ES324355A1 - PLATE DEVICE WITH INTEGRATED CIRCUIT AND METHOD FOR THE MANUFACTURE OF THE SAME. - Google Patents

PLATE DEVICE WITH INTEGRATED CIRCUIT AND METHOD FOR THE MANUFACTURE OF THE SAME.

Info

Publication number
ES324355A1
ES324355A1 ES0324355A ES324355A ES324355A1 ES 324355 A1 ES324355 A1 ES 324355A1 ES 0324355 A ES0324355 A ES 0324355A ES 324355 A ES324355 A ES 324355A ES 324355 A1 ES324355 A1 ES 324355A1
Authority
ES
Spain
Prior art keywords
integrated circuit
members
plate device
manufacture
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0324355A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Spain SA
Original Assignee
Alcatel Espana SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Espana SA filed Critical Alcatel Espana SA
Publication of ES324355A1 publication Critical patent/ES324355A1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

A plate device with integrated circuit comprising the integrated circuit, connection terminals extending from connection points in said integrated circuit, first and second members, means placing said integrated circuit between said first and second members extending said connection terminals out from between said first and second members and insulating material disposed between said first and second members that completely impregnate said integrated circuit. (Machine-translation by Google Translate, not legally binding)
ES0324355A 1965-03-17 1966-03-17 PLATE DEVICE WITH INTEGRATED CIRCUIT AND METHOD FOR THE MANUFACTURE OF THE SAME. Expired ES324355A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US44052565A 1965-03-17 1965-03-17

Publications (1)

Publication Number Publication Date
ES324355A1 true ES324355A1 (en) 1967-02-01

Family

ID=23749099

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0324355A Expired ES324355A1 (en) 1965-03-17 1966-03-17 PLATE DEVICE WITH INTEGRATED CIRCUIT AND METHOD FOR THE MANUFACTURE OF THE SAME.

Country Status (5)

Country Link
BE (1) BE677962A (en)
DE (1) DE1279798B (en)
ES (1) ES324355A1 (en)
GB (1) GB1117675A (en)
NL (1) NL6603525A (en)

Also Published As

Publication number Publication date
NL6603525A (en) 1966-09-19
BE677962A (en) 1966-09-19
DE1279798B (en) 1968-10-10
GB1117675A (en) 1968-06-19

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