FR1504726A - Perfectionnements aux procédés de fabrication de boîtiers pour dispositifs semiconducteurs - Google Patents

Perfectionnements aux procédés de fabrication de boîtiers pour dispositifs semiconducteurs

Info

Publication number
FR1504726A
FR1504726A FR81498A FR81498A FR1504726A FR 1504726 A FR1504726 A FR 1504726A FR 81498 A FR81498 A FR 81498A FR 81498 A FR81498 A FR 81498A FR 1504726 A FR1504726 A FR 1504726A
Authority
FR
France
Prior art keywords
packages
semiconductor devices
manufacturing processes
processes
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR81498A
Other languages
English (en)
Inventor
Henri Thouvenin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RADIOTECHNIQUE COPRIM RTC
Original Assignee
RADIOTECHNIQUE COPRIM RTC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RADIOTECHNIQUE COPRIM RTC filed Critical RADIOTECHNIQUE COPRIM RTC
Priority to FR81498A priority Critical patent/FR1504726A/fr
Application granted granted Critical
Publication of FR1504726A publication Critical patent/FR1504726A/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01Manufacture or treatment
    • H10W70/04Manufacture or treatment of leadframes
    • H10W70/048Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/15Containers comprising an insulating or insulated base
    • H10W76/157Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/551Materials of bond wires
    • H10W72/552Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
FR81498A 1966-10-25 1966-10-25 Perfectionnements aux procédés de fabrication de boîtiers pour dispositifs semiconducteurs Expired FR1504726A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR81498A FR1504726A (fr) 1966-10-25 1966-10-25 Perfectionnements aux procédés de fabrication de boîtiers pour dispositifs semiconducteurs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR81498A FR1504726A (fr) 1966-10-25 1966-10-25 Perfectionnements aux procédés de fabrication de boîtiers pour dispositifs semiconducteurs

Publications (1)

Publication Number Publication Date
FR1504726A true FR1504726A (fr) 1967-12-08

Family

ID=8619895

Family Applications (1)

Application Number Title Priority Date Filing Date
FR81498A Expired FR1504726A (fr) 1966-10-25 1966-10-25 Perfectionnements aux procédés de fabrication de boîtiers pour dispositifs semiconducteurs

Country Status (1)

Country Link
FR (1) FR1504726A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2118154A1 (fr) * 1970-12-17 1972-07-28 Philips Nv

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2118154A1 (fr) * 1970-12-17 1972-07-28 Philips Nv

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