ES8401678A1 - Un sistema de pulverizacion catodica para magnetron. - Google Patents

Un sistema de pulverizacion catodica para magnetron.

Info

Publication number
ES8401678A1
ES8401678A1 ES520264A ES520264A ES8401678A1 ES 8401678 A1 ES8401678 A1 ES 8401678A1 ES 520264 A ES520264 A ES 520264A ES 520264 A ES520264 A ES 520264A ES 8401678 A1 ES8401678 A1 ES 8401678A1
Authority
ES
Spain
Prior art keywords
plate
backing plate
catch
channels
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES520264A
Other languages
English (en)
Other versions
ES520264A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of ES520264A0 publication Critical patent/ES520264A0/es
Publication of ES8401678A1 publication Critical patent/ES8401678A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Microwave Tubes (AREA)
  • Particle Accelerators (AREA)
  • Resistance Welding (AREA)
  • Coating By Spraying Or Casting (AREA)

Abstract

SISTEMA DE PULVERIZACION CATODICA PARA MAGNETRON. CONSISTE EN CONECTAR EL ANTICATODO (8) A UNA PLACA DE MATERIAL A PULVERIZAR, ALUMINIO DE 1 CM DE ESPESOR, CONTRA LA PLACA DE RESPALDO (13) PROPORCIONANDO ADEMAS, A LA PLACA DE RESPALDO, UNA CAPA DE MATERIAL DE SOLDADURA QUE SE ADHIERE REALMENTE A DICHA PLACA DE RESPALDO (13), NO ADHIRIENDOSE AL ANTICATODO (8). EL BORDE (9) DEL ANTICATODO (8) ESTA CONECTADO CONTRA EL BORDE (11) DE UNA ABERTURA (12) EN LA AMPOLLA (1), DE UNA MANERA ESTANCA A LOS GASES, COMPRENDIENDO DICHA PLACA DE RESPALDO UNA PLURALIDADDE CANALES (17) QUE SE ABREN A LA CARA DE CONTACTO DEL ANTICATODO CON LA PLACA DE RESPALDO, ESTANDO CONECTADA LA PLACA DE RESPALDO CONTRA EL ANTICATODO POR SUCCION A VACIO POR LA VIA DE DICHOS CANALES. SE REALIZA CON PLACAS DE FORMA CUADRADA O RECTANGULAR Y SE TRABAJA ENTRE 70 GC Y 100 GC PARA TEMPERATURA DE SOLDADURA. MEJORA LA TRANSMISION DE CALOR ENTRE LAS DOS PLACAS PARA LA FABRICACION DE VEHICULOS DE INFORMACION OPTICA.
ES520264A 1982-03-05 1983-03-03 Un sistema de pulverizacion catodica para magnetron. Expired ES8401678A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8200902A NL8200902A (nl) 1982-03-05 1982-03-05 Magnetron-kathodesputtersysteem.

Publications (2)

Publication Number Publication Date
ES520264A0 ES520264A0 (es) 1983-12-01
ES8401678A1 true ES8401678A1 (es) 1983-12-01

Family

ID=19839373

Family Applications (1)

Application Number Title Priority Date Filing Date
ES520264A Expired ES8401678A1 (es) 1982-03-05 1983-03-03 Un sistema de pulverizacion catodica para magnetron.

Country Status (9)

