ES342451A1 - Perfeccionamientos en la metalizacion de sustratos aislan- tes. - Google Patents

Perfeccionamientos en la metalizacion de sustratos aislan- tes.

Info

Publication number: ES342451A1
Authority: ES; Spain
Prior art keywords: subtrates; metallization; insulating; cupric; pyrrolidone
Prior art date: 1966-06-28
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

ES342451A

Other languages

English (en)

Spanish (es)

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Kollmorgen Corp

Original Assignee

Photocircuits Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1966-06-28

Filing date

1967-06-28

Publication date

1968-07-16

1967-06-28 Application filed by Photocircuits Corp filed Critical Photocircuits Corp

1968-07-16 Publication of ES342451A1 publication Critical patent/ES342451A1/es

Status Expired legal-status Critical Current

Links

238000001465 metallisation Methods 0.000 title 1
SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 abstract 2
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract 2
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 abstract 2
SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 abstract 1
KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
229910003803 Gold(III) chloride Inorganic materials 0.000 abstract 1
239000000853 adhesive Substances 0.000 abstract 1
230000001070 adhesive effect Effects 0.000 abstract 1
230000003197 catalytic effect Effects 0.000 abstract 1
229920001577 copolymer Polymers 0.000 abstract 1
ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 abstract 1
230000008021 deposition Effects 0.000 abstract 1
229920001971 elastomer Polymers 0.000 abstract 1
239000003822 epoxy resin Substances 0.000 abstract 1
RJHLTVSLYWWTEF-UHFFFAOYSA-K gold trichloride Chemical compound Cl[Au](Cl)Cl RJHLTVSLYWWTEF-UHFFFAOYSA-K 0.000 abstract 1
229910052763 palladium Inorganic materials 0.000 abstract 1
229920001568 phenolic resin Polymers 0.000 abstract 1
239000005011 phenolic resin Substances 0.000 abstract 1
229920000647 polyepoxide Polymers 0.000 abstract 1
235000012239 silicon dioxide Nutrition 0.000 abstract 1
239000000377 silicon dioxide Substances 0.000 abstract 1
229910001961 silver nitrate Inorganic materials 0.000 abstract 1
239000000080 wetting agent Substances 0.000 abstract 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0236—Plating catalyst as filler in insulating material
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemical Kinetics & Catalysis (AREA)
General Chemical & Material Sciences (AREA)
Manufacturing Of Printed Wiring (AREA)
Adhesives Or Adhesive Processes (AREA)
Chemically Coating (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Laminated Bodies (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)

ES342451A 1966-06-28 1967-06-28 Perfeccionamientos en la metalizacion de sustratos aislan- tes. Expired ES342451A1 (es)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US56112366A	1966-06-28	1966-06-28

Publications (1)

Publication Number	Publication Date
ES342451A1 true ES342451A1 (es)	1968-07-16

Family

ID=24240722

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
ES342451A Expired ES342451A1 (es)	1966-06-28	1967-06-28	Perfeccionamientos en la metalizacion de sustratos aislan- tes.

Country Status (8)

Country	Link
JP (3)	JPS5031940B1 (de)
AT (2)	AT310843B (de)
CH (1)	CH504830A (de)
DE (1)	DE1665374B1 (de)
ES (1)	ES342451A1 (de)
FR (1)	FR1605382A (de)
GB (1)	GB1186558A (de)
NL (1)	NL162816C (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
AT318048B (de) *	1968-02-09	1974-09-25	Photocircuits Corp	Verfahren zur Herstellung von elektrischen Leiterplatten
JPS5026022B1 (de) *	1970-11-16	1975-08-28
JPS5914882U (ja) *	1982-07-19	1984-01-28	川上　規久雄	排水装置
JPS60190403U (ja) *	1984-05-30	1985-12-17	川崎製鉄株式会社	圧延ロ−ルの冷却装置
US4767665A (en) *	1985-09-16	1988-08-30	Seeger Richard E	Article formed by electroless plating
GB2188194A (en) *	1986-03-21	1987-09-23	Plessey Co Plc	Carrier for high frequency integrated circuits
CA1318416C (en) *	1987-01-14	1993-05-25	Kollmorgen Corporation	Bonding compositions for the manufacture of additive printed wiring boards and articles made with the bonding composition
JPH0748583B2 (ja) *	1989-04-03	1995-05-24	喜平大津	高密度プリント配線板の電気検査治具板の製造方法
KR20070086863A (ko)	1998-09-03	2007-08-27	이비덴 가부시키가이샤	다층프린트배선판 및 그 제조방법
US10765012B2 (en) *	2017-07-10	2020-09-01	Catlam, Llc	Process for printed circuit boards using backing foil
JP2025056521A (ja) *	2023-09-27	2025-04-08	東洋アルミニウム株式会社	プリント配線基板用材料及びプリント配線基板の製造方法
JP2025056512A (ja) *	2023-09-27	2025-04-08	東洋アルミニウム株式会社	プリント配線基板用材料及びプリント配線基板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB938365A (en) *	1959-01-08	1963-10-02	Photocircuits Corp	Method of making printed circuits
US3143484A (en) *	1959-12-29	1964-08-04	Gen Electric	Method of making plated circuit boards
US3171756A (en) *	1961-05-04	1965-03-02	Ibm	Method of making a printed circuit and base therefor

