FR2388064A1 - Procede pour renforcer par voie galvanique un motif de base conducteur et dispositif obtenu suivant ce procede - Google Patents

Procede pour renforcer par voie galvanique un motif de base conducteur et dispositif obtenu suivant ce procede

Info

Publication number
FR2388064A1
FR2388064A1 FR7811320A FR7811320A FR2388064A1 FR 2388064 A1 FR2388064 A1 FR 2388064A1 FR 7811320 A FR7811320 A FR 7811320A FR 7811320 A FR7811320 A FR 7811320A FR 2388064 A1 FR2388064 A1 FR 2388064A1
Authority
FR
France
Prior art keywords
conductive pattern
galvanic
reinforcing
procedure
device obtained
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7811320A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2388064A1 publication Critical patent/FR2388064A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Magnetic Heads (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

Procédé de fabrication d'un dispositif, suivant lequel on forme sur un substrat un motif de base conducteur qu'on renforce par voie galvanique pour obtenir un motif de conducteurs, caractérisé en ce qu'au moins une couche superficielle du substrat consiste en une matière électriquement isolante, puis on applique une couche auxiliaire ayant une résistance en surface de 10**12 à 10**17 OMEGA / Section , après quoi on forme le motif de base sur cette dernière couche.
FR7811320A 1977-04-18 1978-04-18 Procede pour renforcer par voie galvanique un motif de base conducteur et dispositif obtenu suivant ce procede Withdrawn FR2388064A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7704186A NL7704186A (nl) 1977-04-18 1977-04-18 Werkwijze voor het galvanisch versterken van een geleidend basispatroon en inrichting ver- kregen met behulp van de werkwijze.

Publications (1)

Publication Number Publication Date
FR2388064A1 true FR2388064A1 (fr) 1978-11-17

Family

ID=19828377

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7811320A Withdrawn FR2388064A1 (fr) 1977-04-18 1978-04-18 Procede pour renforcer par voie galvanique un motif de base conducteur et dispositif obtenu suivant ce procede

Country Status (7)

Country Link
US (1) US4175010A (fr)
JP (1) JPS53129988A (fr)
CA (1) CA1112372A (fr)
DE (1) DE2815410A1 (fr)
FR (1) FR2388064A1 (fr)
GB (1) GB1577403A (fr)
NL (1) NL7704186A (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59215790A (ja) * 1983-05-23 1984-12-05 マルイ工業株式会社 印刷回路板の製造法
US4937930A (en) * 1989-10-05 1990-07-03 International Business Machines Corporation Method for forming a defect-free surface on a porous ceramic substrate
JP2950301B2 (ja) 1997-11-21 1999-09-20 日本電気株式会社 磁気ディスク装置
US10636964B2 (en) * 2018-03-30 2020-04-28 Applied Materials, Inc. Magnetic tunnel junctions with tunable high perpendicular magnetic anisotropy

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2027664A1 (fr) * 1969-01-02 1970-10-02 Philips Nv
US3700508A (en) * 1970-06-25 1972-10-24 Gen Instrument Corp Fabrication of integrated microcircuit devices
CA929675A (en) * 1972-02-16 1973-07-03 Microsystems International Limited Fabrication of beam leads
FR2209216A1 (fr) * 1972-11-30 1974-06-28 Ibm

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1521057C3 (de) * 1966-08-30 1980-01-31 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Verfahren zum Kontaktieren einer Halbleiterzone
GB1293574A (en) * 1969-12-01 1972-10-18 Ass Elect Ind Improvements in or relating to methods of depositing metal layers by electroplating
US3776820A (en) * 1972-09-15 1973-12-04 Buckbee Mears Co Method of forming miniature electrical conductors
JPS4995591A (fr) * 1973-01-12 1974-09-10

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2027664A1 (fr) * 1969-01-02 1970-10-02 Philips Nv
US3700508A (en) * 1970-06-25 1972-10-24 Gen Instrument Corp Fabrication of integrated microcircuit devices
CA929675A (en) * 1972-02-16 1973-07-03 Microsystems International Limited Fabrication of beam leads
FR2172242A1 (fr) * 1972-02-16 1973-09-28 Microsystems Int Ltd
FR2209216A1 (fr) * 1972-11-30 1974-06-28 Ibm

Also Published As

Publication number Publication date
CA1112372A (fr) 1981-11-10
NL7704186A (nl) 1978-10-20
DE2815410A1 (de) 1978-10-19
JPS53129988A (en) 1978-11-13
GB1577403A (en) 1980-10-22
US4175010A (en) 1979-11-20

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Legal Events

Date Code Title Description
ST Notification of lapse