FR1534329A - Procédé de montage de circuits intégrés - Google Patents

Procédé de montage de circuits intégrés

Info

Publication number
FR1534329A
FR1534329A FR117930A FR117930A FR1534329A FR 1534329 A FR1534329 A FR 1534329A FR 117930 A FR117930 A FR 117930A FR 117930 A FR117930 A FR 117930A FR 1534329 A FR1534329 A FR 1534329A
Authority
FR
France
Prior art keywords
integrated circuit
assembly process
circuit assembly
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR117930A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Signetics Corp
Original Assignee
Signetics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Signetics Corp filed Critical Signetics Corp
Priority to FR117930A priority Critical patent/FR1534329A/fr
Application granted granted Critical
Publication of FR1534329A publication Critical patent/FR1534329A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/124—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed the encapsulations having cavities other than that occupied by chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
FR117930A 1966-08-16 1967-08-16 Procédé de montage de circuits intégrés Expired FR1534329A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR117930A FR1534329A (fr) 1966-08-16 1967-08-16 Procédé de montage de circuits intégrés

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US57272066A 1966-08-16 1966-08-16
US61897367A 1967-02-27 1967-02-27
FR117930A FR1534329A (fr) 1966-08-16 1967-08-16 Procédé de montage de circuits intégrés

Publications (1)

Publication Number Publication Date
FR1534329A true FR1534329A (fr) 1968-07-26

Family

ID=27244430

Family Applications (1)

Application Number Title Priority Date Filing Date
FR117930A Expired FR1534329A (fr) 1966-08-16 1967-08-16 Procédé de montage de circuits intégrés

Country Status (1)

Country Link
FR (1) FR1534329A (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2088564A1 (fr) * 1970-05-14 1972-01-07 Siemens Ag
FR2156343A1 (fr) * 1971-10-14 1973-05-25 Philips Nv
FR2196570A1 (fr) * 1972-06-14 1974-03-15 Ibm
DE2554965A1 (de) * 1974-12-20 1976-07-01 Ibm Elektrische kompaktschaltungsanordnung
FR2494908A1 (fr) * 1980-11-21 1982-05-28 Gao Ges Automation Org Element support pour modules de circuit integre
FR2535110A1 (fr) * 1982-10-20 1984-04-27 Radiotechnique Compelec Procede d'encapsulation d'un composant semi-conducteur dans un circuit electronique realise sur substrat et application aux circuits integres rapides
EP0148083A3 (en) * 1983-12-23 1986-10-08 Fujitsu Limited Ultra-high speed semiconductor integrated circuit device having a multi-layered wiring board
EP0526147A3 (en) * 1991-07-25 1993-08-18 Nec Corporation Film-carrier type semiconductor device and process for fabricating the same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2088564A1 (fr) * 1970-05-14 1972-01-07 Siemens Ag
FR2156343A1 (fr) * 1971-10-14 1973-05-25 Philips Nv
FR2196570A1 (fr) * 1972-06-14 1974-03-15 Ibm
DE2554965A1 (de) * 1974-12-20 1976-07-01 Ibm Elektrische kompaktschaltungsanordnung
FR2494908A1 (fr) * 1980-11-21 1982-05-28 Gao Ges Automation Org Element support pour modules de circuit integre
FR2535110A1 (fr) * 1982-10-20 1984-04-27 Radiotechnique Compelec Procede d'encapsulation d'un composant semi-conducteur dans un circuit electronique realise sur substrat et application aux circuits integres rapides
EP0148083A3 (en) * 1983-12-23 1986-10-08 Fujitsu Limited Ultra-high speed semiconductor integrated circuit device having a multi-layered wiring board
US4751482A (en) * 1983-12-23 1988-06-14 Fujitsu Limited Semiconductor integrated circuit device having a multi-layered wiring board for ultra high speed connection
EP0526147A3 (en) * 1991-07-25 1993-08-18 Nec Corporation Film-carrier type semiconductor device and process for fabricating the same

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