ES447245A1 - Perfeccionamientos introducidos en un bastidor de conducto- res para una dispositivo semiconductor. - Google Patents

Perfeccionamientos introducidos en un bastidor de conducto- res para una dispositivo semiconductor.

Info

Publication number: ES447245A1
Authority: ES; Spain
Prior art keywords: semiconductor device; improvements introduced; conductor frame; fingers; semiconductive device
Prior art date: 1975-11-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

ES447245A

Other languages

English (en)

Spanish (es)

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

TE Connectivity Corp

Original Assignee

AMP Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1975-11-18

Filing date

1976-04-22

Publication date

1977-06-16

1975-11-18 Priority claimed from US05/633,045 external-priority patent/US4048438A/en

1976-04-22 Application filed by AMP Inc filed Critical AMP Inc

1977-06-16 Publication of ES447245A1 publication Critical patent/ES447245A1/es

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/453—Leadframes comprising flexible metallic tapes
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/688—Flexible insulating substrates
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Lead Frames For Integrated Circuits (AREA)
Wire Bonding (AREA)

ES447245A 1975-11-18 1976-04-22 Perfeccionamientos introducidos en un bastidor de conducto- res para una dispositivo semiconductor. Expired ES447245A1 (es)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US05/633,045 US4048438A (en)	1974-10-23	1975-11-18	Conductor patterned substrate providing stress release during direct attachment of integrated circuit chips

Publications (1)

Publication Number	Publication Date
ES447245A1 true ES447245A1 (es)	1977-06-16

Family

ID=24538059

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
ES447245A Expired ES447245A1 (es)	1975-11-18	1976-04-22	Perfeccionamientos introducidos en un bastidor de conducto- res para una dispositivo semiconductor.

Country Status (8)

Country	Link
JP (1)	JPS5261963A (it)
BR (1)	BR7602449A (it)
CA (1)	CA1053379A (it)
DE (1)	DE2614930A1 (it)
ES (1)	ES447245A1 (it)
FR (1)	FR2332620A1 (it)
GB (1)	GB1509142A (it)
IT (1)	IT1059111B (it)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2753236C2 (de) *	1977-11-29	1982-05-27	Siemens AG, 1000 Berlin und 8000 München	Einbaurahmen für eine gehäuselose integrierte Halbleiterschaltungsanordnung
FR2518813A1 (fr) *	1981-12-22	1983-06-24	Socapex	Support d'interconnexion d'un boitier de circuit integre sur un circuit imprime et systeme d'interconnexion utilisant un tel support
FR2521350B1 (fr) *	1982-02-05	1986-01-24	Hitachi Ltd	Boitier porteur de puce semi-conductrice
EP0641019A3 (en) *	1993-08-27	1995-12-20	Poly Flex Circuits Inc	Flexible lead frame printed on a polymer.

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
NL7014131A (it) *	1970-09-24	1972-03-28
US3777365A (en) *	1972-03-06	1973-12-11	Honeywell Inf Systems	Circuit chips having beam leads attached by film strip process
US3778686A (en) *	1972-08-18	1973-12-11	Motorola Inc	Carrier for beam lead integrated circuits

1976
- 1976-03-31 GB GB12911/76A patent/GB1509142A/en not_active Expired
- 1976-03-31 CA CA249,325A patent/CA1053379A/en not_active Expired
- 1976-04-07 DE DE19762614930 patent/DE2614930A1/de not_active Withdrawn
- 1976-04-08 JP JP51040163A patent/JPS5261963A/ja active Pending
- 1976-04-14 IT IT22326/76A patent/IT1059111B/it active
- 1976-04-22 FR FR7611962A patent/FR2332620A1/fr active Granted
- 1976-04-22 ES ES447245A patent/ES447245A1/es not_active Expired
- 1976-04-22 BR BR7602449A patent/BR7602449A/pt unknown

Also Published As

Publication number	Publication date
FR2332620B1 (it)	1982-11-12
IT1059111B (it)	1982-05-31
CA1053379A (en)	1979-04-24
FR2332620A1 (fr)	1977-06-17
BR7602449A (pt)	1977-05-10
JPS5261963A (en)	1977-05-21
DE2614930A1 (de)	1977-06-02
GB1509142A (en)	1978-04-26

Publication	Publication Date	Title
ES217330Y (es)	1977-01-01	Armario metalico para material electrico.
NO138073C (no)	1978-06-21	Elektrisk kontaktklemme.
IT1017103B (it)	1977-07-20	Dispositivo di ritenuta per contatti elettrici
AR216582A1 (es)	1979-12-28	Elemento intermedio de alivio de tension,termica y electricamente conductor,para un dispositivo semiconductor
NL168999C (nl)	1982-05-17	Elektrische aardingselektrode.
NL175120C (nl)	1984-09-17	Langwerpig electrisch contactorgaan met isolatie-doorsnijdende draadvastklemorganen.
CH533351A (de)	1973-01-31	Elektrische Kontaktvorrichtung für hohe Ströme
ES234209U (es)	1978-04-16	Cuerpo aislante cilindrico.
NL7602676A (nl)	1976-10-20	Elektrisch contact.
ES196000U (es)	1975-02-16	Un dispositivo de elemento de circuito electrico.
FR2301085A1 (fr)	1976-09-10	Porte-contacts en matiere isolante, obturable par boitier
NL7611659A (nl)	1977-05-05	Draadtoevoerinrichting.
NL154357B (nl)	1977-08-15	Elektrische contactinrichting.
NL7802424A (nl)	1978-09-11	Geleidend materiaal, alsmede dielektrisch sub- straat waarop dit materiaal is aangebracht.
NO142212C (no)	1980-07-30	Variabel traadmatningsanordning.
ES221819Y (es)	1977-03-01	Un dispositivo interruptor electrico.
NL7411562A (nl)	1975-03-04	Elektrisch isolerend materiaal.
IT1074665B (it)	1985-04-20	Dispositivo elettrico di supporto avente contatti schermati in condizione inattiva,in particolare portalampade di tipo edison
BR7208703D0 (pt)	1973-09-25	Dispositivo de temporizacao para contatos eletricos
ES451614A1 (es)	1977-07-16	Perfeccionamientos en componentes semiconductores.
SU449900A1 (ru)	1974-11-15	Термостойкий электроизол ционный материал
NL7514694A (nl)	1976-08-31	Elektrisch installatie-element.
CH540574A (de)	1973-08-15	Kontaktelement aus Blech für elektrische Verbinder
ES221765Y (es)	1977-03-01	Conductor metalico rigido.
JPS5214805A (en)	1977-02-04	Flat commutator