ES422706A1 - Procedimiento para la fabricacion de una envuelta estanca ala humedad para componentes electricos. - Google Patents

Procedimiento para la fabricacion de una envuelta estanca ala humedad para componentes electricos.

Info

Publication number: ES422706A1
Authority: ES; Spain
Prior art keywords: components; combinations; electrical components; support frame; sheet
Prior art date: 1973-01-30
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

ES422706A

Other languages

English (en)

Spanish (es)

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Siemens AG

Siemens Corp

Original Assignee

Siemens AG

Siemens Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1973-01-30

Filing date

1974-01-29

Publication date

1976-04-16

1974-01-29 Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG

1976-04-16 Publication of ES422706A1 publication Critical patent/ES422706A1/es

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
- H10W74/144—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations comprising foils
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1311—Foil encapsulation, e.g. of mounted components
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Connector Housings Or Holding Contact Members (AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Cable Accessories (AREA)
Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Installation Of Indoor Wiring (AREA)
Lead Frames For Integrated Circuits (AREA)
Details Of Resistors (AREA)
Casings For Electric Apparatus (AREA)
Casting Or Compression Moulding Of Plastics Or The Like (AREA)

ES422706A 1973-01-30 1974-01-29 Procedimiento para la fabricacion de una envuelta estanca ala humedad para componentes electricos. Expired ES422706A1 (es)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE2304412A DE2304412A1 (de)	1973-01-30	1973-01-30	Feuchtedichte umhuellung fuer elektrische bauelemente oder bauelementekombinationen

Publications (1)

Publication Number	Publication Date
ES422706A1 true ES422706A1 (es)	1976-04-16

Family

ID=5870335

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
ES422706A Expired ES422706A1 (es)	1973-01-30	1974-01-29	Procedimiento para la fabricacion de una envuelta estanca ala humedad para componentes electricos.
ES422705A Expired ES422705A1 (es)	1973-01-30	1974-01-29	Perfeccionamientos en envueltas estancas a la humedad para componentes electricos.

Family Applications After (1)

Application Number	Title	Priority Date	Filing Date
ES422705A Expired ES422705A1 (es)	1973-01-30	1974-01-29	Perfeccionamientos en envueltas estancas a la humedad para componentes electricos.

Country Status (18)

Country	Link
JP (1)	JPS49105161A (de)
AT (1)	AT327345B (de)
AU (1)	AU6352073A (de)
BE (1)	BE810374A (de)
BR (1)	BR7309911D0 (de)
CH (1)	CH562512A5 (de)
CS (1)	CS170484B2 (de)
DD (1)	DD109475A5 (de)
DE (1)	DE2304412A1 (de)
ES (2)	ES422706A1 (de)
FR (1)	FR2215780B1 (de)
GB (1)	GB1418949A (de)
IT (1)	IT1006156B (de)
LU (1)	LU68391A1 (de)
NL (1)	NL7317195A (de)
SE (1)	SE385757B (de)
SU (1)	SU528892A3 (de)
ZA (1)	ZA74310B (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4154344A (en) *	1976-11-09	1979-05-15	Minnesota Mining And Manufacturing Company	Material for forming envelopes used to protect electronic components
DE2830472C3 (de) *	1978-07-11	1981-07-16	Siemens AG, 1000 Berlin und 8000 München	Verfahren zum serienmäßigen Umhüllen elektrischer Bauelemente, insbesondere Kondensatoren
DE3216192A1 (de) *	1982-04-30	1983-11-03	Siemens AG, 1000 Berlin und 8000 München	Elektrisches bauelement, das zentriert und justiert in einem gehaeuse untergebracht ist
DE3346896C2 (de) *	1983-12-23	1995-05-11	Siemens Ag	Vorrichtung zum Schutz von Anzeigeelementen und mit diesen verbundenen Schaltungen vor Störungen durch elektrostatische Ladungen
DE3624852A1 (de) *	1986-01-10	1987-07-16	Orga Druck Gmbh	Elektronische daten- und/oder programmtraeger und verfahren zu seiner herstellung
DE20011590U1 (de) *	2000-07-03	2000-09-07	Infineon Technologies AG, 81541 München	Halbleiterchip-Modul mit Schutzfolie
EP2293657A1 (de) *	2009-08-24	2011-03-09	Schreiner Group GmbH & Co. KG	Elektronisches Bauteil und Verfahren zum Herstellen eines elektronischen Bauteils
US10834827B2 (en)	2017-09-14	2020-11-10	HELLA GmbH & Co. KGaA	System for potting components using a cap