Country Link
US (1) US4392939A (es)
EP (1) EP0088463B1 (es)
JP (1) JPS58164783A (es)
AT (1) ATE22752T1 (es)
AU (1) AU560381B2 (es)
CA (1) CA1192318A (es)
DE (1) DE3366772D1 (es)
ES (1) ES8401678A1 (es)
NL (1) NL8200902A (es)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4657654A (en) * 1984-05-17 1987-04-14 Varian Associates, Inc. Targets for magnetron sputter device having separate confining magnetic fields to separate targets subject to separate discharges
US4595482A (en) * 1984-05-17 1986-06-17 Varian Associates, Inc. Apparatus for and the method of controlling magnetron sputter device having separate confining magnetic fields to separate targets subject to separate discharges
US4606806A (en) * 1984-05-17 1986-08-19 Varian Associates, Inc. Magnetron sputter device having planar and curved targets
US4569746A (en) * 1984-05-17 1986-02-11 Varian Associates, Inc. Magnetron sputter device using the same pole piece for coupling separate confining magnetic fields to separate targets subject to separate discharges
US5215639A (en) * 1984-10-09 1993-06-01 Genus, Inc. Composite sputtering target structures and process for producing such structures
US4597847A (en) * 1984-10-09 1986-07-01 Iodep, Inc. Non-magnetic sputtering target
JP2934711B2 (ja) * 1989-12-07 1999-08-16 カシオ計算機株式会社 スパッタ装置
KR950000906B1 (ko) * 1991-08-02 1995-02-03 니찌덴 아넬바 가부시기가이샤 스퍼터링장치
US5458759A (en) * 1991-08-02 1995-10-17 Anelva Corporation Magnetron sputtering cathode apparatus
US5374343A (en) * 1992-05-15 1994-12-20 Anelva Corporation Magnetron cathode assembly
US5286361A (en) * 1992-10-19 1994-02-15 Regents Of The University Of California Magnetically attached sputter targets
US5414588A (en) * 1993-09-20 1995-05-09 The Regents Of The University Of California High performance capacitors using nano-structure multilayer materials fabrication
US6033483A (en) * 1994-06-30 2000-03-07 Applied Materials, Inc. Electrically insulating sealing structure and its method of use in a high vacuum physical vapor deposition apparatus
EP0787819B1 (de) * 1996-01-31 1999-12-22 LEYBOLD MATERIALS GmbH Sputtertarget aus einer Zinn- oder Zinn-Basislegierung
EP0787818A1 (de) * 1996-01-31 1997-08-06 LEYBOLD MATERIALS GmbH Sputtertarget aus einer Zinn- oder Zinn-Basislegierung
JP2000133693A (ja) * 1998-08-19 2000-05-12 Shibaura Mechatronics Corp 真空装置用駆動機構および真空装置
JP3568845B2 (ja) * 1999-11-09 2004-09-22 株式会社日鉱マテリアルズ スパッタリングターゲット／バッキングプレート組立体の矯正方法及び同矯正装置
US20050145487A1 (en) * 2002-04-15 2005-07-07 Michael Geisler Coating installation
DE10216671A1 (de) * 2002-04-15 2003-12-18 Applied Films Gmbh & Co Kg Beschichtungsanlage
US20080067058A1 (en) * 2006-09-15 2008-03-20 Stimson Bradley O Monolithic target for flat panel application
KR100899355B1 (ko) * 2007-11-15 2009-05-27 한국과학기술연구원 플라스마 증착 장치 및 방법
KR20130017314A (ko) * 2011-08-10 2013-02-20 삼성디스플레이 주식회사 스퍼터링 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR846557A (fr) * 1938-04-14 1939-09-20 Procédé pour métalliser des articles métalliques par pulvérisation cathodique
US3616449A (en) * 1970-03-30 1971-10-26 Bendix Corp Sputtering anode
US4204936A (en) * 1979-03-29 1980-05-27 The Perkin-Elmer Corporation Method and apparatus for attaching a target to the cathode of a sputtering system
US4297190A (en) * 1979-05-14 1981-10-27 Western Electric Co., Inc. Method for removing heat from a workpiece during processing in a vacuum chamber
US4274476A (en) * 1979-05-14 1981-06-23 Western Electric Company, Inc. Method and apparatus for removing heat from a workpiece during processing in a vacuum chamber
US4272355A (en) * 1980-02-26 1981-06-09 International Business Machines Corporation Process of bonding sputtering targets to target electrodes
US4341810A (en) * 1981-08-27 1982-07-27 Dynagel Incorporated Gelled gelatin food product prepared from non-gelled aqueous gelatin compositions

Also Published As

Publication number Publication date
ATE22752T1 (de) 1986-10-15
ES520264A0 (es) 1983-12-01
EP0088463A1 (en) 1983-09-14
JPS58164783A (ja) 1983-09-29
DE3366772D1 (en) 1986-11-13
NL8200902A (nl) 1983-10-03
CA1192318A (en) 1985-08-20
JPH0214425B2 (es) 1990-04-09
EP0088463B1 (en) 1986-10-08
AU1203283A (en) 1983-09-08
US4392939A (en) 1983-07-12
AU560381B2 (en) 1987-04-02

Similar Documents

Publication Publication Date Title
ES520264A0 (es) Un sistema de pulverizacion catodica para magnetron.
IT8122598A0 (it) Valvola di congelamento avente mezzi multipli di riscaldamento e raffredamento.
BR9810299A (pt) Processos para a produção de um sistema de camadas finas com uma camada de prata transparente e para o revestimento de vidro, e, painéis de vidro e de vidro duplo.
NO159140C (no) Fordamper og anvendelse derav.
ES8305251A1 (es) Procedimiento para la union de una primera lamina vitrea a una segunda lamina por medio de un cuerpo intermedio de material adhesivo.
AU568536B2 (en) Absorption heat with rotating plate heat exchangers
CA1002112A (en) Corrosion inhibitor system for alkaline aluminum cells
ES2091800T3 (es) Pelicula de polipropileno sellable por calor en un lado.
CA994709A (en) Apparatus for the sputtering deposition of thin films with labyrinth heat exchanger
AU565523B2 (en) Heat pump having rotating plate heat exchangers
GB1205043A (en) Adhesive signs
SE8207195L (sv) Hogkorrosionsbestendigt reflexionsskiktsystem pa substrat
IT977754B (it) Procedimento e dispositivo per pro teggere la superficie di lastre di vetro accatastate per il loro magaz zinaggio o il loro trasporto
JPS55122242A (en) Substrate for optical disc
FR2225068A5 (en) Liquid crystal display cell - thin liquid layer enclosed in channels in support plate
NO903798L (no) Fremgangsmaate for fremstilling av plate-, folie- eller baandformede materialer, samt fremgangsmaate for fremstilling av sensibiliserte plantrykkplater eller offsetplater.
JPS5767262A (en) Gas discharge display panel
AU116306B2 (en) Improvements in or relating to blocking layer cells comprising one or more cooling plates
CA990060A (en) Corrosion inhibitor composition for engine cooling systems
JPS5391083A (en) Sputtering apparatus
AU259041A (en) Improvements in or relating to blocking layer cells comprising one or more cooling plates
ES2116909B1 (es) Nueva superficie de recubrimiento envolvente, aplicable en tanques y similares.
CA806843A (en) Semiconductor assemblies including semiconductor units with cooling plates therefor
JPS5768807A (en) Quartz double refraction plate
JPS57135918A (en) Liquid crystal display panel

Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19970519