FR2280977A1 - Procede d'obtention d'une couche de protection stabilisatrice de surface dans des composants a semi-conducteur - Google Patents

Procede d'obtention d'une couche de protection stabilisatrice de surface dans des composants a semi-conducteur

Info

Publication number: FR2280977A1
Authority: FR; France
Prior art keywords: obtaining; protective layer; semiconductor components; surface stabilizing; stabilizing protective
Prior art date: 1974-07-30
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

FR7508680A

Other languages

English (en)

French (fr)

Other versions

FR2280977B1 (2

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Semikron GmbH and Co KG

Original Assignee

Semikron GmbH and Co KG

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1974-07-30

Filing date

1975-03-20

Publication date

1976-02-27

1975-03-20 Application filed by Semikron GmbH and Co KG filed Critical Semikron GmbH and Co KG

1976-02-27 Publication of FR2280977A1 publication Critical patent/FR2280977A1/fr

1979-03-02 Application granted granted Critical

1979-03-02 Publication of FR2280977B1 publication Critical patent/FR2280977B1/fr

Status Granted legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/976—Temporary protective layer
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina

FR7508680A 1974-07-30 1975-03-20 Procede d'obtention d'une couche de protection stabilisatrice de surface dans des composants a semi-conducteur Granted FR2280977A1 (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE2436600A DE2436600A1 (de)	1974-07-30	1974-07-30	Verfahren zur erzielung einer oberflaechenstabilisierenden schutzschicht bei halbleiterbauelementen

Publications (2)

Publication Number	Publication Date
FR2280977A1 true FR2280977A1 (fr)	1976-02-27
FR2280977B1 FR2280977B1 (2)	1979-03-02

Family

ID=5921905

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
FR7508680A Granted FR2280977A1 (fr)	1974-07-30	1975-03-20	Procede d'obtention d'une couche de protection stabilisatrice de surface dans des composants a semi-conducteur

Country Status (11)

Country	Link
US (1)	US3947303A (2)
JP (1)	JPS5429345B2 (2)
AR (1)	AR202062A1 (2)
BR (1)	BR7504290A (2)
CH (1)	CH590557A5 (2)
DE (1)	DE2436600A1 (2)
ES (1)	ES435343A1 (2)
FR (1)	FR2280977A1 (2)
GB (1)	GB1509227A (2)
IT (1)	IT1037271B (2)
SE (1)	SE397902B (2)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4624724A (en) *	1985-01-17	1986-11-25	General Electric Company	Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base
US4680072A (en) *	1985-04-30	1987-07-14	Wedco Inc.	Method and apparatus for producing multilayered plastic containing sheets
DE10029035C1 (de) *	2000-06-13	2002-02-28	Infineon Technologies Ag	Verfahren zur Bearbeitung eines Wafers
ZA200506095B (en) *	2003-01-30	2006-10-25	Univ Cape Town	A thin film semiconductor device and method of manufacturing a thin film semiconductor device
US7400037B2 (en) *	2004-12-30	2008-07-15	Advanced Chip Engineering Tachnology Inc.	Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3690984A (en) *	1967-10-09	1972-09-12	Western Electric Co	Releasable mounting method of placing an oriented array of semiconductor devices on the mounting
US3706409A (en) *	1970-02-26	1972-12-19	Gen Electric	Semiconductor lead attachment system including a semiconductor pellet orientation plate
US3766638A (en) *	1970-08-31	1973-10-23	Hugle Ind Inc	Wafer spreader
US3739463A (en) *	1971-10-18	1973-06-19	Gen Electric	Method for lead attachment to pellets mounted in wafer alignment
US3888053A (en) *	1973-05-29	1975-06-10	Rca Corp	Method of shaping semiconductor workpiece

1974
- 1974-07-30 DE DE2436600A patent/DE2436600A1/de active Pending
1975
- 1975-02-04 CH CH135075A patent/CH590557A5/xx not_active IP Right Cessation
- 1975-02-21 SE SE7501979A patent/SE397902B/xx unknown
- 1975-02-24 AR AR257737A patent/AR202062A1/es active
- 1975-03-06 ES ES435343A patent/ES435343A1/es not_active Expired
- 1975-03-10 US US05/556,867 patent/US3947303A/en not_active Expired - Lifetime
- 1975-03-20 FR FR7508680A patent/FR2280977A1/fr active Granted
- 1975-04-11 JP JP4347575A patent/JPS5429345B2/ja not_active Expired
- 1975-04-14 IT IT22297/75A patent/IT1037271B/it active
- 1975-05-15 GB GB20500/75A patent/GB1509227A/en not_active Expired
- 1975-07-08 BR BR5500/75D patent/BR7504290A/pt unknown

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Also Published As

Publication number	Publication date
FR2280977B1 (2)	1979-03-02
BR7504290A (pt)	1976-07-13
CH590557A5 (2)	1977-08-15
ES435343A1 (es)	1976-12-16
SE7501979L (sv)	1976-02-02
JPS5117670A (2)	1976-02-12
DE2436600A1 (de)	1976-02-19
US3947303A (en)	1976-03-30
GB1509227A (en)	1978-05-04
SE397902B (sv)	1977-11-21
JPS5429345B2 (2)	1979-09-22
IT1037271B (it)	1979-11-10
AR202062A1 (es)	1975-05-09

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Legal Events

Date	Code	Title	Description
1980-12-26	ST	Notification of lapse