ES424713A1 - Metallizing insulating substrates - Google Patents

Metallizing insulating substrates

Info

Publication number
ES424713A1
ES424713A1 ES424713A ES424713A ES424713A1 ES 424713 A1 ES424713 A1 ES 424713A1 ES 424713 A ES424713 A ES 424713A ES 424713 A ES424713 A ES 424713A ES 424713 A1 ES424713 A1 ES 424713A1
Authority
ES
Spain
Prior art keywords
metal
solution
intensified
substrate
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES424713A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of ES424713A1 publication Critical patent/ES424713A1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Chemical Treatment Of Metals (AREA)

Abstract

Method of coating photochemically with metal, uniformly or according to a design, flexible or rigid polymerized and molded resin substrates, containing either in a surface layer or in its entire mass, finely divided dispersed particles of a photosensitive and semiconductor metal oxide whose product of reaction with light is capable of depositing copper and/or a more noble metal than copper in a solution of the respective metal salt, the layer being contacted, before and/or after exposure to light with such a solution so that the metal cores that are formed are intensified by means of a stabilized physical developer or a non-electrolytic metal coating solution to form an electrically conductive layer, and, if required, intensified by electrodeposition, characterized because as a pre-treatment the substrate is successively contacted with a bipolar proton-free solvent capable of slightly inflate the substrate and with a solution of a roughness-forming chemical agent. (Machine-translation by Google Translate, not legally binding)
ES424713A 1973-03-30 1974-03-28 Metallizing insulating substrates Expired ES424713A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7304429A NL7304429A (en) 1973-03-30 1973-03-30

Publications (1)

Publication Number Publication Date
ES424713A1 true ES424713A1 (en) 1976-06-01

Family

ID=19818532

Family Applications (1)

Application Number Title Priority Date Filing Date
ES424713A Expired ES424713A1 (en) 1973-03-30 1974-03-28 Metallizing insulating substrates

Country Status (11)

Country Link
JP (1) JPS5631916B2 (en)
AT (1) AT326444B (en)
BE (1) BE812977A (en)
CA (1) CA1000415A (en)
DE (1) DE2412733C2 (en)
ES (1) ES424713A1 (en)
FR (1) FR2223477B1 (en)
GB (1) GB1457008A (en)
HK (1) HK39378A (en)
IT (1) IT1011156B (en)
NL (1) NL7304429A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194911U (en) * 1982-06-21 1983-12-24 富士重工業株式会社 Rear quarter window glass mounting structure
US4601916A (en) * 1984-07-18 1986-07-22 Kollmorgen Technologies Corporation Process for bonding metals to electrophoretically deposited resin coatings
DE19957130A1 (en) * 1999-11-26 2001-05-31 Infineon Technologies Ag Metallizing dielectric materials comprises applying a photosensitive dielectric to a substrate, irradiating the dielectric through a mask, growing a metal, subjecting to high temperatures and chemically metallizing
DE10361419A1 (en) * 2003-12-22 2005-07-14 Infineon Technologies Ag Layer structure for a memory component comprises a functional layer containing a lithographically fixed material for fixing the functional layer on the layer lying below it
CN109680552B (en) * 2017-10-18 2021-11-05 江苏先诺新材料科技有限公司 Polyimide/nano fiber composite paper and preparation method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1621077A1 (en) * 1967-03-31 1971-04-22 Bayer Ag Process for the deposition of metal coatings
GB1229936A (en) * 1968-09-20 1971-04-28
US3698940A (en) * 1970-01-26 1972-10-17 Macdermid Inc Method of making additive printed circuit boards and product thereof

Also Published As

Publication number Publication date
AU6720474A (en) 1975-10-02
FR2223477A1 (en) 1974-10-25
CA1000415A (en) 1976-11-23
FR2223477B1 (en) 1978-07-28
IT1011156B (en) 1977-01-20
JPS5631916B2 (en) 1981-07-24
DE2412733A1 (en) 1974-10-10
BE812977A (en) 1974-09-30
GB1457008A (en) 1976-12-01
ATA254174A (en) 1975-02-15
DE2412733C2 (en) 1982-12-02
HK39378A (en) 1978-07-21
NL7304429A (en) 1974-10-02
JPS49128833A (en) 1974-12-10
AT326444B (en) 1975-12-10

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