FR2019192A1 - - Google Patents

Info

Publication number
FR2019192A1
FR2019192A1 FR6933106A FR6933106A FR2019192A1 FR 2019192 A1 FR2019192 A1 FR 2019192A1 FR 6933106 A FR6933106 A FR 6933106A FR 6933106 A FR6933106 A FR 6933106A FR 2019192 A1 FR2019192 A1 FR 2019192A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR6933106A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of FR2019192A1 publication Critical patent/FR2019192A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N80/00—Bulk negative-resistance effect devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
FR6933106A 1968-09-30 1969-09-29 Withdrawn FR2019192A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681789063 DE1789063A1 (de) 1968-09-30 1968-09-30 Traeger fuer Halbleiterbauelemente

Publications (1)

Publication Number Publication Date
FR2019192A1 true FR2019192A1 (fr) 1970-06-26

Family

ID=5706785

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6933106A Withdrawn FR2019192A1 (fr) 1968-09-30 1969-09-29

Country Status (8)

Country Link
US (1) US3611065A (fr)
AT (1) AT323253B (fr)
CH (1) CH499877A (fr)
DE (1) DE1789063A1 (fr)
FR (1) FR2019192A1 (fr)
GB (1) GB1242660A (fr)
NL (1) NL6913107A (fr)
SE (1) SE364848B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1102512S1 (en) 2023-01-10 2025-11-18 Luxottica S.R.L. Eyeglasses with paraboloid lenses

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS546787A (en) * 1977-06-17 1979-01-19 Matsushita Electric Ind Co Ltd Luminous element
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
GB2135521A (en) * 1983-02-16 1984-08-30 Ferranti Plc Printed circuit boards
US4685987A (en) * 1983-09-02 1987-08-11 The Bergquist Company Method of preparing interfacings of heat sinks with electrical devices
US4916515A (en) * 1985-06-03 1990-04-10 Levi Clifford A Microwave circuit integrating
US5596231A (en) * 1991-08-05 1997-01-21 Asat, Limited High power dissipation plastic encapsulated package for integrated circuit die
US5700715A (en) * 1994-06-14 1997-12-23 Lsi Logic Corporation Process for mounting a semiconductor device to a circuit substrate
US5679457A (en) * 1995-05-19 1997-10-21 The Bergquist Company Thermally conductive interface for electronic devices
US6090484A (en) * 1995-05-19 2000-07-18 The Bergquist Company Thermally conductive filled polymer composites for mounting electronic devices and method of application
SG59997A1 (en) * 1995-06-07 1999-02-22 Ibm Apparatus and process for improved die adhesion to organic chip carries
GB2334633B (en) * 1998-02-21 2002-09-25 Mitel Corp Low leakage electrostatic discharge protection system
US6486561B1 (en) * 2000-09-12 2002-11-26 Luminary Logic, Ltd. Semiconductor light emitting element formed on a clear or translucent substrate

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3414968A (en) * 1965-02-23 1968-12-10 Solitron Devices Method of assembly of power transistors
US3506886A (en) * 1965-03-08 1970-04-14 Itt High power transistor assembly
US3479570A (en) * 1966-06-14 1969-11-18 Rca Corp Encapsulation and connection structure for high power and high frequency semiconductor devices
US3489956A (en) * 1966-09-30 1970-01-13 Nippon Electric Co Semiconductor device container
GB1181459A (en) * 1966-09-30 1970-02-18 Nippon Electric Co Improvements in Semiconductor Structures
US3471923A (en) * 1966-12-09 1969-10-14 Rca Corp Method of making diode arrays
JPS4697Y1 (fr) * 1967-03-09 1971-01-06
US3469017A (en) * 1967-12-12 1969-09-23 Rca Corp Encapsulated semiconductor device having internal shielding
US3478161A (en) * 1968-03-13 1969-11-11 Rca Corp Strip-line power transistor package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1102512S1 (en) 2023-01-10 2025-11-18 Luxottica S.R.L. Eyeglasses with paraboloid lenses

Also Published As

Publication number Publication date
AT323253B (de) 1975-07-10
GB1242660A (en) 1971-08-11
DE1789063A1 (de) 1971-12-30
NL6913107A (fr) 1970-04-01
US3611065A (en) 1971-10-05
CH499877A (de) 1970-11-30
SE364848B (fr) 1974-03-04

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Legal Events

Date Code Title Description
ST Notification of lapse