FR2382094A1 - Passivation d'une interception de surface d'une jonction pn - Google Patents
Passivation d'une interception de surface d'une jonction pnInfo
- Publication number
- FR2382094A1 FR2382094A1 FR7804586A FR7804586A FR2382094A1 FR 2382094 A1 FR2382094 A1 FR 2382094A1 FR 7804586 A FR7804586 A FR 7804586A FR 7804586 A FR7804586 A FR 7804586A FR 2382094 A1 FR2382094 A1 FR 2382094A1
- Authority
- FR
- France
- Prior art keywords
- junction
- passivation
- layer
- regions
- polycrystalline silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
- H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/481—Encapsulations, e.g. protective coatings characterised by their materials comprising semiconductor materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
- H10P14/662—Laminate layers, e.g. stacks of alternating high-k metal oxides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/69215—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
- H10P14/6939—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal
- H10P14/69391—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal the material containing aluminium, e.g. Al2O3
Landscapes
- Formation Of Insulating Films (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
L'invention concerne un dispositif semi-conducteur comprenant un corps semi-conducteur ayant une surface, au moins deux régions de types de conductivité opposés dans le corps, une jonction PN à l'interface entre les deux régions, cette jonction PN s'étendant jusqu'à la surface du corps, et une couche de silicium polycristallin de forte résistivité sur la surface. Selon l'invention, une couche 24 d'un matériau particulaire de passivation est déposée sur la couche en silicium polycristallin 22. L'invention s'applique notamment à l'industrie de semi-conducteurs.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US77168177A | 1977-02-24 | 1977-02-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2382094A1 true FR2382094A1 (fr) | 1978-09-22 |
| FR2382094B1 FR2382094B1 (fr) | 1985-07-19 |
Family
ID=25092625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7804586A Expired FR2382094B1 (fr) | 1977-02-24 | 1978-02-17 | Passivation d'une interception de surface d'une jonction pn |
Country Status (10)
| Country | Link |
|---|---|
| JP (1) | JPS53105978A (fr) |
| BE (1) | BE864270A (fr) |
| DE (1) | DE2806493A1 (fr) |
| FR (1) | FR2382094B1 (fr) |
| GB (1) | GB1552759A (fr) |
| IN (1) | IN147572B (fr) |
| IT (1) | IT1091594B (fr) |
| PL (1) | PL116754B1 (fr) |
| SE (1) | SE7801091L (fr) |
| YU (1) | YU14978A (fr) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4344985A (en) | 1981-03-27 | 1982-08-17 | Rca Corporation | Method of passivating a semiconductor device with a multi-layer passivant system by thermally growing a layer of oxide on an oxygen doped polycrystalline silicon layer |
| US4420765A (en) | 1981-05-29 | 1983-12-13 | Rca Corporation | Multi-layer passivant system |
| JPS6312166U (fr) * | 1986-07-08 | 1988-01-26 | ||
| CA1339817C (fr) * | 1989-05-31 | 1998-04-14 | Mitel Corporation | Operation de chauffage et de passivation de materiaux de spin sur verre utilisant un plasma et produits avec ces operations |
| JPH0316373U (fr) * | 1989-06-28 | 1991-02-19 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1250099A (fr) * | 1969-04-14 | 1971-10-20 | ||
| DE1274736B (de) * | 1964-12-03 | 1974-02-07 | Verfahren zur herstellung einer halbleitervorrichtung | |
| FR2266301A1 (fr) * | 1974-03-30 | 1975-10-24 | Sony Corp | |
| US4007476A (en) * | 1975-04-21 | 1977-02-08 | Hutson Jearld L | Technique for passivating semiconductor devices |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3895127A (en) * | 1974-04-19 | 1975-07-15 | Rca Corp | Method of selectively depositing glass on semiconductor devices |
| NL7500492A (nl) * | 1975-01-16 | 1976-07-20 | Philips Nv | Werkwijze voor het vervaardigen van halfgelei- derinrichtingen, waarbij een glazen bedekking wordt aangebracht, en halfgeleiderinrichtingen, vervaardigd volgens deze werkwijze. |
-
1978
- 1978-01-02 IN IN2/CAL/78A patent/IN147572B/en unknown
- 1978-01-04 IT IT19030/78A patent/IT1091594B/it active
- 1978-01-23 YU YU00149/78A patent/YU14978A/xx unknown
- 1978-01-30 SE SE7801091A patent/SE7801091L/xx unknown
- 1978-02-16 GB GB6178/78A patent/GB1552759A/en not_active Expired
- 1978-02-16 DE DE19782806493 patent/DE2806493A1/de not_active Ceased
- 1978-02-17 FR FR7804586A patent/FR2382094B1/fr not_active Expired
- 1978-02-21 JP JP1960078A patent/JPS53105978A/ja active Granted
- 1978-02-22 PL PL1978204820A patent/PL116754B1/pl unknown
- 1978-02-23 BE BE185438A patent/BE864270A/fr unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1274736B (de) * | 1964-12-03 | 1974-02-07 | Verfahren zur herstellung einer halbleitervorrichtung | |
| GB1250099A (fr) * | 1969-04-14 | 1971-10-20 | ||
| FR2266301A1 (fr) * | 1974-03-30 | 1975-10-24 | Sony Corp | |
| US4007476A (en) * | 1975-04-21 | 1977-02-08 | Hutson Jearld L | Technique for passivating semiconductor devices |
Also Published As
| Publication number | Publication date |
|---|---|
| IT7819030A0 (it) | 1978-01-04 |
| IN147572B (fr) | 1980-04-19 |
| JPS5626980B2 (fr) | 1981-06-22 |
| IT1091594B (it) | 1985-07-06 |
| JPS53105978A (en) | 1978-09-14 |
| FR2382094B1 (fr) | 1985-07-19 |
| SE7801091L (sv) | 1978-08-25 |
| GB1552759A (en) | 1979-09-19 |
| PL116754B1 (en) | 1981-06-30 |
| YU14978A (en) | 1982-10-31 |
| DE2806493A1 (de) | 1978-08-31 |
| BE864270A (fr) | 1978-06-16 |
| PL204820A1 (pl) | 1978-11-06 |
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