ES297137U - Tarjeta de memoria electronica - Google Patents

Tarjeta de memoria electronica

Info

Publication number
ES297137U
ES297137U ES1987297137U ES297137U ES297137U ES 297137 U ES297137 U ES 297137U ES 1987297137 U ES1987297137 U ES 1987297137U ES 297137 U ES297137 U ES 297137U ES 297137 U ES297137 U ES 297137U
Authority
ES
Spain
Prior art keywords
boards
card
face
roughnesses
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES1987297137U
Other languages
English (en)
Other versions
ES297137Y (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Flonic SA
Original Assignee
Flonic SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Flonic SA filed Critical Flonic SA
Publication of ES297137U publication Critical patent/ES297137U/es
Application granted granted Critical
Publication of ES297137Y publication Critical patent/ES297137Y/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Holo Graphy (AREA)
  • Photoreceptors In Electrophotography (AREA)

Abstract

TARJETA DE MEMORIA ELECTRONICA, QUE COMPRENDE UN CUERPO REALIZADO CON UN MATERIAL TERMOPLASTICO, Y PROVISTO DE UNA CAVIDAD, FORMADA POR UN PRIMER VACIADO, QUE DESEMBOCA EN UNA PRIMERA CARA PRINCIPAL DEL CUERPO DE LA TARJETA, Y UN SEGUNDO VACIADO, QUE DESEMBOCA EN EL FONDO DEL CITADO PRIMER VACIADO, Y UN MODULO ELECTRONICO ALOJADO EN LA CITADA CAVIDAD, QUE COMPRENDE UN SUSTRAYO SITUADO EN EL CITADO PRIMER VACIADO, PROVISTO SOBRE SU CARA EXTERNA DE ZONAS DE CONTACTO, DISPUESTAS SENSIBLEMENTE EN EL MISMO PLANO QUE LA CITADA PRIMERA CARA PRINCIPAL DEL CUERPO DE LA TARJETA, Y PROVISTO, SOBRE SU CARA INTERNA, DE UNA PASTILLA DE MATERIAL SEMICONDUCTOR Y DE CONEXIONES ELECTRICAS, CARACTERIZADA PORQUE COMPRENDE, ADEMAS, UNA PLURALIDAD DE ASPEREZAS, QUE FORMAN SALIENTE FUERA DEL CITADO FONDO, Y QUE SE ADHIEREN A LA CARA INTERNA DEL CITADO SOPORTE, SIENDO EL ESPACIO COMPRENDIDO ENTRE EL CITADO FONDO, EL CITADO SOPORTE, Y LAS CITADAS ASPEREZAS, SENSIBLEMENTE LLENADO POR UNA COLA AISLANTE.
ES1987297137U 1985-03-28 1987-03-16 Tarjeta de memoria electronica Expired ES297137Y (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8504658A FR2579799B1 (fr) 1985-03-28 1985-03-28 Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede

Publications (2)

Publication Number Publication Date
ES297137U true ES297137U (es) 1989-04-01
ES297137Y ES297137Y (es) 1989-10-16

Family

ID=9317687

Family Applications (2)

Application Number Title Priority Date Filing Date
ES553359A Expired ES8706990A1 (es) 1985-03-28 1986-03-25 Procedimiento para fabricar una tarjeta de memoria electronica.
ES1987297137U Expired ES297137Y (es) 1985-03-28 1987-03-16 Tarjeta de memoria electronica

Family Applications Before (1)

Application Number Title Priority Date Filing Date
ES553359A Expired ES8706990A1 (es) 1985-03-28 1986-03-25 Procedimiento para fabricar una tarjeta de memoria electronica.

Country Status (8)

