FR2083400A1 - - Google Patents

Info

Publication number
FR2083400A1
FR2083400A1 FR7103759A FR7103759A FR2083400A1 FR 2083400 A1 FR2083400 A1 FR 2083400A1 FR 7103759 A FR7103759 A FR 7103759A FR 7103759 A FR7103759 A FR 7103759A FR 2083400 A1 FR2083400 A1 FR 2083400A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7103759A
Other languages
French (fr)
Other versions
FR2083400B1 (da
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PFIZER
Pfizer Inc
Original Assignee
PFIZER
Pfizer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PFIZER, Pfizer Inc filed Critical PFIZER
Publication of FR2083400A1 publication Critical patent/FR2083400A1/fr
Application granted granted Critical
Publication of FR2083400B1 publication Critical patent/FR2083400B1/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
FR7103759A 1970-03-19 1971-02-04 Expired FR2083400B1 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2121670A 1970-03-19 1970-03-19

Publications (2)

Publication Number Publication Date
FR2083400A1 true FR2083400A1 (da) 1971-12-17
FR2083400B1 FR2083400B1 (da) 1973-12-28

Family

ID=21803010

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7103759A Expired FR2083400B1 (da) 1970-03-19 1971-02-04

Country Status (5)

Country Link
US (1) US3684666A (da)
BE (1) BE762452A (da)
DE (1) DE2104873A1 (da)
FR (1) FR2083400B1 (da)
GB (1) GB1320373A (da)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1897973A1 (en) * 2006-09-07 2008-03-12 Enthone, Inc. Deposition of conductive polymer and metallization of non-conductive substrates

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4659540A (en) * 1979-11-26 1987-04-21 General Electric Company Composite construction for nuclear fuel containers
US4445942A (en) * 1979-11-26 1984-05-01 General Electric Company Method for forming nuclear fuel containers of a composite construction and the product thereof
US5314756A (en) * 1991-11-27 1994-05-24 Hitachi Metals, Ltd. Permanent magnet of rare-earth-element/transition-metal system having improved corrosion resistance and manufacturing method thereof
TW593731B (en) * 1998-03-20 2004-06-21 Semitool Inc Apparatus for applying a metal structure to a workpiece
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6656606B1 (en) 2000-08-17 2003-12-02 The Westaim Corporation Electroplated aluminum parts and process of production
US8366901B2 (en) * 2006-09-07 2013-02-05 Enthone Inc. Deposition of conductive polymer and metallization of non-conductive substrates
US9714474B2 (en) 2010-04-06 2017-07-25 Tel Nexx, Inc. Seed layer deposition in microscale features
DE102016113641A1 (de) 2016-07-25 2018-01-25 Christian-Albrechts-Universität Zu Kiel Aluminium-Kupfer-Konnektor aufweisend eine Heterostruktur und Verfahren zur Herstellung der Heterostruktur
WO2023114337A1 (en) 2021-12-14 2023-06-22 Earth Science Laboratories, Inc. Method to coat metals onto surfaces

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2411674A (en) * 1943-03-04 1946-11-26 Little Inc A Art of electrodeposition of copper
US2871172A (en) * 1955-11-02 1959-01-27 James T N Atkinson Electro-plating of metals
FR1357843A (fr) * 1962-03-06 1964-04-10 Pittsburgh Plate Glass Co Surfaces métalliques ayant des qualités d'adhérence perfectionnées

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2411674A (en) * 1943-03-04 1946-11-26 Little Inc A Art of electrodeposition of copper
US2871172A (en) * 1955-11-02 1959-01-27 James T N Atkinson Electro-plating of metals
FR1357843A (fr) * 1962-03-06 1964-04-10 Pittsburgh Plate Glass Co Surfaces métalliques ayant des qualités d'adhérence perfectionnées

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1897973A1 (en) * 2006-09-07 2008-03-12 Enthone, Inc. Deposition of conductive polymer and metallization of non-conductive substrates

Also Published As

Publication number Publication date
FR2083400B1 (da) 1973-12-28
US3684666A (en) 1972-08-15
GB1320373A (en) 1973-06-13
DE2104873A1 (de) 1971-10-14
BE762452A (fr) 1971-08-03

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Legal Events

Date Code Title Description
ST Notification of lapse