ES336273A1 - Procedimiento para la deposicion sin corriente de capas metalicas. - Google Patents

Procedimiento para la deposicion sin corriente de capas metalicas.

Info

Publication number: ES336273A1
Authority: ES; Spain
Prior art keywords: translation; deposition; ions; machine; current
Prior art date: 1966-02-01
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

ES0336273A

Other languages

English (en)

Spanish (es)

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Kollmorgen Corp

Original Assignee

Photocircuits Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1966-02-01

Filing date

1967-01-31

Publication date

1967-12-16

1967-01-31 Application filed by Photocircuits Corp filed Critical Photocircuits Corp

1967-12-16 Publication of ES336273A1 publication Critical patent/ES336273A1/es

Status Expired legal-status Critical Current

Links

239000002184 metal Substances 0.000 title abstract 3
229910052751 metal Inorganic materials 0.000 title abstract 3
230000008021 deposition Effects 0.000 title abstract 2
238000000034 method Methods 0.000 title abstract 2
150000002500 ions Chemical class 0.000 abstract 3
239000003638 chemical reducing agent Substances 0.000 abstract 1
239000000470 constituent Substances 0.000 abstract 1
XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 1
229910052742 iron Inorganic materials 0.000 abstract 1
-1 iron ions Chemical class 0.000 abstract 1
229910021645 metal ion Inorganic materials 0.000 abstract 1
230000003647 oxidation Effects 0.000 abstract 1
238000007254 oxidation reaction Methods 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Electroplating And Plating Baths Therefor (AREA)

ES0336273A 1966-02-01 1967-01-31 Procedimiento para la deposicion sin corriente de capas metalicas. Expired ES336273A1 (es)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US52389766A	1966-02-01	1966-02-01

Publications (1)

Publication Number	Publication Date
ES336273A1 true ES336273A1 (es)	1967-12-16

Family

ID=24086884

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
ES0336273A Expired ES336273A1 (es)	1966-02-01	1967-01-31	Procedimiento para la deposicion sin corriente de capas metalicas.

Country Status (8)

Country	Link
CH (1)	CH491206A (de)
DE (1)	DE1621307B2 (de)
DK (1)	DK129661B (de)
ES (1)	ES336273A1 (de)
FR (1)	FR1509788A (de)
GB (1)	GB1176051A (de)
NL (1)	NL153604C (de)
SE (1)	SE332327B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CA1135903A (en) *	1978-09-13	1982-11-23	John F. Mccormack	Electroless copper deposition process having faster plating rates
DE102010012204B4 (de) *	2010-03-19	2019-01-24	MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware)	Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten

1967
- 1967-01-25 CH CH108467A patent/CH491206A/de not_active IP Right Cessation
- 1967-01-25 DE DE19671621307 patent/DE1621307B2/de active Pending
- 1967-01-30 GB GB437867A patent/GB1176051A/en not_active Expired
- 1967-01-30 SE SE132567A patent/SE332327B/xx unknown
- 1967-01-31 DK DK53867A patent/DK129661B/da unknown
- 1967-01-31 ES ES0336273A patent/ES336273A1/es not_active Expired
- 1967-02-01 FR FR93312A patent/FR1509788A/fr not_active Expired
- 1967-02-01 NL NL6701525A patent/NL153604C/xx not_active IP Right Cessation

Also Published As

Publication number	Publication date
DK129661B (da)	1974-11-04
DE1621307A1 (de)	1971-06-03
NL6701525A (de)	1967-08-02
DE1621307B2 (de)	1972-01-05
NL153604B (nl)	1977-06-15
NL153604C (nl)	1980-05-16
FR1509788A (fr)	1968-01-12
SE332327B (de)	1971-02-01
CH491206A (de)	1970-05-31
GB1176051A (en)	1970-01-01
DK129661C (de)	1975-04-01

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