ES525483A0 - Un metodo de electrochapar un deposito de paladio sobre una pieza de trabajo - Google Patents

Un metodo de electrochapar un deposito de paladio sobre una pieza de trabajo

Info

Publication number
ES525483A0
ES525483A0 ES525483A ES525483A ES525483A0 ES 525483 A0 ES525483 A0 ES 525483A0 ES 525483 A ES525483 A ES 525483A ES 525483 A ES525483 A ES 525483A ES 525483 A0 ES525483 A0 ES 525483A0
Authority
ES
Spain
Prior art keywords
electrochapping
paladium
workpiece
tank
paladium tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES525483A
Other languages
English (en)
Other versions
ES8407118A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF Catalysts LLC
Original Assignee
Engelhard Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Corp filed Critical Engelhard Corp
Publication of ES8407118A1 publication Critical patent/ES8407118A1/es
Publication of ES525483A0 publication Critical patent/ES525483A0/es
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
ES525483A 1982-09-09 1983-09-08 Un metodo de electrochapar un deposito de paladio sobre una pieza de trabajo Granted ES525483A0 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US41641282A 1982-09-09 1982-09-09

Publications (2)

Publication Number Publication Date
ES8407118A1 ES8407118A1 (es) 1984-09-01
ES525483A0 true ES525483A0 (es) 1984-09-01

Family

ID=23649865

Family Applications (1)

Application Number Title Priority Date Filing Date
ES525483A Granted ES525483A0 (es) 1982-09-09 1983-09-08 Un metodo de electrochapar un deposito de paladio sobre una pieza de trabajo

Country Status (5)

Country Link
EP (1) EP0107308A3 (es)
JP (1) JPS5967388A (es)
KR (1) KR840006022A (es)
BR (1) BR8304883A (es)
ES (1) ES525483A0 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8821005D0 (en) * 1988-09-07 1988-10-05 Johnson Matthey Plc Improvements in plating
US5135622A (en) * 1991-12-02 1992-08-04 At&T Bell Laboratories Electrochemical synthesis of palladium hydroxide compounds
JP4570213B2 (ja) * 2000-01-12 2010-10-27 古河電気工業株式会社 パラジウムめっき液
FR2807422B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages
KR100797731B1 (ko) * 2002-11-25 2008-01-24 삼성전자주식회사 합금 패턴 형성을 위한 유기 금속화합물의 조성물 및 이를이용한 합금 패턴 형성방법
US20110147225A1 (en) 2007-07-20 2011-06-23 Rohm And Haas Electronic Materials Llc High speed method for plating palladium and palladium alloys
GB202217304D0 (en) 2022-11-18 2023-01-04 Johnson Matthey Plc High efficiency platinum electroplating solutions
CN116043290B (zh) * 2022-12-01 2025-07-22 崇辉半导体(深圳)有限公司 一种提升led灯珠寿命的电镀工艺

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB348919A (en) * 1930-06-13 1931-05-21 Baker & Co Improvements in and relating to the electro deposition of metals and alloys of the platinum group
US3925170A (en) * 1974-01-23 1975-12-09 American Chem & Refining Co Method and composition for producing bright palladium electrodepositions

Also Published As

Publication number Publication date
EP0107308A3 (en) 1985-07-03
BR8304883A (pt) 1984-04-24
ES8407118A1 (es) 1984-09-01
JPS5967388A (ja) 1984-04-17
KR840006022A (ko) 1984-11-21
EP0107308A2 (en) 1984-05-02

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