ES401687A1 - A SEMICONDUCTOR DEVICE. - Google Patents
A SEMICONDUCTOR DEVICE.Info
- Publication number
- ES401687A1 ES401687A1 ES401687A ES401687A ES401687A1 ES 401687 A1 ES401687 A1 ES 401687A1 ES 401687 A ES401687 A ES 401687A ES 401687 A ES401687 A ES 401687A ES 401687 A1 ES401687 A1 ES 401687A1
- Authority
- ES
- Spain
- Prior art keywords
- region
- layer
- semiconductor
- conductivity
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W15/00—Highly-doped buried regions of integrated devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
- H10D84/67—Complementary BJTs
- H10D84/673—Vertical complementary BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/87—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of PN-junction gate FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
- H10W10/012—Manufacture or treatment of isolation regions comprising dielectric materials using local oxidation of silicon [LOCOS]
- H10W10/0121—Manufacture or treatment of isolation regions comprising dielectric materials using local oxidation of silicon [LOCOS] in regions recessed from the surface, e.g. in trenches or grooves
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
- H10W10/012—Manufacture or treatment of isolation regions comprising dielectric materials using local oxidation of silicon [LOCOS]
- H10W10/0125—Manufacture or treatment of isolation regions comprising dielectric materials using local oxidation of silicon [LOCOS] comprising introducing electrical impurities in local oxidation regions, e.g. to alter LOCOS oxide growth characteristics
- H10W10/0126—Manufacture or treatment of isolation regions comprising dielectric materials using local oxidation of silicon [LOCOS] comprising introducing electrical impurities in local oxidation regions, e.g. to alter LOCOS oxide growth characteristics introducing electrical active impurities in local oxidation regions to create channel stoppers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/10—Isolation regions comprising dielectric materials
- H10W10/13—Isolation regions comprising dielectric materials formed using local oxidation of silicon [LOCOS], e.g. sealed interface localised oxidation [SILO] or side-wall mask isolation [SWAMI]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W15/00—Highly-doped buried regions of integrated devices
- H10W15/01—Manufacture or treatment
Landscapes
- Element Separation (AREA)
- Bipolar Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
Abstract
A semiconductor device comprising a semiconductor body having a region of a first type of conductivity, a semiconductor layer present on said region and contiguous to the body surface, at least a first buried layer of the second type of conductivity present locally between said layer semiconductor and the region of the first type of conductivity, and a path of an insulating material embedded at least partially in the semiconductor layer, a region of the semiconductor layer being separated from the region of the first type of conductivity and the remaining part of the layer by the first buried layer and by a part of the layout contiguous to the first buried layer and which substantially surrounds said region, a semiconductor circuit element being arranged at least partially in said region of the semiconductor layer, characterized in that between the first buried layer and the semiconductor layer is a second a buried layer of the first type of conductivity and because the mentioned semiconductor layer region is divided, by a part of the embedded path of insulating material that is separated from the first buried layer by at least a part of the thickness of the second buried layer, at least in a first island-shaped region in which the semiconductor circuit element is arranged at least partially, and in a second island-shaped region of the first type of conductivity, the regions of which are both contiguous to the second buried layer . (Machine-translation by Google Translate, not legally binding)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7105000A NL7105000A (en) | 1971-04-14 | 1971-04-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES401687A1 true ES401687A1 (en) | 1975-03-16 |
Family
ID=19812915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES401687A Expired ES401687A1 (en) | 1971-04-14 | 1972-04-12 | A SEMICONDUCTOR DEVICE. |
Country Status (11)
| Country | Link |
|---|---|
| AU (1) | AU470407B2 (en) |
| BE (1) | BE782012A (en) |
| BR (1) | BR7202251D0 (en) |
| CH (1) | CH539952A (en) |
| DE (1) | DE2216642C3 (en) |
| ES (1) | ES401687A1 (en) |
| FR (1) | FR2133692B1 (en) |
| GB (1) | GB1387021A (en) |
| IT (1) | IT951314B (en) |
| NL (1) | NL7105000A (en) |
| SE (1) | SE383582B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL161301C (en) * | 1972-12-29 | 1980-01-15 | Philips Nv | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURE THEREOF. |
| JPS5534619U (en) * | 1978-08-25 | 1980-03-06 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE740938A (en) * | 1967-12-05 | 1970-04-01 |
-
1971
- 1971-04-14 NL NL7105000A patent/NL7105000A/xx not_active Application Discontinuation
-
1972
- 1972-04-07 DE DE2216642A patent/DE2216642C3/en not_active Expired
- 1972-04-10 AU AU40936/72A patent/AU470407B2/en not_active Expired
- 1972-04-11 SE SE7204673A patent/SE383582B/en unknown
- 1972-04-11 IT IT23017/72A patent/IT951314B/en active
- 1972-04-11 CH CH531272A patent/CH539952A/en not_active IP Right Cessation
- 1972-04-11 GB GB1660972A patent/GB1387021A/en not_active Expired
- 1972-04-12 BE BE782012A patent/BE782012A/en unknown
- 1972-04-12 ES ES401687A patent/ES401687A1/en not_active Expired
- 1972-04-13 FR FR7213006A patent/FR2133692B1/fr not_active Expired
- 1972-04-14 BR BR2251/72A patent/BR7202251D0/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| SE383582B (en) | 1976-03-15 |
| DE2216642B2 (en) | 1979-04-12 |
| DE2216642A1 (en) | 1972-10-19 |
| BR7202251D0 (en) | 1973-06-07 |
| DE2216642C3 (en) | 1979-12-13 |
| CH539952A (en) | 1973-07-31 |
| NL7105000A (en) | 1972-10-17 |
| FR2133692A1 (en) | 1972-12-01 |
| AU470407B2 (en) | 1973-10-18 |
| GB1387021A (en) | 1975-03-12 |
| BE782012A (en) | 1972-10-13 |
| IT951314B (en) | 1973-06-30 |
| FR2133692B1 (en) | 1977-08-19 |
| AU4093672A (en) | 1973-10-18 |
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