
ES (1) ES2872875T3 (pl)
PL (1) PL3577406T3 (pl)
TW (1) TW201839343A (pl)
WO (1) WO2018142310A1 (pl)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7181443B2 (ja) * 2018-02-14 2022-12-01 日本電産サンキョー株式会社 冷却装置
JP7238401B2 (ja) * 2018-03-30 2023-03-14 日本電産株式会社 冷却装置
JP2019179832A (ja) * 2018-03-30 2019-10-17 日本電産株式会社 冷却装置
CN109976484B (zh) * 2019-04-16 2021-01-08 山东劳动职业技术学院（山东劳动技师学院） 一种用于计算机cpu的降温装置
CN113672059B (zh) * 2020-05-15 2025-01-24 亚浩电子五金塑胶（惠州）有限公司 电脑液冷系统
CN213960586U (zh) * 2020-06-12 2021-08-13 春鸿电子科技(重庆)有限公司 水冷头
CN114121849B (zh) * 2020-08-27 2025-10-31 讯凯国际股份有限公司 水冷散热装置及其制造方法
CN114138082A (zh) * 2020-09-03 2022-03-04 北京图森智途科技有限公司 散热系统以及服务器系统
US11812582B2 (en) * 2020-11-09 2023-11-07 Baidu Usa Llc Symmetrical cold plate design
CN114554779B (zh) * 2020-11-24 2025-01-28 深圳引望智能技术有限公司 一种散热装置和车辆
EP4092720A1 (en) * 2021-05-20 2022-11-23 Aptiv Technologies Limited Heat sink
CN116979086B (zh) * 2022-04-21 2026-05-08 北京亿华通科技股份有限公司 一种冷却液置换方法、装置及应用
US12324127B2 (en) * 2022-07-19 2025-06-03 Hewlett Packard Enterprise Development Lp Folded-fin vapor chamber cold plate
CN221728783U (zh) * 2024-01-11 2024-09-17 健昶精密有限公司 散热水冷头
CN118843018B (zh) * 2024-09-13 2024-11-22 长春电子科技学院 一种适用于5g通讯基站机柜的换热设备

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5020586A (en) * 1989-09-08 1991-06-04 Hewlett-Packard Company Air-cooled heat exchanger for electronic circuit modules
TW556074B (en) * 1998-12-15 2003-10-01 Foxconn Prec Components Co Ltd Heat sink and the manufacturing method thereof
CN102902329B (zh) * 2005-05-06 2015-09-09 阿塞泰克丹麦公司 用于计算机系统的冷却系统
US7411290B2 (en) * 2005-08-05 2008-08-12 Delphi Technologies, Inc. Integrated circuit chip and method for cooling an integrated circuit chip
US7331378B2 (en) * 2006-01-17 2008-02-19 Delphi Technologies, Inc. Microchannel heat sink
US20080017360A1 (en) * 2006-07-20 2008-01-24 International Business Machines Corporation Heat exchanger with angled secondary fins extending from primary fins
CN101155501B (zh) * 2006-09-27 2011-11-09 鸿富锦精密工业（深圳）有限公司 散热器
US20090260789A1 (en) * 2008-04-21 2009-10-22 Dana Canada Corporation Heat exchanger with expanded metal turbulizer
JP4485583B2 (ja) * 2008-07-24 2010-06-23 トヨタ自動車株式会社 熱交換器及びその製造方法
US20100065248A1 (en) * 2008-09-17 2010-03-18 Asia Vital Components Co., Ltd. Heat sink
CN102422413B (zh) * 2009-05-11 2014-07-30 丰田自动车株式会社 热交换器、半导体装置及它们的制造方法
JP4920071B2 (ja) * 2009-11-12 2012-04-18 株式会社日本自動車部品総合研究所 半導体素子の冷却装置
CN201655785U (zh) * 2010-04-15 2010-11-24 华中科技大学 用于电子封装器件的微通道热沉
US20120175094A1 (en) * 2011-01-10 2012-07-12 Asetek A/S Liquid Cooling System Cold Plate Assembly
JP5768795B2 (ja) * 2011-10-18 2015-08-26 カルソニックカンセイ株式会社 排気熱交換装置
CN103547115A (zh) * 2012-07-13 2014-01-29 台达电子工业股份有限公司 散热器、电子装置与热交换装置
US9765694B2 (en) * 2012-08-07 2017-09-19 Unison Industries, Llc Gas turbine engine heat exchangers and methods of assembling the same
US9224673B2 (en) * 2013-03-08 2015-12-29 Taiwan Semiconductor Manufacturing Company, Ltd. Packages for semiconductor devices, packaged semiconductor devices, and methods of cooling packaged semiconductor devices

Also Published As

Publication number Publication date
EP3577406B1 (en) 2021-04-21
US20180228040A1 (en) 2018-08-09
WO2018142310A1 (en) 2018-08-09
PL3577406T3 (pl) 2021-10-04
DK3577406T3 (da) 2021-06-21
CN110268217A (zh) 2019-09-20
TW201839343A (zh) 2018-11-01
EP3577406A1 (en) 2019-12-11

Similar Documents

Publication Publication Date Title
EP3577406B1 (en) Liquid cooling systems for heat generating devices
CN100385653C (zh) 液冷罩
US20130233523A1 (en) Cold plate with combined inclined impingement and ribbed channels
US20240118042A1 (en) Heat Exchanger
JP7225666B2 (ja) 冷却ユニット
US10959353B2 (en) Cooling device
JP5423625B2 (ja) Ｅｈｄ流体を用いた冷却装置
CN111480261A (zh) 用于冷却电能存储单元的装置
ES2898528T3 (es) Intercambiador de calor
JP4619387B2 (ja) 半導体素子の冷却装置
KR102030143B1 (ko) 수랭식 양면 냉각기
JP4041437B2 (ja) 半導体素子の冷却装置
US20120103575A1 (en) Cooling device
JP4664387B2 (ja) ラジエータ
CN211019741U (zh) 冷却装置
US20190380227A1 (en) Water cooler assembly and system
US20180003447A1 (en) Heat-exchange element suitable for a heat exchange between first and second fluids, an exchanger core including the heat-exchange element and a heat exchanger including the exchanger core
US20230164947A1 (en) Water cooler assembly and system
CN107003077A (zh) 冷却器
CN206525066U (zh) 冷却水排装置及其水冷模块
CN207517665U (zh) 基于微通道模块的散热装置
CN115707212B (zh) 电控盒的散热板、散热组件、电控盒和空调器
KR20140080625A (ko) 수냉 장치
WO2010112654A1 (es) Intercambiador de calor
CN115175512A (zh) 流路模块、电力转换装置、马达装置和车辆