FR2361636A1 - Agencement de conduites de chaleur - Google Patents

Agencement de conduites de chaleur

Info

Publication number
FR2361636A1
FR2361636A1 FR7724497A FR7724497A FR2361636A1 FR 2361636 A1 FR2361636 A1 FR 2361636A1 FR 7724497 A FR7724497 A FR 7724497A FR 7724497 A FR7724497 A FR 7724497A FR 2361636 A1 FR2361636 A1 FR 2361636A1
Authority
FR
France
Prior art keywords
heat
layout
condensing
power plants
coupled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7724497A
Other languages
English (en)
Other versions
FR2361636B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westinghouse Electric Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of FR2361636A1 publication Critical patent/FR2361636A1/fr
Application granted granted Critical
Publication of FR2361636B1 publication Critical patent/FR2361636B1/fr
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/688Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06Control arrangements therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6847Structural arrangements; Mounting of elements, e.g. in relation to fluid flow where sensing or heating elements are not disturbing the fluid flow, e.g. elements mounted outside the flow duct
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • G05D23/1927Control of temperature characterised by the use of electric means using a plurality of sensors
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • G05D23/1927Control of temperature characterised by the use of electric means using a plurality of sensors
    • G05D23/193Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces
    • G05D23/1932Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of a plurality of spaces
    • G05D23/1934Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of a plurality of spaces each space being provided with one sensor acting on one or more control means
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • G05D23/20Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • G05D23/20Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G05D23/22Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element being a thermocouple
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2200/00Prediction; Simulation; Testing
    • F28F2200/005Testing heat pipes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Fluid Mechanics (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Remote Sensing (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un agencement de conduites de chaleur qui fournissent une indication des puissances thermiques relatives d'un premier et d'un second environnement couplé à cette combinaison de conduites de chaleur. Cet agencement comporte un premier et un second dispositif de conduite de chaleur chacun possédant une section d'évaporation et une section de condensation, ces premier et second dispositifs de conduite de chaleur étant couplés de telle sorte que les sections de condensation se combinent pour former une section commune de condensation, tandis que les sections d'évaporation de ces première et seconde conduites de chaleur sont exposées au premier et au second environnement Application aux centrales électriques, notamment des centrales nucléaires.
FR7724497A 1976-08-10 1977-08-09 Agencement de conduites de chaleur Granted FR2361636A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/713,175 US4067237A (en) 1976-08-10 1976-08-10 Novel heat pipe combination

Publications (2)

Publication Number Publication Date
FR2361636A1 true FR2361636A1 (fr) 1978-03-10
FR2361636B1 FR2361636B1 (fr) 1983-07-01

Family

ID=24865089

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7724497A Granted FR2361636A1 (fr) 1976-08-10 1977-08-09 Agencement de conduites de chaleur

Country Status (5)

Country Link
US (1) US4067237A (fr)
JP (1) JPS5321445A (fr)
DE (1) DE2735941A1 (fr)
FR (1) FR2361636A1 (fr)
GB (1) GB1589730A (fr)