1973
- 1973-01-30 DE DE2304412A patent/DE2304412A1/de active Pending
- 1973-09-10 LU LU68391A patent/LU68391A1/xx unknown
- 1973-10-11 AT AT869073A patent/AT327345B/de not_active IP Right Cessation
- 1973-11-30 GB GB5554773A patent/GB1418949A/en not_active Expired
- 1973-12-12 AU AU63520/73A patent/AU6352073A/en not_active Expired
- 1973-12-14 NL NL7317195A patent/NL7317195A/xx unknown
- 1973-12-18 BR BR9911/73A patent/BR7309911D0/pt unknown
1974
- 1974-01-03 SE SE7400046A patent/SE385757B/xx unknown
- 1974-01-16 ZA ZA740310A patent/ZA74310B/xx unknown
- 1974-01-22 CH CH85774A patent/CH562512A5/xx not_active IP Right Cessation
- 1974-01-25 DD DD176196A patent/DD109475A5/xx unknown
- 1974-01-25 IT IT19802/74A patent/IT1006156B/it active
- 1974-01-29 ES ES422706A patent/ES422706A1/es not_active Expired
- 1974-01-29 SU SU1997125A patent/SU528892A3/ru active
- 1974-01-29 FR FR7402874A patent/FR2215780B1/fr not_active Expired
- 1974-01-29 ES ES422705A patent/ES422705A1/es not_active Expired
- 1974-01-30 CS CS632A patent/CS170484B2/cs unknown
- 1974-01-30 BE BE140354A patent/BE810374A/xx unknown
- 1974-01-30 JP JP49011926A patent/JPS49105161A/ja active Pending

Also Published As

Publication number	Publication date
DE2304412A1 (de)	1974-08-01
NL7317195A (de)	1974-08-01
SU528892A3 (ru)	1976-09-15
LU68391A1 (de)	1973-11-22
AT327345B (de)	1976-01-26
BE810374A (fr)	1974-05-16
JPS49105161A (de)	1974-10-04
ATA869073A (de)	1975-04-15
AU6352073A (en)	1975-06-12
CH562512A5 (de)	1975-05-30
DD109475A5 (de)	1974-11-05
BR7309911D0 (pt)	1974-10-22
GB1418949A (en)	1975-12-24
FR2215780B1 (de)	1977-09-23
FR2215780A1 (de)	1974-08-23
CS170484B2 (de)	1976-08-27
ES422705A1 (es)	1976-04-16
ZA74310B (en)	1974-11-27
IT1006156B (it)	1976-09-30
SE385757B (sv)	1976-07-19

Publication	Publication Date	Title
JPS5679148A (en)	1981-06-29	Waterrreducing resin composition
NL7512225A (nl)	1976-04-21	Thermoplastische harssamenstellingen.
AR205399A1 (es)	1976-04-30	Una resina moldeable de poliester termoplastico mejorada
SE412918B (sv)	1980-03-24	Forfarande for framstellning av en termoplastisk komposition baserad pa bitumen och en elast
NL7500997A (nl)	1975-07-30	Harsmateriaal.
ZA748230B (en)	1976-01-28	Closure mechanism for an injection molding machine or extrusion press
GB1504359A (en)	1978-03-22	Vulcanizable polymer blends
HK10379A (en)	1979-03-09	Thermoplastic polyoxymethylene molding resins
FR2290294A1 (fr)	1976-06-04	Perfectionnements aux machines de moulage par injection
ES422705A1 (es)	1976-04-16	Perfeccionamientos en envueltas estancas a la humedad para componentes electricos.
IL43345A0 (en)	1974-01-14	Thermosetting composition,a cured resin obtained therefrom and a fibrous material impregnated with said composition
BR7503381A (pt)	1976-04-27	Composicao termoplastica de moldagem
GB1396213A (en)	1975-06-04	Silicone resin moulding compositions
NZ179219A (en)	1979-04-26	Homogeising mouliding material with filler in injection moulding machine
CA994937A (en)	1976-08-10	Metal-amine complex accelerator for polyester resin curing
GB1502453A (en)	1978-03-01	Synthetic resin composition
ZA701148B (en)	1971-10-27	Thermo-setting resin moulding material
GB1505403A (en)	1978-03-30	Thermoplastic resin composition
JPS5262362A (en)	1977-05-23	Thermoplastic resin composition
SE7507654L (sv)	1976-01-05	Termoplastiska pressmassor.
IT1052486B (it)	1981-06-20	Procedimento per produrre copolimeri polisegmentati con proprieta termoplastiche
JPS5278966A (en)	1977-07-02	Device for producing synthetic resin foil
JPS5222056A (en)	1977-02-19	Thermoplastic resin extruder
CA1020689A (en)	1977-11-08	Thermoplastic resin composition
ES200936U (es)	1975-11-01	Un dispositivo de filtro