ES438666A1 - IMPROVEMENTS INTRODUCED IN A CIRCUIT SEMICONDUCTOR PLATE STRUCTURE INTEGRATED IN A PLANE. - Google Patents

IMPROVEMENTS INTRODUCED IN A CIRCUIT SEMICONDUCTOR PLATE STRUCTURE INTEGRATED IN A PLANE.

Info

Publication number
ES438666A1
ES438666A1 ES438666A ES438666A ES438666A1 ES 438666 A1 ES438666 A1 ES 438666A1 ES 438666 A ES438666 A ES 438666A ES 438666 A ES438666 A ES 438666A ES 438666 A1 ES438666 A1 ES 438666A1
Authority
ES
Spain
Prior art keywords
cells
lines
resistors
transistors
plane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES438666A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of ES438666A1 publication Critical patent/ES438666A1/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90Masterslice integrated circuits
    • H10D84/901Masterslice integrated circuits comprising bipolar technology
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

Improvements introduced in a semiconductor chip structure of integrated circuits in a plane, a structure that comprises a surface from which a plurality of regions of different types of conductivity extend that enter the chip forming transistors and resistors, the improvement in which said transistors and resistors are arranged in a plurality of repetitive cells, each of said cells containing a sufficient number of transistors and resistors to form a chosen type of logic circuit, and said cells being arranged in an orthogonal formation, with cells in essentially parallel rows in both orthogonal directions; and in which the structure includes a metallization level arranged above said formation and isolated from it by at least one layer of electrically insulating material, said metallization level comprising a plurality of groups of essentially parallel lines, respectively arranged above of and parallel to a corresponding plurality of interfacial zones or transition faces between rows of said cells in one of said orthogonal directions, each group of lines being connected to a plurality of cells that apply to the transition face below said group, providing interconnections between said cells, and voltage level supplies for them, and distribution designs or guidelines of lines respectively arranged between said groups of lines and at a certain separation distance from them and above said cells, providing intracellular connections. (Machine-translation by Google Translate, not legally binding)
ES438666A 1974-06-26 1975-06-18 IMPROVEMENTS INTRODUCED IN A CIRCUIT SEMICONDUCTOR PLATE STRUCTURE INTEGRATED IN A PLANE. Expired ES438666A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US48346374A 1974-06-26 1974-06-26

Publications (1)

Publication Number Publication Date
ES438666A1 true ES438666A1 (en) 1977-03-16

Family

ID=23920133

Family Applications (1)

Application Number Title Priority Date Filing Date
ES438666A Expired ES438666A1 (en) 1974-06-26 1975-06-18 IMPROVEMENTS INTRODUCED IN A CIRCUIT SEMICONDUCTOR PLATE STRUCTURE INTEGRATED IN A PLANE.

Country Status (8)

Country Link
JP (2) JPS5753984B2 (en)
CA (1) CA1024661A (en)
CH (1) CH583970A5 (en)
DE (1) DE2523221A1 (en)
ES (1) ES438666A1 (en)
FR (1) FR2276693A1 (en)
GB (1) GB1513893A (en)
IT (1) IT1038108B (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2823555A1 (en) * 1977-05-31 1978-12-07 Fujitsu Ltd CELL-SHAPED INTEGRATED CIRCUIT
CA1102009A (en) * 1977-09-06 1981-05-26 Algirdas J. Gruodis Integrated circuit layout utilizing separated active circuit and wiring regions
DE2822011C3 (en) * 1978-05-19 1987-09-10 Fujitsu Ltd., Kawasaki, Kanagawa Semiconductor device and method for its manufacture
US4249193A (en) * 1978-05-25 1981-02-03 International Business Machines Corporation LSI Semiconductor device and fabrication thereof
FR2443185A1 (en) * 1978-11-30 1980-06-27 Ibm TOPOLOGY OF INTEGRATED SEMICONDUCTOR CIRCUITS AND METHOD FOR OBTAINING THIS TOPOLOGY
JPS5712534A (en) * 1980-06-27 1982-01-22 Hitachi Ltd Semiconductor device
FR2495834A1 (en) * 1980-12-05 1982-06-11 Cii Honeywell Bull INTEGRATED CIRCUIT DEVICE OF HIGH DENSITY
JPS57186350A (en) * 1981-05-13 1982-11-16 Hitachi Ltd Semiconductor integrated circuit device
JPS58112343A (en) * 1981-12-26 1983-07-04 Olympus Optical Co Ltd Semiconductor and manufacture thereof
JPS58143550A (en) * 1982-02-22 1983-08-26 Nec Corp Semiconductor device
JPS5943548A (en) * 1982-09-06 1984-03-10 Hitachi Ltd Semiconductor integrated circuit device
JPS59103455U (en) * 1982-12-28 1984-07-12 富士通株式会社 semiconductor equipment
DE3381270D1 (en) * 1983-01-12 1990-04-05 Ibm SEMICONDUCTOR NUT DISC CHIP WITH MULTI-FUNCTIONAL FASC.
JPS59159558A (en) * 1983-03-01 1984-09-10 Toshiba Corp Semiconductor substrate
JPS63278249A (en) * 1986-12-26 1988-11-15 Toshiba Corp Wiring of semiconductor integrated circuit device
US5124776A (en) * 1989-03-14 1992-06-23 Fujitsu Limited Bipolar integrated circuit having a unit block structure
DE10317018A1 (en) * 2003-04-11 2004-11-18 Infineon Technologies Ag Multichip module with several semiconductor chips and printed circuit board with several components

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1064185A (en) * 1967-05-23 1954-05-11 Philips Nv Method of manufacturing an electrode system
DE1789137A1 (en) * 1967-06-23 1973-05-03 Rca Corp CIRCUIT CONSTRUCTED FROM UNIT CELLS
US3558992A (en) * 1968-06-17 1971-01-26 Rca Corp Integrated circuit having bonding pads over unused active area components
US3584269A (en) * 1968-10-11 1971-06-08 Ibm Diffused equal impedance interconnections for integrated circuits
US3656028A (en) * 1969-05-12 1972-04-11 Ibm Construction of monolithic chip and method of distributing power therein for individual electronic devices constructed thereon
US3621562A (en) * 1970-04-29 1971-11-23 Sylvania Electric Prod Method of manufacturing integrated circuit arrays
US3771217A (en) * 1971-04-16 1973-11-13 Texas Instruments Inc Integrated circuit arrays utilizing discretionary wiring and method of fabricating same
US3725743A (en) * 1971-05-19 1973-04-03 Hitachi Ltd Multilayer wiring structure
US3808475A (en) * 1972-07-10 1974-04-30 Amdahl Corp Lsi chip construction and method

Also Published As

Publication number Publication date
CH583970A5 (en) 1977-01-14
JPS5125085A (en) 1976-03-01
DE2523221C2 (en) 1992-09-17
GB1513893A (en) 1978-06-14
FR2276693A1 (en) 1976-01-23
JPS5753984B2 (en) 1982-11-16
CA1024661A (en) 1978-01-17
FR2276693B1 (en) 1977-04-15
IT1038108B (en) 1979-11-20
JPS5989435A (en) 1984-05-23
DE2523221A1 (en) 1976-01-15

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