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IN154143B (fr) * 1979-05-22 1984-09-22 Smidth & Co As F L
US4370547A (en) * 1979-11-28 1983-01-25 Varian Associates, Inc. Variable thermal impedance
JPS58153005A (ja) * 1982-03-04 1983-09-10 三浦工業株式会社 ボイラへの薬品投入方法
NL8203080A (nl) * 1982-08-02 1984-03-01 Cc Controls Bv Werkwijze en inrichting voor het meten van de stroom van een fysische grootheid.
US4597675A (en) * 1983-04-04 1986-07-01 The Garrett Corporation Mean temperature sensor
US4627487A (en) * 1983-12-19 1986-12-09 Hughes Aircraft Company Separate liquid flow heat pipe system
JPS63197904U (fr) * 1988-05-12 1988-12-20
GB8819442D0 (en) * 1988-08-16 1988-09-21 Nat Nuclear Corp Ltd Heat transfer measurement
JPH06213482A (ja) * 1993-01-12 1994-08-02 Hitachi Ltd 蓄熱装置及び熱供給システム
US5730211A (en) * 1996-01-22 1998-03-24 Lockheed Martin Corporation Apparatus and method for operating a heat pipe panel assembly
GB2315324A (en) * 1996-07-16 1998-01-28 Alan Brown Thermo-syphons
US5901040A (en) * 1997-07-30 1999-05-04 Hewlett-Packard Company Heat sink and Faraday Cage assembly for a semiconductor module and a power converter
US6191945B1 (en) 1997-07-30 2001-02-20 Hewlett-Packard Company Cold plate arrangement for cooling processor and companion voltage regulator
US6084178A (en) * 1998-02-27 2000-07-04 Hewlett-Packard Company Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU)
US5947111A (en) * 1998-04-30 1999-09-07 Hudson Products Corporation Apparatus for the controlled heating of process fluids
US5979220A (en) * 1998-06-30 1999-11-09 Siemens Westinghouse Power Corporation In-situ sensors for gas turbines
US5926370A (en) * 1998-10-29 1999-07-20 Hewlett-Packard Company Method and apparatus for a modular integrated apparatus for multi-function components
US6061235A (en) * 1998-11-18 2000-05-09 Hewlett-Packard Company Method and apparatus for a modular integrated apparatus for heat dissipation, processor integration, electrical interface, and electromagnetic interference management
US6209626B1 (en) * 1999-01-11 2001-04-03 Intel Corporation Heat pipe with pumping capabilities and use thereof in cooling a device
US6198630B1 (en) 1999-01-20 2001-03-06 Hewlett-Packard Company Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules
US6804622B2 (en) * 2001-09-04 2004-10-12 General Electric Company Method and apparatus for non-destructive thermal inspection
US7134486B2 (en) * 2001-09-28 2006-11-14 The Board Of Trustees Of The Leeland Stanford Junior University Control of electrolysis gases in electroosmotic pump systems
US6942018B2 (en) * 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
US6606251B1 (en) 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module
US6675887B2 (en) 2002-03-26 2004-01-13 Thermal Corp. Multiple temperature sensitive devices using two heat pipes
US20040104011A1 (en) * 2002-10-23 2004-06-03 Paul Crutchfield Thermal management system
JP2007088282A (ja) * 2005-09-22 2007-04-05 Mitsubishi Electric Corp 周辺機器及び電子機器
CN100552445C (zh) * 2005-11-17 2009-10-21 富准精密工业(深圳)有限公司 热管性能检测装置
CN100561206C (zh) * 2005-11-18 2009-11-18 富准精密工业(深圳)有限公司 热管性能检测装置
CN100561207C (zh) * 2005-11-25 2009-11-18 富准精密工业(深圳)有限公司 热管性能检测装置
CN100573121C (zh) * 2005-12-01 2009-12-23 富准精密工业(深圳)有限公司 热管性能检测装置
TWI287084B (en) * 2005-12-02 2007-09-21 Foxconn Tech Co Ltd Detecting device for heat pipes
CN1979147B (zh) * 2005-12-09 2010-05-26 富准精密工业(深圳)有限公司 热管性能检测装置
CN100573123C (zh) * 2005-12-15 2009-12-23 富准精密工业(深圳)有限公司 热管性能检测装置
US7417858B2 (en) * 2005-12-21 2008-08-26 Sun Microsystems, Inc. Cooling technique using multiple magnet array for magneto-hydrodynamic cooling of multiple integrated circuits
US7614445B2 (en) * 2005-12-21 2009-11-10 Sun Microsystems, Inc. Enhanced heat pipe cooling with MHD fluid flow
US7628198B2 (en) * 2005-12-21 2009-12-08 Sun Microsystems, Inc. Cooling technique using a heat sink containing swirling magneto-hydrodynamic fluid
CN100573125C (zh) * 2005-12-28 2009-12-23 富准精密工业(深圳)有限公司 热管性能检测装置
CN100573124C (zh) * 2005-12-28 2009-12-23 富准精密工业(深圳)有限公司 热管性能检测装置
US7651261B2 (en) * 2007-07-10 2010-01-26 General Electric Company System and method for thermal inspection of parts
US20090297336A1 (en) * 2007-08-21 2009-12-03 General Electric Company Online systems and methods for thermal inspection of parts
US7909507B2 (en) * 2008-04-11 2011-03-22 General Electric Company Thermal inspection system and method
JP5125889B2 (ja) * 2008-08-28 2013-01-23 三菱電機株式会社 可変コンダクタンスヒートパイプ
US20100101763A1 (en) * 2008-10-27 2010-04-29 Meng-Cheng Huang Thin heat dissipating apparatus
JP5360226B2 (ja) * 2009-11-19 2013-12-04 富士通株式会社 ループ型ヒートパイプシステム及び情報処理装置
US8244488B2 (en) * 2009-11-25 2012-08-14 General Electric Company Thermal inspection systems
US20110164653A1 (en) * 2010-01-07 2011-07-07 General Electric Company Thermal inspection system and method incorporating external flow
WO2012079078A2 (fr) 2010-12-10 2012-06-14 Global Carbon Solutions, Inc. Extraction de chaleur passive et production d'énergie
DE102011119174A1 (de) * 2011-11-23 2013-05-23 Inheco Industrial Heating And Cooling Gmbh Vapor Chamber
US20130306274A1 (en) * 2012-05-15 2013-11-21 Hsiu-Wei Yang Heat dissipation structure for heat dissipation unit
US9696092B2 (en) 2014-07-16 2017-07-04 CIX Inc. Furnace cooling panel monitoring system
GB2533936B (en) 2015-01-07 2017-10-25 Homeserve Plc Flow detection device
GB201501935D0 (en) 2015-02-05 2015-03-25 Tooms Moore Consulting Ltd And Trow Consulting Ltd Water flow analysis
US10184730B2 (en) * 2016-08-17 2019-01-22 Harris Corporation Phase change cell

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2504588A (en) * 1943-03-10 1950-04-18 Hartford Nat Bank & Trust Co Device for measuring temperatures at a distance
US3525386A (en) * 1969-01-22 1970-08-25 Atomic Energy Commission Thermal control chamber
FR2276546A1 (fr) * 1974-06-26 1976-01-23 Euratom Chambre de chauffe a temperature controlee

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DE1473739A1 (de) * 1965-02-15 1969-04-03 Euratom Dampfdruckmessgeraet und Kalorimeter fuer hoehere Temperaturen
US3433929A (en) * 1967-04-10 1969-03-18 Minnesota Mining & Mfg Control device
US3564727A (en) * 1969-03-03 1971-02-23 Virtis Co Inc Freeze dryer using an expendable refrigerant
US3566676A (en) * 1969-04-17 1971-03-02 Nasa Fluid phase analyzer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2504588A (en) * 1943-03-10 1950-04-18 Hartford Nat Bank & Trust Co Device for measuring temperatures at a distance
US3525386A (en) * 1969-01-22 1970-08-25 Atomic Energy Commission Thermal control chamber
FR2276546A1 (fr) * 1974-06-26 1976-01-23 Euratom Chambre de chauffe a temperature controlee

Also Published As

Publication number Publication date
DE2735941A1 (de) 1978-02-16
JPS559637B2 (fr) 1980-03-11
FR2361636B1 (fr) 1983-07-01
JPS5321445A (en) 1978-02-27
US4067237A (en) 1978-01-10
GB1589730A (en) 1981-05-20

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Legal Events

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ST Notification of lapse