ES539843A0 - Una disposicion de placa de circuito impreso para componen- tes electronicos - Google Patents

Una disposicion de placa de circuito impreso para componen- tes electronicos

Info

Publication number
ES539843A0
ES539843A0 ES539843A ES539843A ES539843A0 ES 539843 A0 ES539843 A0 ES 539843A0 ES 539843 A ES539843 A ES 539843A ES 539843 A ES539843 A ES 539843A ES 539843 A0 ES539843 A0 ES 539843A0
Authority
ES
Spain
Prior art keywords
circuit board
printed circuit
electronic components
board arrangement
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES539843A
Other languages
English (en)
Other versions
ES8602339A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP59013005A external-priority patent/JPS60160150A/ja
Priority claimed from JP59013006A external-priority patent/JPS60160151A/ja
Priority claimed from JP59013007A external-priority patent/JPS60160152A/ja
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of ES539843A0 publication Critical patent/ES539843A0/es
Publication of ES8602339A1 publication Critical patent/ES8602339A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H10W40/475—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling using jet impingement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/772—Bellows

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
ES539843A 1984-01-26 1985-01-25 Una disposicion de placa de circuito impreso para componen- tes electronicos Expired ES8602339A1 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP59013005A JPS60160150A (ja) 1984-01-26 1984-01-26 集積回路の冷却装置
JP59013006A JPS60160151A (ja) 1984-01-26 1984-01-26 集積回路の冷却方式
JP59013007A JPS60160152A (ja) 1984-01-26 1984-01-26 集積回路冷却装置

Publications (2)

Publication Number Publication Date
ES539843A0 true ES539843A0 (es) 1985-11-16
ES8602339A1 ES8602339A1 (es) 1985-11-16

Family

ID=27280079

Family Applications (1)

Application Number Title Priority Date Filing Date
ES539843A Expired ES8602339A1 (es) 1984-01-26 1985-01-25 Una disposicion de placa de circuito impreso para componen- tes electronicos

Country Status (8)

Country Link
US (1) US5050037A (es)
EP (1) EP0151546B1 (es)
KR (1) KR900002214B1 (es)
AU (1) AU552537B2 (es)
BR (1) BR8500360A (es)
CA (1) CA1227886A (es)
DE (1) DE3586661T2 (es)
ES (1) ES8602339A1 (es)

