FR2117026A5 - - Google Patents

Info

Publication number
FR2117026A5
FR2117026A5 FR7128037A FR7128037A FR2117026A5 FR 2117026 A5 FR2117026 A5 FR 2117026A5 FR 7128037 A FR7128037 A FR 7128037A FR 7128037 A FR7128037 A FR 7128037A FR 2117026 A5 FR2117026 A5 FR 2117026A5
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7128037A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEMICONDUCTOR ELECTRONIC
Original Assignee
SEMICONDUCTOR ELECTRONIC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEMICONDUCTOR ELECTRONIC filed Critical SEMICONDUCTOR ELECTRONIC
Application granted granted Critical
Publication of FR2117026A5 publication Critical patent/FR2117026A5/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
FR7128037A 1970-12-03 1971-07-30 Expired FR2117026A5 (2)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US9466970A 1970-12-03 1970-12-03

Publications (1)

Publication Number Publication Date
FR2117026A5 true FR2117026A5 (2) 1972-07-21

Family

ID=22246470

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7128037A Expired FR2117026A5 (2) 1970-12-03 1971-07-30

Country Status (1)

Country Link
FR (1) FR2117026A5 (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0021139A3 (en) * 1979-06-29 1983-08-17 International Business Machines Corporation Process for producing a solder connection between a semiconductor device and a carrier substrate, and a semiconductor device made by such method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0021139A3 (en) * 1979-06-29 1983-08-17 International Business Machines Corporation Process for producing a solder connection between a semiconductor device and a carrier substrate, and a semiconductor device made by such method

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Legal Events

Date Code Title Description
ST Notification of lapse