FR2204886B3 - - Google Patents

Info

Publication number: FR2204886B3
Authority: FR; France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

FR7338058A

Other versions

FR2204886A1 (fr

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Esec Sales SA

Original Assignee

Esec Sales SA

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1972-10-26

Filing date

1973-10-25

Publication date

1976-09-17

1973-10-25 Application filed by Esec Sales SA filed Critical Esec Sales SA

1974-05-24 Publication of FR2204886A1 publication Critical patent/FR2204886A1/fr

1976-09-17 Application granted granted Critical

1976-09-17 Publication of FR2204886B3 publication Critical patent/FR2204886B3/fr

Status Expired legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01551—Changing the shapes of bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07168—Means for storing or moving the material for the connector
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07531—Techniques
- H10W72/07532—Compression bonding, e.g. thermocompression bonding
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07531—Techniques
- H10W72/07532—Compression bonding, e.g. thermocompression bonding
- H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

FR7338058A 1972-10-26 1973-10-25 Expired FR2204886B3 (fr)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
CH1563572A CH558983A (de)	1972-10-26	1972-10-26	Verfahren zum fortlaufenden herstellen mindestens einer drahtverbindung in halbleiter-bauteilen und vorrichtung zur ausfuehrung des verfahrens.
GB1838075A GB1464687A (en)	1972-10-26	1975-05-02	Connections for semiconductor components

Publications (2)

Publication Number	Publication Date
FR2204886A1 FR2204886A1 (fr)	1974-05-24
FR2204886B3 true FR2204886B3 (fr)	1976-09-17

Family

ID=62527839

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
FR7338058A Expired FR2204886B3 (fr)	1972-10-26	1973-10-25

Country Status (4)

Country	Link
CH (1)	CH558983A (fr)
DE (1)	DE2353100A1 (fr)
FR (1)	FR2204886B3 (fr)
GB (2)	GB1430666A (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2608250C3 (de) *	1976-02-28	1985-06-05	Telefunken electronic GmbH, 7100 Heilbronn	Verfahren zum Thermokompressions-Verbinden von auf Halbleiterkörpern befindlichen Metall-Anschlußkontakten mit zugeordneten Gehäuseanschlußteilen und Vorrichtung zur Durchführung des Verfahrens
JP3459291B2 (ja) *	1993-09-21	2003-10-20	ローム株式会社	半導体チップを備えた電子部品
US5644281A (en) *	1992-04-07	1997-07-01	Rohm Co., Ltd.	Electronic component incorporating solder fuse wire
US5295619A (en) *	1992-05-22	1994-03-22	Rohm Co., Ltd.	Method and apparatus for performing wire bonding by using solder wire
JP3248778B2 (ja) *	1993-05-21	2002-01-21	ローム株式会社	半田ワイヤーにボール部を形成する方法

1972
- 1972-10-26 CH CH1563572A patent/CH558983A/xx not_active IP Right Cessation
1973
- 1973-10-23 DE DE19732353100 patent/DE2353100A1/de active Pending
- 1973-10-24 GB GB4951873A patent/GB1430666A/en not_active Expired
- 1973-10-25 FR FR7338058A patent/FR2204886B3/fr not_active Expired
1975
- 1975-05-02 GB GB1838075A patent/GB1464687A/en not_active Expired

Also Published As

Publication number	Publication date
DE2353100A1 (de)	1974-05-09
GB1430666A (en)	1976-03-31
GB1464687A (en)	1977-02-16
FR2204886A1 (fr)	1974-05-24
CH558983A (de)	1975-02-14

Publication	Publication Date	Title
FR2184621B3 (fr)	1976-07-23
FR2204886A1 (fr)	1974-05-24
JPS5346473Y2 (fr)	1978-11-07
JPS4984558A (fr)	1974-08-14
JPS5715128B2 (fr)	1982-03-29
JPS525748B2 (fr)	1977-02-16
JPS491100U (fr)	1974-01-08
JPS5222679Y2 (fr)	1977-05-24
JPS4950173A (fr)	1974-05-15
JPS4926674U (fr)	1974-03-07
JPS4980630U (fr)	1974-07-12
JPS4899028U (fr)	1973-11-22
AU480295A (fr)	1974-05-02
CH590341A5 (fr)	1977-08-15
CH594598A5 (fr)	1978-01-13
CH568307A5 (fr)	1975-10-31
CH568124A5 (fr)	1975-10-31
CH1291872A4 (fr)	1975-06-13
BG17866A1 (fr)	1974-03-05
CH566534A5 (fr)	1975-09-15
CH572344A5 (fr)	1976-02-13
CH566258A5 (fr)	1975-09-15
CH585547A5 (fr)	1977-03-15
CH572951A5 (fr)	1976-02-27
CH587602A5 (fr)	1977-05-13