ES462067A1 - Una capsula evacuadora de calor con componente electronico. - Google Patents

Una capsula evacuadora de calor con componente electronico.

Info

Publication number
ES462067A1
ES462067A1 ES462067A ES462067A ES462067A1 ES 462067 A1 ES462067 A1 ES 462067A1 ES 462067 A ES462067 A ES 462067A ES 462067 A ES462067 A ES 462067A ES 462067 A1 ES462067 A1 ES 462067A1
Authority
ES
Spain
Prior art keywords
capsule
electronic component
heat
component
heat evacuating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES462067A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/720,470 external-priority patent/US4034468A/en
Priority claimed from US05/720,471 external-priority patent/US4034469A/en
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of ES462067A1 publication Critical patent/ES462067A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Una cápsula evacuadora de calor con componente electrónico, en la que el calor del componente es transmitido a través de, al menos, un cojín metálico, a un elemento enfriador, caracterizado porque el cojín metálico está metálicamente unido por un lado, ya con el componente, ya con el elemento enfriador, mientras que su otro lado se apoya suelto sobre el elemento enfriador o, respectivamente, sobre el componente.
ES462067A 1976-09-03 1977-09-02 Una capsula evacuadora de calor con componente electronico. Expired ES462067A1 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US05/720,470 US4034468A (en) 1976-09-03 1976-09-03 Method for making conduction-cooled circuit package
US05/720,471 US4034469A (en) 1976-09-03 1976-09-03 Method of making conduction-cooled circuit package

Publications (1)

Publication Number Publication Date
ES462067A1 true ES462067A1 (es) 1978-06-01

Family

ID=27110261

Family Applications (1)

Application Number Title Priority Date Filing Date
ES462067A Expired ES462067A1 (es) 1976-09-03 1977-09-02 Una capsula evacuadora de calor con componente electronico.

Country Status (3)

Country Link
CH (1) CH614810A5 (es)
DE (1) DE2729074C2 (es)
ES (1) ES462067A1 (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8324839D0 (en) * 1983-09-16 1983-10-19 Lucas Ind Plc Mounting carrier for microelectronic silicon chip
KR920008251B1 (ko) * 1988-09-26 1992-09-25 가부시기가이샤 히다찌세이사꾸쇼 전자디바이스의 냉각장치
US5396403A (en) * 1993-07-06 1995-03-07 Hewlett-Packard Company Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
US6108208A (en) * 1997-12-08 2000-08-22 Unisys Corporation Testing assembly having a pressed joint with a single layer of thermal conductor which is reused to sequentially test multiple circuit modules

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1042762B (de) * 1955-02-26 1958-11-06 Siemens Ag Flaechengleichrichter bzw. -transistor, welcher mit mindestens einer seiner Elektroden flaechenhaft mit einem die Verlustwaerme abfuehrenden Koerper in Kontakt steht
US3429040A (en) * 1965-06-18 1969-02-25 Ibm Method of joining a component to a substrate

Also Published As

Publication number Publication date
DE2729074A1 (de) 1978-03-09
CH614810A5 (en) 1979-12-14
DE2729074C2 (de) 1982-08-26

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