1967
- 1967-06-27 DE DE19671665374 patent/DE1665374B1/de active Pending
- 1967-06-27 AT AT629371A patent/AT310843B/de not_active IP Right Cessation
- 1967-06-27 AT AT598867A patent/AT314010B/de not_active IP Right Cessation
- 1967-06-27 CH CH908067A patent/CH504830A/de not_active IP Right Cessation
- 1967-06-28 ES ES342451A patent/ES342451A1/es not_active Expired
- 1967-06-28 NL NL6709035A patent/NL162816C/xx not_active IP Right Cessation
- 1967-06-28 FR FR112285A patent/FR1605382A/fr not_active Expired
- 1967-06-28 GB GB2982467A patent/GB1186558A/en not_active Expired
1970
- 1970-09-16 JP JP8117570A patent/JPS5031940B1/ja active Pending
- 1970-09-16 JP JP8117470A patent/JPS5110329B1/ja active Pending
1979
- 1979-08-17 JP JP10545779A patent/JPS5746679B1/ja active Pending

Also Published As

Publication number	Publication date
AT310843B (de)	1973-10-25
FR1605382A (en)	1975-02-28
DE1665374B1 (de)	1971-09-09
JPS5746679B1 (de)	1982-10-05
NL6709035A (de)	1967-12-29
GB1186558A (en)	1970-04-02
NL162816B (nl)	1980-01-15
JPS5110329B1 (de)	1976-04-03
AT314010B (de)	1974-03-11
NL162816C (nl)	1980-06-16
CH504830A (de)	1971-03-15
JPS5031940B1 (de)	1975-10-16

Publication	Publication Date	Title
ES342451A1 (es)	1968-07-16	Perfeccionamientos en la metalizacion de sustratos aislan- tes.
CA674883A (en)	1963-11-26	Electroless copper plating
GOEPFERT et al.	1963	Description of the properties of the main types of copper clad laminates as they pertain to printed circuits
ES394126A1 (es)	1974-10-01	Perfeccionamientos introducidos en un procedimiento para lareconstitucion de banos para el cobreado sin corriente elec-trica.
JPS5290240A (en)	1977-07-29	Mounting of logic circuit
CH401168A (de)	1965-10-31	Empfangseinrichtung für tonfrequente Tastwahl-Codezeichen in Fernmelde-, insbesondere Fernsprechanlagen
JPS5229147A (en)	1977-03-04	Semiconductor directoscillator
JPS5236406A (en)	1977-03-19	Inter-selective call receiver
JPS5382105A (en)	1978-07-20	System for numbering guide and dial service attendant board
ORANGE	1963	Feasibility of air-ground-air teletype communications circuit for vhf ionospheric scatter propagation
GB1087302A (en)	1967-10-18	Improvements in or relating to layer rheostats for printed circuits
EKISS et al.	1964	Application of silicon integrated circuit technology to low power digital circuits(Silicon integrated circuit technology applied to low power digital circuits)
CA647036A (en)	1962-08-21	Printed circuit component mounting
FR1248954A (fr)	1960-12-23	Plaque support d'un câblage imprimé pour appareils électroniques, notamment pour radio récepteurs
ES358436A3 (es)	1970-04-16	Perfeccionamientos en la construccion de elementos de ma- niobra electrica.
HEWITT	1962	Telecommunications research- radio propagation, ionospheric absorption, weather radar, lf radio noise, and space tracking- south africa
CRUZ	1966	Annual Allerton Conference on Circuit and System Theory, 4 th, University of Illinois, Monticello, Ill., October 5-7, 1966, Proceedings(Circuit and system theory- Allerton Conference, University of Illinois, October 1966)
AYLING et al.	1965	The manufacture of thin film circuits for use in airborne equipment(Feasibility of guard channel receiver, transmitter and marker receiver system by thin film circuit techniques, noting reliability with minimum servicing)
AU266756B2 (en)	1965-02-18	Mounting arrangements for printed circuit boards
DK101305C (da)	1965-03-22	Elektronisk oscillatorkreds til anvendelse i forbindelse med telefonapparater.
CA685838A (en)	1964-05-05	Plated circuit board
CA649648A (en)	1962-10-02	Printed circuit armature
AU252996B2 (en)	1963-01-31	Improved circuit arrangement for providing a. g. c. in receivers for radio communications
GB1076008A (en)	1967-07-19	Printed circuit component mounting technique
JPS5292402A (en)	1977-08-03	Power supply application muting circuit