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR910008985B1 (ko) * 1987-05-25 1991-10-26 후지쓰 가부시끼가이샤 전자회로부품을 냉각시키기 위해 열도전성 화합물층을 갖는 냉각시스템 및 그 화합물 형성방법
KR890007419A (ko) * 1987-10-21 1989-06-19 미다가쓰시게 반도체모듈 및 그 냉각장치
JPH0682941B2 (ja) * 1987-10-22 1994-10-19 富士通株式会社 冷却液供給装置
JPH0812890B2 (ja) * 1988-05-24 1996-02-07 富士通株式会社 モジュール封止方法
US5132873A (en) * 1988-09-30 1992-07-21 Microelectronics And Computer Technology Corporation Diaphragm sealing apparatus
US4909315A (en) * 1988-09-30 1990-03-20 Microelectronics And Computer Technology Corporation Fluid heat exchanger for an electronic component
US4882654A (en) * 1988-12-22 1989-11-21 Microelectronics And Computer Technology Corporation Method and apparatus for adjustably mounting a heat exchanger for an electronic component
US5148003A (en) * 1990-11-28 1992-09-15 International Business Machines Corporation Modular test oven
JPH06342990A (ja) * 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> 統合冷却システム
JP2728105B2 (ja) * 1991-10-21 1998-03-18 日本電気株式会社 集積回路用冷却装置
US5177667A (en) * 1991-10-25 1993-01-05 International Business Machines Corporation Thermal conduction module with integral impingement cooling
US5206791A (en) * 1992-02-07 1993-04-27 Digital Equipment Corporation Bellows heat pipe apparatus for cooling systems
JP2745948B2 (ja) * 1992-04-06 1998-04-28 日本電気株式会社 集積回路の冷却構造
US5754399A (en) * 1992-09-30 1998-05-19 International Business Machines Corporation Direct coupled CPU package
DE4326207A1 (de) * 1992-10-06 1994-04-07 Hewlett Packard Co Mechanisch schwimmendes Mehr-Chip-Substrat
US5323292A (en) * 1992-10-06 1994-06-21 Hewlett-Packard Company Integrated multi-chip module having a conformal chip/heat exchanger interface
CA2102662C (en) * 1992-11-09 1997-10-07 Shinya Akamatsu Structure for cooling an integrated circuit
US6018289A (en) 1995-06-15 2000-01-25 Sekura; Ronald D. Prescription compliance device and method of using device
US5831824A (en) * 1996-01-31 1998-11-03 Motorola, Inc. Apparatus for spray-cooling multiple electronic modules
US5675473A (en) * 1996-02-23 1997-10-07 Motorola, Inc. Apparatus and method for shielding an electronic module from electromagnetic radiation
US5718117A (en) * 1996-04-10 1998-02-17 Motorola, Inc. Apparatus and method for spray-cooling an electronic module
US5687577A (en) * 1996-04-10 1997-11-18 Motorola, Inc. Apparatus and method for spray-cooling an electronic module
US5731542A (en) * 1996-05-23 1998-03-24 Motorola, Inc. Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic component mounted to a substrate
US5761038A (en) * 1996-05-30 1998-06-02 The Furukawa Electric Co.,Ltd. Electrical connection box
US5983997A (en) * 1996-10-17 1999-11-16 Brazonics, Inc. Cold plate having uniform pressure drop and uniform flow rate
US5907473A (en) * 1997-04-04 1999-05-25 Raytheon Company Environmentally isolated enclosure for electronic components
US5815370A (en) * 1997-05-16 1998-09-29 Allied Signal Inc Fluidic feedback-controlled liquid cooling module
KR20010024447A (ko) * 1997-10-07 2001-03-26 릴라이어빌리티 인코포레이티드 적응성 있는 방열 장치를 구비한 번인 보드
US6132184A (en) * 1998-11-05 2000-10-17 Ford Motor Company Reservoir apparatus for an electronically controlled electric pump
US6665184B2 (en) 2001-07-13 2003-12-16 Lytron, Inc. Tapered cold plate
JP2003051689A (ja) * 2001-08-06 2003-02-21 Toshiba Corp 発熱素子用冷却装置
US7385821B1 (en) * 2001-12-06 2008-06-10 Apple Inc. Cooling method for ICS
JP2005166855A (ja) * 2003-12-02 2005-06-23 Hitachi Ltd 電子機器
US7983042B2 (en) * 2004-06-15 2011-07-19 Raytheon Company Thermal management system and method for thin membrane type antennas
US7149087B2 (en) * 2004-09-08 2006-12-12 Thermal Corp. Liquid cooled heat sink with cold plate retention mechanism
EP1637741A1 (de) * 2004-09-17 2006-03-22 Pumpenfabrik Ernst Vogel Gesellschaft m.b.H. Flüssigkeitsgekühltes Pumpensteuergerät und Flüssigkeitspumpenanordnung
US20060067052A1 (en) * 2004-09-30 2006-03-30 Llapitan David J Liquid cooling system
US8125781B2 (en) * 2004-11-11 2012-02-28 Denso Corporation Semiconductor device
JP2006190972A (ja) * 2004-12-08 2006-07-20 Mitsubishi Electric Corp 電力用半導体装置
EP1848948B1 (de) * 2005-02-18 2010-04-14 ebm-papst St. Georgen GmbH & Co. KG Wärmetauscher
US7243705B2 (en) * 2005-03-01 2007-07-17 Intel Corporation Integrated circuit coolant microchannel with compliant cover
JP4305406B2 (ja) * 2005-03-18 2009-07-29 三菱電機株式会社 冷却構造体
