ES352861A1 - Un dispositivo semiconductor encapsulado. - Google Patents
Un dispositivo semiconductor encapsulado.Info
- Publication number
- ES352861A1 ES352861A1 ES352861A ES352861A ES352861A1 ES 352861 A1 ES352861 A1 ES 352861A1 ES 352861 A ES352861 A ES 352861A ES 352861 A ES352861 A ES 352861A ES 352861 A1 ES352861 A1 ES 352861A1
- Authority
- ES
- Spain
- Prior art keywords
- translation
- machine
- legally binding
- google translate
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/611—Bolts or screws
- H10W40/613—Bolts or screws for stacked arrangements of a plurality of semiconductor devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Die Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US63353267A | 1967-04-25 | 1967-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES352861A1 true ES352861A1 (es) | 1969-09-01 |
Family
ID=24540007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES352861A Expired ES352861A1 (es) | 1967-04-25 | 1968-04-18 | Un dispositivo semiconductor encapsulado. |
Country Status (3)
| Country | Link |
|---|---|
| BR (1) | BR6898366D0 (es) |
| ES (1) | ES352861A1 (es) |
| FR (1) | FR1570698A (es) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE212019000499U1 (de) * | 2019-05-08 | 2022-01-12 | Siemens Energy Global GmbH & Co. KG | Kühlkörper |
-
1968
- 1968-04-16 BR BR198366/68A patent/BR6898366D0/pt unknown
- 1968-04-18 ES ES352861A patent/ES352861A1/es not_active Expired
- 1968-04-24 FR FR1570698D patent/FR1570698A/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR1570698A (es) | 1969-06-13 |
| BR6898366D0 (pt) | 1973-02-27 |
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