ES320212A1 - Método para unir un elemento transistor de tipo plano a un circuito impreso - Google Patents

Método para unir un elemento transistor de tipo plano a un circuito impreso

Info

Publication number
ES320212A1
ES320212A1 ES0320212A ES320212A ES320212A1 ES 320212 A1 ES320212 A1 ES 320212A1 ES 0320212 A ES0320212 A ES 0320212A ES 320212 A ES320212 A ES 320212A ES 320212 A1 ES320212 A1 ES 320212A1
Authority
ES
Spain
Prior art keywords
contact areas
printed circuit
type transistor
pillars
join
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0320212A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Glass Works
Original Assignee
Corning Glass Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Glass Works filed Critical Corning Glass Works
Publication of ES320212A1 publication Critical patent/ES320212A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
    • H10W72/07233—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
ES0320212A 1964-12-02 1965-11-30 Método para unir un elemento transistor de tipo plano a un circuito impreso Expired ES320212A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US415314A US3403438A (en) 1964-12-02 1964-12-02 Process for joining transistor chip to printed circuit

Publications (1)

Publication Number Publication Date
ES320212A1 true ES320212A1 (es) 1966-09-01

Family

ID=23645203

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0320212A Expired ES320212A1 (es) 1964-12-02 1965-11-30 Método para unir un elemento transistor de tipo plano a un circuito impreso

Country Status (8)

Country Link
US (2) US3403438A (es)
CH (1) CH440406A (es)
DE (2) DE1238975B (es)
ES (1) ES320212A1 (es)
FR (1) FR1456295A (es)
GB (1) GB1110535A (es)
NL (1) NL6515692A (es)
SE (1) SE314122B (es)

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US3765590A (en) * 1972-05-08 1973-10-16 Fairchild Camera Instr Co Structure for simultaneously attaching a plurality of semiconductor dice to their respective package leads
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US4004726A (en) * 1974-12-23 1977-01-25 Western Electric Company, Inc. Bonding of leads
DE2627178C2 (de) * 1976-06-15 1978-06-22 Zschimmer, Gero, 8000 Muenchen Verfahren zum Aufkleben von Bauteilen auf eine Unterlage mittels thixotropen Materials
JPS53149763A (en) * 1977-06-01 1978-12-27 Citizen Watch Co Ltd Mounting method of semiconductor integrate circuit
US4179802A (en) * 1978-03-27 1979-12-25 International Business Machines Corporation Studded chip attachment process
US4332341A (en) * 1979-12-26 1982-06-01 Bell Telephone Laboratories, Incorporated Fabrication of circuit packages using solid phase solder bonding
EP0102728B1 (en) * 1982-07-27 1986-10-01 Luc Technologies Limited Bonding and bonded products
JPS59151443A (ja) * 1983-02-17 1984-08-29 Fujitsu Ltd 半導体装置
US4924353A (en) * 1985-12-20 1990-05-08 Hughes Aircraft Company Connector system for coupling to an integrated circuit chip
US5184400A (en) * 1987-05-21 1993-02-09 Cray Computer Corporation Method for manufacturing a twisted wire jumper electrical interconnector
US5045975A (en) * 1987-05-21 1991-09-03 Cray Computer Corporation Three dimensionally interconnected module assembly
US5054192A (en) * 1987-05-21 1991-10-08 Cray Computer Corporation Lead bonding of chips to circuit boards and circuit boards to circuit boards
US5014419A (en) * 1987-05-21 1991-05-14 Cray Computer Corporation Twisted wire jumper electrical interconnector and method of making
US5112232A (en) * 1987-05-21 1992-05-12 Cray Computer Corporation Twisted wire jumper electrical interconnector
US5195237A (en) * 1987-05-21 1993-03-23 Cray Computer Corporation Flying leads for integrated circuits
US4831724A (en) * 1987-08-04 1989-05-23 Western Digital Corporation Apparatus and method for aligning surface mountable electronic components on printed circuit board pads
US5798780A (en) * 1988-07-03 1998-08-25 Canon Kabushiki Kaisha Recording element driving unit having extra driving element to facilitate assembly and apparatus using same
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US4885841A (en) * 1989-02-21 1989-12-12 Micron Technology, Inc. Vibrational method of aligning the leads of surface-mount electronic components with the mounting pads of printed circuit boards during the molten solder mounting process
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JPH0770806B2 (ja) * 1990-08-22 1995-07-31 株式会社エーユーイー研究所 超音波溶着による電子回路およびその製造方法
US20050062492A1 (en) * 2001-08-03 2005-03-24 Beaman Brian Samuel High density integrated circuit apparatus, test probe and methods of use thereof
US5371654A (en) * 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US5471090A (en) * 1993-03-08 1995-11-28 International Business Machines Corporation Electronic structures having a joining geometry providing reduced capacitive loading
US5375035A (en) * 1993-03-22 1994-12-20 Compaq Computer Corporation Capacitor mounting structure for printed circuit boards
US5591941A (en) * 1993-10-28 1997-01-07 International Business Machines Corporation Solder ball interconnected assembly
US5427301A (en) * 1994-05-06 1995-06-27 Ford Motor Company Ultrasonic flip chip process and apparatus
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US5683788A (en) * 1996-01-29 1997-11-04 Dell Usa, L.P. Apparatus for multi-component PCB mounting
US5667132A (en) * 1996-04-19 1997-09-16 Lucent Technologies Inc. Method for solder-bonding contact pad arrays
JPH1032221A (ja) * 1996-07-12 1998-02-03 Nec Corp プリント配線基板
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US6133634A (en) 1998-08-05 2000-10-17 Fairchild Semiconductor Corporation High performance flip chip package
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US7119447B2 (en) 2001-03-28 2006-10-10 International Rectifier Corporation Direct fet device for high frequency application
US7476964B2 (en) * 2001-06-18 2009-01-13 International Rectifier Corporation High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing
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US3330026A (en) * 1964-12-02 1967-07-11 Corning Glass Works Semiconductor terminals and method

Also Published As

Publication number Publication date
DE1964254U (de) 1967-07-20
GB1110535A (en) 1968-04-18
SE314122B (es) 1969-09-01
NL6515692A (es) 1966-06-03
US3403438A (en) 1968-10-01
US3561107A (en) 1971-02-09
CH440406A (de) 1967-07-31
FR1456295A (fr) 1966-10-21
DE1238975B (de) 1967-04-20

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