ES456268A1 - Un procedimiento para confeccionar placas de circuitos im- presos. - Google Patents

Un procedimiento para confeccionar placas de circuitos im- presos.

Info

Publication number
ES456268A1
ES456268A1 ES456268A ES456268A ES456268A1 ES 456268 A1 ES456268 A1 ES 456268A1 ES 456268 A ES456268 A ES 456268A ES 456268 A ES456268 A ES 456268A ES 456268 A1 ES456268 A1 ES 456268A1
Authority
ES
Spain
Prior art keywords
circuit board
grooves
pressed
separation lines
metal foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES456268A
Other languages
English (en)
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westfaelische Metall Industrie KG Hueck and Co
Original Assignee
Westfaelische Metall Industrie KG Hueck and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westfaelische Metall Industrie KG Hueck and Co filed Critical Westfaelische Metall Industrie KG Hueck and Co
Publication of ES456268A1 publication Critical patent/ES456268A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
ES456268A 1976-03-23 1977-02-24 Un procedimiento para confeccionar placas de circuitos im- presos. Expired ES456268A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762612257 DE2612257C3 (de) 1976-03-23 1976-03-23 Verfahren und Vorrichtung zur Herstellung von Leiterplatten

Publications (1)

Publication Number Publication Date
ES456268A1 true ES456268A1 (es) 1978-05-01

Family

ID=5973201

Family Applications (1)

Application Number Title Priority Date Filing Date
ES456268A Expired ES456268A1 (es) 1976-03-23 1977-02-24 Un procedimiento para confeccionar placas de circuitos im- presos.

Country Status (6)

Country Link
AT (1) AT362009B (de)
BR (1) BR7701750A (de)
DE (1) DE2612257C3 (de)
ES (1) ES456268A1 (de)
FR (1) FR2345888A1 (de)
SE (1) SE7702753L (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3642039A1 (de) * 1986-12-09 1988-06-23 Philips Patentverwaltung Werkzeug zum herstellen eines schaltungsmusters einer elektrischen schaltungsplatte durch schneiden einer kupferplatte und schaltungsmuster einer elektrischen schaltungsplatte, das zur bearbeitung mit dem werkzeug geeignet ist
FR2621774B1 (fr) * 1987-10-12 1990-02-16 Dav Plaque circuit pour courants eleves et procede de preparation
US4811504A (en) * 1988-01-28 1989-03-14 Bunke Clinton R Walk ease ski boot soles

Also Published As

Publication number Publication date
SE7702753L (sv) 1977-09-24
BR7701750A (pt) 1978-01-17
FR2345888B3 (de) 1980-02-29
FR2345888A1 (fr) 1977-10-21
ATA198577A (de) 1980-09-15
DE2612257B2 (de) 1978-10-05
DE2612257C3 (de) 1979-06-07
DE2612257A1 (de) 1977-09-29
AT362009B (de) 1981-04-27

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