ES472055A1 - Perfeccionamientos introducidos en un conectador electrico - Google Patents

Perfeccionamientos introducidos en un conectador electrico

Info

Publication number
ES472055A1
ES472055A1 ES472055A ES472055A ES472055A1 ES 472055 A1 ES472055 A1 ES 472055A1 ES 472055 A ES472055 A ES 472055A ES 472055 A ES472055 A ES 472055A ES 472055 A1 ES472055 A1 ES 472055A1
Authority
ES
Spain
Prior art keywords
electrical connector
housing
modules
improvements introduced
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES472055A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of ES472055A1 publication Critical patent/ES472055A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
    • H05K7/1046—J-shaped leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Combinations Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

Perfeccionamientos introducidos en un conectador eléctrico, para uso al montar una pluralidad de módulos de microcircuito que comprenden cada uno un cuerpo que tiene una pluralidad de terminales que se extienden desde el mismo, en un substrato, caracterizados porque el conectador comprende un alojamiento prismático hueco de material eléctricamente aislante configurado para recibir una pluralidad de dichos módulos en relación superpuesta, teniendo el alojamiento una pluralidad de conductores eléctricos que se extienden a lo largo de las caras internas de sus paredes y dispuestos para que hagan contacto con ellos los terminales de los módulos cuando son recibidos en el alojamiento, teniendo los conductores porciones que se extienden desde un extremo común del alojamiento para conexión a conductores en un substrato.
ES472055A 1977-08-02 1978-07-26 Perfeccionamientos introducidos en un conectador electrico Expired ES472055A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/821,112 US4116519A (en) 1977-08-02 1977-08-02 Electrical connections for chip carriers

Publications (1)

Publication Number Publication Date
ES472055A1 true ES472055A1 (es) 1979-02-01

Family

ID=25232548

Family Applications (1)

Application Number Title Priority Date Filing Date
ES472055A Expired ES472055A1 (es) 1977-08-02 1978-07-26 Perfeccionamientos introducidos en un conectador electrico

Country Status (7)

