FR1465435A - Procédé de fabrication de composants électroniques à couches minces et de circuits intégrés par vaporisation au moyen de laser et appareil correspondant - Google Patents

Procédé de fabrication de composants électroniques à couches minces et de circuits intégrés par vaporisation au moyen de laser et appareil correspondant

Info

Publication number
FR1465435A
FR1465435A FR29685A FR29685A FR1465435A FR 1465435 A FR1465435 A FR 1465435A FR 29685 A FR29685 A FR 29685A FR 29685 A FR29685 A FR 29685A FR 1465435 A FR1465435 A FR 1465435A
Authority
FR
France
Prior art keywords
vaporization
laser
thin
manufacturing process
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR29685A
Other languages
English (en)
Inventor
Otto Deutschbein
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to FR29685A priority Critical patent/FR1465435A/fr
Application granted granted Critical
Publication of FR1465435A publication Critical patent/FR1465435A/fr
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
    • B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
    • B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure in vacuum
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
FR29685A 1965-08-27 1965-08-27 Procédé de fabrication de composants électroniques à couches minces et de circuits intégrés par vaporisation au moyen de laser et appareil correspondant Expired FR1465435A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR29685A FR1465435A (fr) 1965-08-27 1965-08-27 Procédé de fabrication de composants électroniques à couches minces et de circuits intégrés par vaporisation au moyen de laser et appareil correspondant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR29685A FR1465435A (fr) 1965-08-27 1965-08-27 Procédé de fabrication de composants électroniques à couches minces et de circuits intégrés par vaporisation au moyen de laser et appareil correspondant

Publications (1)

Publication Number Publication Date
FR1465435A true FR1465435A (fr) 1967-01-13

Family

ID=8587373

Family Applications (1)

Application Number Title Priority Date Filing Date
FR29685A Expired FR1465435A (fr) 1965-08-27 1965-08-27 Procédé de fabrication de composants électroniques à couches minces et de circuits intégrés par vaporisation au moyen de laser et appareil correspondant

Country Status (1)

Country Link
FR (1) FR1465435A (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT381122B (de) * 1974-11-29 1986-08-25 Lohja Ab Oy Verfahren zum zuechten von verbindungs -duennschichten
EP2644308A1 (fr) * 2012-03-31 2013-10-02 Fei Company Système de protection de composants optiques de lumière pendant une ablation par laser
US9216475B2 (en) 2012-03-31 2015-12-22 Fei Company System for protecting light optical components during laser ablation
EP2852968A4 (fr) * 2012-05-22 2016-02-24 Arctic Ip Invest Ab Procédé de revêtement et de production de matériau

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT381122B (de) * 1974-11-29 1986-08-25 Lohja Ab Oy Verfahren zum zuechten von verbindungs -duennschichten
EP2644308A1 (fr) * 2012-03-31 2013-10-02 Fei Company Système de protection de composants optiques de lumière pendant une ablation par laser
CN103358035A (zh) * 2012-03-31 2013-10-23 Fei公司 用于在激光烧蚀期间保护光线光学组件的系统
US9216475B2 (en) 2012-03-31 2015-12-22 Fei Company System for protecting light optical components during laser ablation
CN103358035B (zh) * 2012-03-31 2017-07-18 Fei公司 用于在激光烧蚀期间保护光线光学组件的系统
EP2852968A4 (fr) * 2012-05-22 2016-02-24 Arctic Ip Invest Ab Procédé de revêtement et de production de matériau

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