FR2072110B1 - - Google Patents

Info

Publication number
FR2072110B1
FR2072110B1 FR7043235A FR7043235A FR2072110B1 FR 2072110 B1 FR2072110 B1 FR 2072110B1 FR 7043235 A FR7043235 A FR 7043235A FR 7043235 A FR7043235 A FR 7043235A FR 2072110 B1 FR2072110 B1 FR 2072110B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7043235A
Other languages
French (fr)
Other versions
FR2072110A1 (2
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2072110A1 publication Critical patent/FR2072110A1/fr
Application granted granted Critical
Publication of FR2072110B1 publication Critical patent/FR2072110B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01365—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/903—Metal to nonmetal
FR7043235A 1969-12-30 1970-11-26 Expired FR2072110B1 (2)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US88911269A 1969-12-30 1969-12-30

Publications (2)

Publication Number Publication Date
FR2072110A1 FR2072110A1 (2) 1971-09-24
FR2072110B1 true FR2072110B1 (2) 1974-03-22

Family

ID=25394526

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7043235A Expired FR2072110B1 (2) 1969-12-30 1970-11-26

Country Status (5)

Country Link
US (1) US3677853A (2)
JP (1) JPS4817739B1 (2)
DE (1) DE2060264A1 (2)
FR (1) FR2072110B1 (2)
GB (1) GB1267320A (2)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49142843U (2) * 1973-04-04 1974-12-10
JPS5029634U (2) * 1973-07-11 1975-04-03
JPS5039241U (2) * 1973-08-08 1975-04-22
US3916506A (en) * 1973-10-18 1975-11-04 Mallory Composites Method of conforming a flexible self-supporting means to the surface contour of a substrate
JPS5086444U (2) * 1973-12-12 1975-07-23
JPS5121249A (ja) * 1974-08-13 1976-02-20 Daikin Ind Ltd Paneruhiita
JPS5121248A (ja) * 1974-08-13 1976-02-20 Daikin Ind Ltd Paneruhiita
US4177098A (en) * 1976-02-10 1979-12-04 Usm Corporation Method for stiffening flexible workpieces
GB8410341D0 (en) * 1984-04-19 1984-05-31 Coopervision Optics Blocking machines
JP3537688B2 (ja) * 1998-11-24 2004-06-14 富士通株式会社 磁気ヘッドの加工方法
US8808870B2 (en) 2011-11-28 2014-08-19 Kennametal Inc. Functionally graded coating
US9862029B2 (en) 2013-03-15 2018-01-09 Kennametal Inc Methods of making metal matrix composite and alloy articles
US9346101B2 (en) 2013-03-15 2016-05-24 Kennametal Inc. Cladded articles and methods of making the same
US10221702B2 (en) 2015-02-23 2019-03-05 Kennametal Inc. Imparting high-temperature wear resistance to turbine blade Z-notches
US11117208B2 (en) 2017-03-21 2021-09-14 Kennametal Inc. Imparting wear resistance to superalloy articles

Also Published As

Publication number Publication date
GB1267320A (en) 1972-03-15
JPS4817739B1 (2) 1973-05-31
DE2060264A1 (de) 1971-07-01
US3677853A (en) 1972-07-18
FR2072110A1 (2) 1971-09-24

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Legal Events

Date Code Title Description
ST Notification of lapse