Country Link
US (1) US4737620A (es)
EP (1) EP0197847B1 (es)
JP (1) JPS61227094A (es)
AT (1) ATE48484T1 (es)
CA (1) CA1255388A (es)
DE (1) DE3667345D1 (es)
ES (2) ES8706990A1 (es)
FR (1) FR2579799B1 (es)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2502511B2 (ja) * 1986-02-06 1996-05-29 日立マクセル株式会社 半導体装置の製造方法
US4996411A (en) * 1986-07-24 1991-02-26 Schlumberger Industries Method of manufacturing a card having electronic memory and a card obtained by performing said method
FR2605144B1 (fr) * 1986-10-14 1989-02-24 Flonic Sa Procede de realisation de cartes a memoire electronique et cartes obtenues par la mise en oeuvre dudit procede
FR2613510A1 (fr) * 1987-03-31 1988-10-07 Flonic Sa Procede de realisation de cartes a memoire electronique et cartes a memoire ainsi obtenues
CH672285A5 (es) * 1987-04-14 1989-11-15 Landis & Gyr Ag
JP2562476B2 (ja) * 1987-06-11 1996-12-11 大日本印刷株式会社 １ｃカードの製造方法
FR2617666B1 (fr) * 1987-07-02 1989-10-27 Bull Cp8 Carte a microcircuits electroniques et son procede de fabrication
US4921160A (en) * 1988-02-29 1990-05-01 American Telephone And Telegraph Company Personal data card and method of constructing the same
FR2629236B1 (fr) * 1988-03-22 1991-09-27 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede
US4961893A (en) * 1988-04-28 1990-10-09 Schlumberger Industries Method for manufacturing memory cards
FR2636453B1 (fr) * 1988-09-14 1992-01-17 Sgs Thomson Microelectronics Procede d'encapsulation de circuits-integres notamment pour cartes a puces
JPH0687484B2 (ja) * 1989-04-06 1994-11-02 三菱電機株式会社 Ｉｃカード用モジュール
FR2650530B1 (fr) * 1989-08-07 1991-11-29 Schlumberger Ind Sa Procede de realisation de corps de carte avec graphisme
US5282113A (en) * 1990-03-05 1994-01-25 Hitachi Maxell, Ltd. Memory card with a plurality of contact spaces
FR2664076A1 (fr) * 1990-03-28 1992-01-03 Schlumberger Ind Sa Procede de fabrication d'une carte a memoire electronique.
EP0472768A1 (de) * 1990-08-30 1992-03-04 Siemens Aktiengesellschaft Verfahren zum Befestigen eines Chipmoduls auf einer Chipkarte
FR2668096B1 (fr) * 1990-10-19 1993-01-22 Schlumberger Ind Sa Procede de fabrication de carte a memoire apte a recevoir une image photographique et carte ainsi obtenue.
ES2082470T5 (es) * 1991-05-10 2003-12-16 Gao Ges Automation Org Procedimiento y dispositivo para la fabricacion de piezas moldeadas de material plastico con espesor de paredes reducido por zonas.
FR2677785A1 (fr) * 1991-06-17 1992-12-18 Philips Composants Procede de fabrication d'une carte a microcircuit.
DE4126874C2 (de) * 1991-08-14 1997-05-22 Orga Kartensysteme Gmbh Datenträger mit integriertem Schaltkreis
DE9110057U1 (de) * 1991-08-14 1992-02-20 Orga Kartensysteme GmbH, 6072 Dreieich Datenträgerkarte mit eingeklebtem Schaltkreisträger
DE4140529C2 (de) * 1991-12-09 1997-07-31 Gao Ges Automation Org Verfahren zum Bedrucken von Karten mit sacklochförmiger Aussparung und Vorrichtung zur Ausführung des Verfahrens
DE4142409A1 (de) * 1991-12-20 1993-07-01 Gao Ges Automation Org Verfahren zum bedrucken von karten mit sacklochfoermiger aussparung und vorrichtung zur ausfuehrung des verfahrens
FR2695854B1 (fr) * 1992-09-22 1994-12-09 Leroux Ets Gilles Dispositif de fraisage de cavités dans des cartes en matière plastique et d'encartage de circuits intégrés dans lesdites cavités.
FR2702067B1 (fr) * 1993-02-23 1995-04-14 Schlumberger Ind Sa Procédé et dispositif de fabrication de cartes à mémoire.
CH688696A5 (fr) * 1993-03-17 1998-01-15 François Droz Procédé de fabrication d'une carte comprenant au moins un élément électronique.
AU684174B2 (en) * 1994-05-27 1997-12-04 Assa Abloy Ab Method for fabricating an electronic module and electronic module obtained thereby
US5837992A (en) * 1994-07-15 1998-11-17 Shinko Nameplate Co., Ltd. Memory card and its manufacturing method
DE4431605C2 (de) * 1994-09-05 1998-06-04 Siemens Ag Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten
FR2727542B1 (fr) * 1994-11-25 1997-01-03 Droz Francois Carte incorporant au moins un element electronique
