ES8101657A1 - Mejoras introducidas en un metodo de electrodeposicion de - plata metalica. - Google Patents

Mejoras introducidas en un metodo de electrodeposicion de - plata metalica.

Info

Publication number
ES8101657A1
ES8101657A1 ES486834A ES486834A ES8101657A1 ES 8101657 A1 ES8101657 A1 ES 8101657A1 ES 486834 A ES486834 A ES 486834A ES 486834 A ES486834 A ES 486834A ES 8101657 A1 ES8101657 A1 ES 8101657A1
Authority
ES
Spain
Prior art keywords
silver
electrodeposition process
cyanide
silver electrodeposition
soluble silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES486834A
Other languages
English (en)
Other versions
ES486834A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxy Metal Industries Corp
Original Assignee
Oxy Metal Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxy Metal Industries Corp filed Critical Oxy Metal Industries Corp
Publication of ES8101657A1 publication Critical patent/ES8101657A1/es
Publication of ES486834A0 publication Critical patent/ES486834A0/es
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/46Electroplating: Baths therefor from solutions of silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

PROCEDIMIENTO DE ELECTRO-DEPOSICION DE PLATA METALICA Y COMPOSICION DE ELECTRO-DEPOSICION. LA COMPOSICION CONSTA DE UNA MEZCLA DE: A) UN COMPUESTO DE PLATA SOLUBLE; B) UN ELECTROLITO NO CIANURADO, Y C) UN FOSFATO ORGANICO. A ESTOS COMPUESTOS SE LES AÑADE AGUA, AJUSTANDO EL PH POR ENCIMA DE 7, AGREGANDO UN ACIDO DEBIL COMO CITRICO, FOSFORICO, O UNA BASE COMO HIDROXIDO POTASICO O CARBONATO POTASICO. LAS CONDICIONES DEL PROCEDIMIENTO SON: CONCENTRACION DEL COMPUESTO DE PLATA (PREFERENTEMENTE ARGENTOCIANURO POTASICO), DE 50-90 FR/L.; CONCENTRACION DEL COMPUESTO SOLUBLE NO CIANURADO (PREFERIBLEMENTE CITRATO POTASICO). 90/110 GR(L.; FOSFATO ORGANICO, 20-40 GR/L.; PH 7-10; TEMPERATURA 50-70GC. LA DENSIDAD DE CORRIENTE ES SUPERIOR A 800 AMP/PIE.CUADRADO. EL TIEMPO DE DEPOSICION DEPENDE DEL ESPESOR DESEADO.
ES486834A 1979-07-13 1979-12-12 Mejoras introducidas en un metodo de electrodeposicion de - plata metalica. Granted ES486834A0 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/057,471 US4265715A (en) 1979-07-13 1979-07-13 Silver electrodeposition process

Publications (2)

Publication Number Publication Date
ES8101657A1 true ES8101657A1 (es) 1980-12-16
ES486834A0 ES486834A0 (es) 1980-12-16

Family

ID=22010752

Family Applications (1)

Application Number Title Priority Date Filing Date
ES486834A Granted ES486834A0 (es) 1979-07-13 1979-12-12 Mejoras introducidas en un metodo de electrodeposicion de - plata metalica.

Country Status (12)

Country Link
US (1) US4265715A (es)
JP (1) JPS6056236B2 (es)
BE (1) BE879681A (es)
BR (1) BR8000086A (es)
CA (1) CA1149324A (es)
CH (1) CH643004A5 (es)
DE (1) DE2943395A1 (es)
ES (1) ES486834A0 (es)
FR (1) FR2461024A1 (es)
GB (1) GB2053280B (es)
HK (1) HK66386A (es)
NL (1) NL7907967A (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4428804A (en) 1980-11-10 1984-01-31 Omi International Corporation High speed bright silver electroplating bath and process
US4478691A (en) * 1981-10-13 1984-10-23 At&T Bell Laboratories Silver plating procedure
GB9425030D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
GB9425031D0 (en) * 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
US6905587B2 (en) 1996-03-22 2005-06-14 Ronald Redline Method for enhancing the solderability of a surface
US6544397B2 (en) 1996-03-22 2003-04-08 Ronald Redline Method for enhancing the solderability of a surface
USRE45842E1 (en) 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
CN1692182A (zh) * 2002-11-28 2005-11-02 新光电气工业株式会社 银电镀液
US20130023166A1 (en) * 2011-07-20 2013-01-24 Tyco Electronics Corporation Silver plated electrical contact

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2097630A (en) * 1935-10-17 1937-11-02 Du Pont Plating of cadmium
BE791401A (fr) * 1971-11-15 1973-05-14 Monsanto Co Compositions et procedes electrochimiques
NL7306732A (es) * 1972-05-17 1973-11-20
US3914162A (en) * 1973-06-25 1975-10-21 Monsanto Co Compositions and process for the electrodeposition of metals
GB1419613A (en) * 1974-06-13 1975-12-31 Lea Ronal Inc Cyanidefree electroplating baths

Also Published As

Publication number Publication date
DE2943395A1 (de) 1981-02-12
CA1149324A (en) 1983-07-05
NL7907967A (nl) 1981-01-15
BE879681A (fr) 1980-04-28
BR8000086A (pt) 1981-03-24
JPS6056236B2 (ja) 1985-12-09
HK66386A (en) 1986-09-18
JPS5613491A (en) 1981-02-09
GB2053280A (en) 1981-02-04
FR2461024A1 (fr) 1981-01-30
FR2461024B1 (es) 1985-04-12
CH643004A5 (de) 1984-05-15
ES486834A0 (es) 1980-12-16
US4265715A (en) 1981-05-05
GB2053280B (en) 1984-06-27

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