ES363391A1 - IMPROVEMENTS IN ELECTRICAL CIRCUIT SETS BOARDS. - Google Patents

IMPROVEMENTS IN ELECTRICAL CIRCUIT SETS BOARDS.

Info

Publication number
ES363391A1
ES363391A1 ES363391A ES363391A ES363391A1 ES 363391 A1 ES363391 A1 ES 363391A1 ES 363391 A ES363391 A ES 363391A ES 363391 A ES363391 A ES 363391A ES 363391 A1 ES363391 A1 ES 363391A1
Authority
ES
Spain
Prior art keywords
hole
conductor
metal
electrical circuit
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES363391A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of ES363391A1 publication Critical patent/ES363391A1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66D—CAPSTANS; WINCHES; TACKLES, e.g. PULLEY BLOCKS; HOISTS
    • B66D1/00—Rope, cable, or chain winding mechanisms; Capstans
    • B66D1/02—Driving gear
    • B66D1/08—Driving gear incorporating fluid motors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
    • F16H61/38—Control of exclusively fluid gearing
    • F16H61/40—Control of exclusively fluid gearing hydrostatic
    • F16H61/46—Automatic regulation in accordance with output requirements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66D—CAPSTANS; WINCHES; TACKLES, e.g. PULLEY BLOCKS; HOISTS
    • B66D2700/00—Capstans, winches or hoists
    • B66D2700/01—Winches, capstans or pivots
    • B66D2700/0125—Motor operated winches
    • B66D2700/0133—Fluid actuated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Perfections in electrical circuit assembly boards, characterized in that a preformed metal conductor arranged in the form of a circuit pattern is arranged on an insulating base, cutting at least one hole in said base to at least one conductor, in such a way that less one end of a conductor is exposed to the wall surrounding the hole, and a metal terminal in the hole in electrical contact with the end of the wire, said terminal being constituted by a metal deposit formed on the walls surrounding said hole and forming an integral unión with the end of the conductor, alternatively, the metallic deposit being a non-electrolytically deposited metal. (Machine-translation by Google Translate, not legally binding)
ES363391A 1968-02-09 1969-02-07 IMPROVEMENTS IN ELECTRICAL CIRCUIT SETS BOARDS. Expired ES363391A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70438368A 1968-02-09 1968-02-09

Publications (1)

Publication Number Publication Date
ES363391A1 true ES363391A1 (en) 1970-12-16

Family

ID=24829249

Family Applications (1)

Application Number Title Priority Date Filing Date
ES363391A Expired ES363391A1 (en) 1968-02-09 1969-02-07 IMPROVEMENTS IN ELECTRICAL CIRCUIT SETS BOARDS.

Country Status (6)

Country Link
AT (3) AT301665B (en)
CH (1) CH495683A (en)
DK (1) DK128260B (en)
ES (1) ES363391A1 (en)
FR (1) FR2001647A1 (en)
NL (1) NL162537C (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5550399B1 (en) * 1970-03-05 1980-12-17
US6104802A (en) 1997-02-10 2000-08-15 Genesys Telecommunications Laboratories, Inc. In-band signaling for routing
US6985943B2 (en) 1998-09-11 2006-01-10 Genesys Telecommunications Laboratories, Inc. Method and apparatus for extended management of state and interaction of a remote knowledge worker from a contact center
US6332154B2 (en) 1998-09-11 2001-12-18 Genesys Telecommunications Laboratories, Inc. Method and apparatus for providing media-independent self-help modules within a multimedia communication-center customer interface

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3133773A (en) * 1955-10-12 1964-05-19 Minnesota Mining & Mfg Electric circuit panelboard
DE1135975B (en) * 1961-06-28 1962-09-06 Siemens Ag Method and device for the wiring of circuit boards to be produced by machine for telecommunication systems, in particular telephone systems, and the clamping element used for this purpose
NL291598A (en) * 1962-04-18
FR1353862A (en) * 1962-05-11 1964-02-28 Electrical circuit panel and method and apparatus for manufacturing it
US3435858A (en) * 1965-08-03 1969-04-01 Int Standard Electric Corp Wire wrapping machine
DE1665374B1 (en) * 1966-06-28 1971-09-09 Photocircuits Corp BASE MATERIAL MADE OF INSULATING MATERIAL FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS

Also Published As

Publication number Publication date
DK128260B (en) 1974-03-25
DE1906967B2 (en) 1971-05-19
FR2001647A1 (en) 1969-09-26
ATA703471A (en) 1975-02-15
NL162537B (en) 1979-12-17
AT301665B (en) 1972-09-11
CH495683A (en) 1970-08-31
NL6902088A (en) 1969-08-12
DE1906967A1 (en) 1970-08-20
AT326204B (en) 1975-11-25
NL162537C (en) 1980-05-16
AT318048B (en) 1974-09-25

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