US7605581B2 (en) 2005-06-16 2009-10-20 Delta Design, Inc. Apparatus and method for controlling die force in a semiconductor device testing assembly
DE602006021193D1 (de) * 2006-10-27 2011-05-19 Agie Charmilles S A Leiterplatteneinheit und Verfahren zur Herstellung dazu
US7492594B2 (en) * 2007-05-03 2009-02-17 Hamilton Sundstrand Corporation Electronic circuit modules cooling
CN101505861B (zh) * 2007-09-14 2013-09-11 株式会社爱德万测试 高级热控接口
US20090207568A1 (en) * 2008-02-18 2009-08-20 Haveri Heikki Antti Mikael Method and apparatus for cooling in miniaturized electronics
US8081473B2 (en) * 2008-08-04 2011-12-20 International Business Machines Corporation Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages
US8004841B2 (en) * 2008-05-06 2011-08-23 International Business Machines Corporation Method and apparatus of water cooling several parallel circuit cards each containing several chip packages
US9342121B2 (en) 2008-05-06 2016-05-17 International Business Machines Corporatoin Cooling system for electronic components
US8081478B1 (en) * 2008-12-09 2011-12-20 Lockheed Martin Corporation Fluid cooled electronics module cover
US8369090B2 (en) 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
US20120325436A1 (en) 2011-06-27 2012-12-27 Shedd Timothy A High efficiency thermal management system
KR101457937B1 (ko) * 2012-04-24 2014-11-07 이청종 서버용 유냉식 냉각장치 및 그 구동 방법
JP2013247354A (ja) * 2012-05-23 2013-12-09 Samsung Electro-Mechanics Co Ltd 電力モジュール用放熱システム
US9894802B2 (en) 2014-05-29 2018-02-13 Ge-Hitachi Nuclear Energy Americas Llc Passive system of powering and cooling with liquid metal and method thereof
JP6409556B2 (ja) * 2014-12-19 2018-10-24 富士通株式会社 冷却機構付き基板及び電子機器
US10433458B1 (en) 2018-05-08 2019-10-01 Hewlett Packard Enterprise Development Lp Conducting plastic cold plates
US10746084B2 (en) * 2018-12-13 2020-08-18 General Electric Company Liquid driven thermal module and thermal management system
CN113396310A (zh) * 2019-01-24 2021-09-14 麦格纳国际公司 具有集成多层冷却的功率转换器
US11158566B2 (en) 2019-05-24 2021-10-26 Google Llc Integrated circuit with a ring-shaped hot spot area and multidirectional cooling
WO2020249218A1 (en) * 2019-06-13 2020-12-17 Huawei Technologies Co., Ltd. A cooling device for securing a first module and a second module in a space
US11382241B2 (en) * 2019-09-25 2022-07-05 Baidu Usa Llc Cooling devices for edge computing and heterogeneous computing electronics hardware
CN110799001A (zh) * 2019-11-13 2020-02-14 辽东学院 一种电子信息设备安全保护装置
US11776875B2 (en) 2020-11-13 2023-10-03 Toyota Motor Engineering & Manufacturing North America, Inc. Systems including a vapor chamber as the heat spreading substrate of a power device embedded in a PCB and methods of forming the same
WO2022192031A1 (en) * 2021-03-08 2022-09-15 Tesla, Inc. Cold plate with integrated sliding pedestal and processing system including the same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3389305A (en) * 1966-08-01 1968-06-18 Gen Motors Corp Mounting and cooling apparatus for semiconductor devices
SE350874B (es) * 1970-03-05 1972-11-06 Asea Ab
US3921201A (en) * 1972-01-22 1975-11-18 Siemens Ag Improved liquid cooled semiconductor disk arrangement
DE2345626C3 (de) * 1973-09-10 1978-05-24 Siemens Ag, 1000 Berlin Und 8000 Muenchen Einrichtung zum Kühlen elektronischer Geräte
US4155402A (en) * 1977-01-03 1979-05-22 Sperry Rand Corporation Compliant mat cooling
GB1598174A (en) * 1977-05-31 1981-09-16 Ibm Cooling electrical apparatus
US4138692A (en) * 1977-09-12 1979-02-06 International Business Machines Corporation Gas encapsulated cooling module
US4212349A (en) * 1979-01-02 1980-07-15 International Business Machines Corporation Micro bellows thermo capsule
US4341432A (en) * 1979-08-06 1982-07-27 Cutchaw John M Liquid cooled connector for integrated circuit packages
US4536824A (en) * 1983-03-28 1985-08-20 Goodyear Aerospace Corporation Indirect cooling of electronic circuits

Also Published As

Publication number Publication date
EP0151546A3 (en) 1987-03-18
AU3794385A (en) 1985-08-01
KR850006302A (ko) 1985-10-02
CA1227886A (en) 1987-10-06
EP0151546A2 (en) 1985-08-14
DE3586661T2 (de) 1993-02-04
DE3586661D1 (de) 1992-10-29
EP0151546B1 (en) 1992-09-23
AU552537B2 (en) 1986-06-05
BR8500360A (pt) 1985-09-10
ES8602339A1 (es) 1985-11-16
KR900002214B1 (ko) 1990-04-04
US5050037A (en) 1991-09-17

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