DE4443767A1 (de) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Elektronisches Modul und Datenträger mit elektrischem Modul
US5952713A (en) * 1994-12-27 1999-09-14 Takahira; Kenichi Non-contact type IC card
DE19502398A1 (de) * 1995-01-26 1996-08-01 Giesecke & Devrient Gmbh Verfahren zur Montage eines elektronischen Moduls in einem Kartenkörper
EP0806019B1 (en) * 1995-01-27 1998-11-25 Interprint Formularios Ltda. Memory card and method of producing same
DE19601389A1 (de) * 1996-01-16 1997-07-24 Siemens Ag Chipkartenkörper
CA2262481A1 (fr) * 1996-08-05 1998-02-12 Vincent Permingeat Perfectionnement a un procede de realisation de cartes a memoire et cartes ainsi obtenues
DE19701165C1 (de) 1997-01-15 1998-04-09 Siemens Ag Chipkartenmodul
US5955021A (en) * 1997-05-19 1999-09-21 Cardxx, Llc Method of making smart cards
KR100255108B1 (en) * 1997-06-18 2000-05-01 Samsung Electronics Co Ltd Chip card
DE19749243C1 (de) 1997-11-07 1998-11-19 Richard Herbst Verfahren und Vorrichtung zum Herstellen von Verbundkörpern aus einer Kunststoffmasse
FR2774198B1 (fr) * 1998-01-27 2001-08-31 Solaic Sa Procede de fixation d'un module electronique dans une cavite d'un corps d'objet portable, notamment corps de carte, par ultrasons
DE19816066A1 (de) * 1998-04-09 1999-10-14 Philips Patentverwaltung Folie als Träger von integrierten Schaltungen
FR2803434A1 (fr) * 1999-12-30 2001-07-06 Schlumberger Systems & Service Procede de protection d'un circuit integre dispose dans une cavite d'un corps de carte et outil correspondant
DE10006515C5 (de) * 2000-02-15 2004-09-16 Datacard Corp., Minnetonka Verfahren zum Einbau von Chips in Kartenkörper
FR2805067B1 (fr) 2000-02-15 2003-09-12 Bourgogne Grasset Jeton a puce electronique et procedes de fabrication d'un tel jeton
JP4516179B2 (ja) * 2000-05-22 2010-08-04 大日本印刷株式会社 接触・非接触共用ｉｃカードの製造方法及び製造装置
US6857552B2 (en) * 2003-04-17 2005-02-22 Intercard Limited Method and apparatus for making smart card solder contacts
US20090091424A1 (en) * 2007-10-05 2009-04-09 Manfred Rietzler Transponder inlay for a personal document and method of manufacturing same
ITRM20090236A1 (it) * 2009-05-12 2010-11-13 Gep S P A Sistema di collocazione stabile del modulo del chip di silicio nella cava generata sull inlay tramite deposito di materiale collante sintetico
FR2968432B1 (fr) 2010-12-06 2012-12-28 Oberthur Technologies Procédé d'encartage d'un module dans une carte a microcircuit
CN109564634B (zh) 2016-07-27 2026-04-14 安全创造有限责任公司 用于交易卡的经包覆模制的电子部件及其制造方法
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
NZ762589A (en) 2017-09-07 2022-05-27 Composecure Llc Transaction card with embedded electronic components and process for manufacture
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
KR102931665B1 (ko) 2017-10-18 2026-02-26 컴포시큐어 엘.엘.씨. 윈도우 또는 윈도우 패턴 및 선택적인 백라이팅을 갖는 금속, 세라믹, 또는 세라믹 코팅된 트랜잭션 카드
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4216577A (en) * 1975-12-31 1980-08-12 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
DE3153769C2 (de) * 1981-04-14 1995-10-26 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
US4483067A (en) * 1981-09-11 1984-11-20 U.S. Philips Corporation Method of manufacturing an identification card and an identification manufactured, for example, by this method
FR2538930B1 (fr) * 1983-01-05 1989-05-19 Seiichiro Aigo Carte d'information
DE3466108D1 (en) * 1983-06-09 1987-10-15 Flonic Sa Method of producing memory cards, and cards obtained thereby

Also Published As

Publication number Publication date
ES8706990A1 (es) 1987-06-16
FR2579799A1 (fr) 1986-10-03
JPS61227094A (ja) 1986-10-09
DE3667345D1 (de) 1990-01-11
EP0197847A1 (fr) 1986-10-15
US4737620A (en) 1988-04-12
ES553359A0 (es) 1987-06-16
FR2579799B1 (fr) 1990-06-22
ATE48484T1 (de) 1989-12-15
CA1255388A (en) 1989-06-06
EP0197847B1 (fr) 1989-12-06
ES297137Y (es) 1989-10-16

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Legal Events

Date Code Title Description
FD1K Utility model lapsed

Effective date: 20080714