FR2008003A1 - - Google Patents

Info

Publication number
FR2008003A1
FR2008003A1 FR6914646A FR6914646A FR2008003A1 FR 2008003 A1 FR2008003 A1 FR 2008003A1 FR 6914646 A FR6914646 A FR 6914646A FR 6914646 A FR6914646 A FR 6914646A FR 2008003 A1 FR2008003 A1 FR 2008003A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR6914646A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
ITT Inc
Original Assignee
Deutsche ITT Industries GmbH
ITT Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche ITT Industries GmbH, ITT Industries Inc filed Critical Deutsche ITT Industries GmbH
Publication of FR2008003A1 publication Critical patent/FR2008003A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Led Device Packages (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FR6914646A 1968-05-07 1969-05-07 Withdrawn FR2008003A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2147068A GB1152809A (en) 1968-05-07 1968-05-07 Electric Circuit Assembly

Publications (1)

Publication Number Publication Date
FR2008003A1 true FR2008003A1 (fr) 1970-01-16

Family

ID=10163492

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6914646A Withdrawn FR2008003A1 (fr) 1968-05-07 1969-05-07

Country Status (4)

Country Link
US (1) US3562592A (fr)
DE (1) DE1922654C3 (fr)
FR (1) FR2008003A1 (fr)
GB (1) GB1152809A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3125877A1 (fr) 2021-07-30 2023-02-03 Lynred Procede de realisation d’un micro-bolometre d’imagerie infrarouge aveugle et micro-bolometre associe

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE755950A (fr) * 1969-09-11 1971-03-09 Philips Nv Procede permettant d'etablir des liaisons electriques entre desemplacements de contact d'un corps semiconducteur et des conducteurs d'alimentation
NL7108092A (fr) * 1970-06-18 1971-12-21
US3995310A (en) * 1974-12-23 1976-11-30 General Electric Company Semiconductor assembly including mounting plate with recessed periphery
US4254445A (en) * 1979-05-07 1981-03-03 International Business Machines Corporation Discretionary fly wire chip interconnection
US4237522A (en) * 1979-06-29 1980-12-02 International Business Machines Corporation Chip package with high capacitance, stacked vlsi/power sheets extending through slots in substrate
US4514799A (en) * 1981-02-24 1985-04-30 Bell & Howell Company Bus system architecture and microprocessor system
US4419818A (en) * 1981-10-26 1983-12-13 Amp Incorporated Method for manufacturing substrate with selectively trimmable resistors between signal leads and ground structure
US4580193A (en) * 1985-01-14 1986-04-01 International Business Machines Corporation Chip to board bus connection
US4774634A (en) * 1986-01-21 1988-09-27 Key Tronic Corporation Printed circuit board assembly
JPH03122578U (fr) * 1990-03-26 1991-12-13
DE202011005085U1 (de) * 2011-04-09 2014-06-06 Kiekert Ag Kraftfahrzeugtürschlossgehäuse

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312871A (en) * 1964-12-23 1967-04-04 Ibm Interconnection arrangement for integrated circuits
US3372310A (en) * 1965-04-30 1968-03-05 Radiation Inc Universal modular packages for integrated circuits
US3496419A (en) * 1967-04-25 1970-02-17 J R Andresen Enterprises Inc Printed circuit breadboard
US3474297A (en) * 1967-06-30 1969-10-21 Texas Instruments Inc Interconnection system for complex semiconductor arrays
US3501582A (en) * 1968-04-18 1970-03-17 Burroughs Corp Electrical assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3125877A1 (fr) 2021-07-30 2023-02-03 Lynred Procede de realisation d’un micro-bolometre d’imagerie infrarouge aveugle et micro-bolometre associe

Also Published As

Publication number Publication date
DE1922654A1 (de) 1970-01-29
DE1922654B2 (de) 1978-08-03
DE1922654C3 (de) 1979-04-12
US3562592A (en) 1971-02-09
GB1152809A (en) 1969-05-21

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Legal Events

Date Code Title Description
ST Notification of lapse