ES406779A1 - Elastomerically encapsulated semiconductor device - Google Patents

Elastomerically encapsulated semiconductor device

Info

Publication number
ES406779A1
ES406779A1 ES406779A ES406779A ES406779A1 ES 406779 A1 ES406779 A1 ES 406779A1 ES 406779 A ES406779 A ES 406779A ES 406779 A ES406779 A ES 406779A ES 406779 A1 ES406779 A1 ES 406779A1
Authority
ES
Spain
Prior art keywords
semiconductor device
encapsulated semiconductor
pair
elastomerically
tabs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES406779A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westinghouse Electric Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of ES406779A1 publication Critical patent/ES406779A1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Thyristors (AREA)
  • Die Bonding (AREA)
  • Gasket Seals (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

An encapsulated semiconductor device comprising a semiconductor wafer having an electrode attached to each side, and a pair of cylindrical contacts abutting an associated electrode and including outwardly extending circumferential tabs; characterized by an elastomeric encapsulating cylindrical member having a pair of inwardly extending circumferential flanges positioned to engage with the respectively associated flanges of the contact members, and an inwardly extending sealing member which is arranged to Compression fit between the tabs of the contact member to provide a watertight seal for the pad. (Machine-translation by Google Translate, not legally binding)
ES406779A 1971-10-26 1972-09-18 Elastomerically encapsulated semiconductor device Expired ES406779A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19246871A 1971-10-26 1971-10-26

Publications (1)

Publication Number Publication Date
ES406779A1 true ES406779A1 (en) 1975-10-01

Family

ID=22709794

Family Applications (1)

Application Number Title Priority Date Filing Date
ES406779A Expired ES406779A1 (en) 1971-10-26 1972-09-18 Elastomerically encapsulated semiconductor device

Country Status (9)

Country Link
JP (2) JPS4857581A (en)
AU (1) AU465197B2 (en)
BE (1) BE790502A (en)
CA (1) CA963586A (en)
DE (1) DE2250753A1 (en)
ES (1) ES406779A1 (en)
FR (1) FR2157923A1 (en)
GB (1) GB1358504A (en)
ZA (1) ZA725913B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2246423C3 (en) * 1972-09-21 1979-03-08 Siemens Ag, 1000 Berlin Und 8000 Muenchen Thyristor with a disc-shaped housing
DE2525390A1 (en) * 1975-06-06 1976-12-16 Siemens Ag CONTROLLED SEMICONDUCTOR COMPONENT
JPS5619406Y2 (en) * 1976-06-10 1981-05-08
DE2630320A1 (en) * 1976-07-06 1978-01-12 Licentia Gmbh DISC-SHAPED SEMICONDUCTOR CELL WITH A RING-SHAPED HOUSING
DE2636631A1 (en) * 1976-08-13 1978-02-16 Siemens Ag THYRISTOR
JPS5636134Y2 (en) * 1976-09-07 1981-08-25
DE2654532C3 (en) * 1976-12-02 1982-03-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Disc-shaped semiconductor cell
FR2440077A1 (en) * 1978-10-23 1980-05-23 Transformation En Cie Indle Semiconductor power module casing - with metal discs pressed against O=ring by insulating lipped clamp ring
DE3308720A1 (en) * 1983-03-11 1984-09-13 Siemens AG, 1000 Berlin und 8000 München SEMICONDUCTOR COMPONENT WITH DISC-SHAPED HOUSING
DE3316964A1 (en) * 1983-05-09 1984-11-15 Siemens AG, 1000 Berlin und 8000 München SEMICONDUCTOR COMPONENT WITH PUSHED MUG
JPH0744191B2 (en) * 1989-12-15 1995-05-15 三菱電機株式会社 Semiconductor device and electrode block therefor
EP2447988B1 (en) 2010-11-02 2015-05-06 GE Energy Power Conversion Technology Limited Power electronic device with edge passivation

Also Published As

Publication number Publication date
ZA725913B (en) 1973-05-30
AU465197B2 (en) 1975-09-18
GB1358504A (en) 1974-07-03
JPS5311966U (en) 1978-01-31
AU4624072A (en) 1974-03-07
BE790502A (en) 1973-04-25
CA963586A (en) 1975-02-25
FR2157923A1 (en) 1973-06-08
DE2250753A1 (en) 1973-05-03
JPS4857581A (en) 1973-08-13

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