Country Link
US (1) US4116519A (es)
EP (1) EP0000630B1 (es)
JP (1) JPS5427984A (es)
CA (1) CA1100218A (es)
DE (1) DE2860837D1 (es)
ES (1) ES472055A1 (es)
IT (1) IT1097887B (es)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4356532A (en) * 1980-07-18 1982-10-26 Thomas & Betts Corporation Electronic package and accessory component assembly
US4312555A (en) * 1979-10-17 1982-01-26 Thomas & Betts Corporation Receptacle for stacking electronic packages
USRE31929E (en) * 1980-07-18 1985-06-25 Thomas & Betts Corporation Electronic package and accessory component assembly
US4406508A (en) * 1981-07-02 1983-09-27 Thomas & Betts Corporation Dual-in-line package assembly
US4519658A (en) * 1983-01-24 1985-05-28 Thomas & Betts Corporation Electronic package assembly and accessory component therefor
US4627678A (en) * 1983-01-24 1986-12-09 Thomas & Betts Corporation Electronic package assembly and accessory component therefor
EP0404277B1 (en) * 1984-02-27 1994-09-28 The Whitaker Corporation Method of inserting a chip carrier contact into a housing
US4541676A (en) * 1984-03-19 1985-09-17 Itt Corporation Chip carrier test adapter
KR890004820B1 (ko) * 1984-03-28 1989-11-27 인터내셔널 비지네스 머신즈 코포레이션 배저장밀도의 메모리 모듈 및 보드와 그 형성방법
US4981441A (en) * 1985-03-06 1991-01-01 Minnesota Mining And Manufacturing Co. Test clip for PLCC
US4671590A (en) * 1985-03-06 1987-06-09 Minnesota Mining And Manufacturing Company Test clip for PLCC
US4671592A (en) * 1985-03-06 1987-06-09 Minnesota Mining And Manufacturing Company Test clip for PLCC
US4768972A (en) * 1985-03-06 1988-09-06 Minnesota Mining And Manufacturing Company Test clip for PLCC
JPS6210887A (ja) * 1985-07-04 1987-01-19 日立電子エンジニアリング株式会社 Ｉｃソケツト
US4873615A (en) * 1986-10-09 1989-10-10 Amp Incorporated Semiconductor chip carrier system
US5261055A (en) * 1992-02-19 1993-11-09 Milsys, Ltd. Externally updatable ROM (EUROM)
US6205654B1 (en) 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5330359A (en) * 1993-03-26 1994-07-19 The Whitaker Corporation Socket for stacking integrated circuit chips
US5643000A (en) * 1994-09-27 1997-07-01 Intel Corporation Method and apparatus for providing processor field upgradability to a motherboard
US5514907A (en) * 1995-03-21 1996-05-07 Simple Technology Incorporated Apparatus for stacking semiconductor chips
US6210175B1 (en) * 1998-02-20 2001-04-03 Hewlett-Packard Company Socket rails for stacking integrated circuit components
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US6608763B1 (en) 2000-09-15 2003-08-19 Staktek Group L.P. Stacking system and method
US6462408B1 (en) 2001-03-27 2002-10-08 Staktek Group, L.P. Contact member stacking system and method
US6980015B2 (en) * 2003-06-17 2005-12-27 Agilent Technologies, Inc. Back side probing method and assembly
US7307502B2 (en) * 2003-07-16 2007-12-11 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US7489219B2 (en) * 2003-07-16 2009-02-10 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US7023313B2 (en) * 2003-07-16 2006-04-04 Marvell World Trade Ltd. Power inductor with reduced DC current saturation
US8324872B2 (en) 2004-03-26 2012-12-04 Marvell World Trade, Ltd. Voltage regulator with coupled inductors having high coefficient of coupling
US7227759B2 (en) * 2004-04-01 2007-06-05 Silicon Pipe, Inc. Signal-segregating connector system
CN100468727C (zh) * 2005-09-20 2009-03-11 南茂科技股份有限公司 半导体封装组件的堆叠构造
CN101764328B (zh) * 2008-12-24 2013-09-18 鸿富锦精密工业（深圳）有限公司 芯片接座
CN101976659B (zh) * 2010-09-03 2013-12-11 中兴通讯股份有限公司 一种无外封装晶体装置及其制造方法
DE112014003944B4 (de) * 2013-08-30 2018-08-02 Yazaki Corporation Verbindungsstruktur eines elektronischen Bauelements und von Metallanschlussstücken

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2816253A (en) * 1953-12-23 1957-12-10 Sanders Associates Inc Electronic module structure
CA828390A (en) * 1967-02-15 1969-11-25 Powercube Corporation Modular circuit package
US3715629A (en) * 1967-04-05 1973-02-06 Amp Inc Wiring device for interconnecting module circuit units
US3701077A (en) * 1969-12-29 1972-10-24 Tech Inc K Electronic components
US4028722A (en) * 1970-10-13 1977-06-07 Motorola, Inc. Contact bonded packaged integrated circuit
US3784960A (en) * 1972-05-01 1974-01-08 Bunker Ramo Carrier for integrated circuit packages
US3912984A (en) * 1974-01-07 1975-10-14 Burroughs Corp Auxiliary circuit package
US4045105A (en) * 1974-09-23 1977-08-30 Advanced Memory Systems, Inc. Interconnected leadless package receptacle
US4018494A (en) * 1975-06-10 1977-04-19 Amp Incorporated Interconnection for electrically connecting two vertically stacked electronic packages

Also Published As

Publication number Publication date
JPS5427984A (en) 1979-03-02
EP0000630A1 (en) 1979-02-07
IT7825836A0 (it) 1978-07-18
CA1100218A (en) 1981-04-28
EP0000630B1 (en) 1981-07-15
IT1097887B (it) 1985-08-31
US4116519A (en) 1978-09-26
DE2860837D1 (en) 1981-10-22

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19971103