FR2407815A1 - Piece composite formable mecaniquement, utilisable notamment pour la realisation de circuits imprimes en forme de plaques incurvees - Google Patents

Piece composite formable mecaniquement, utilisable notamment pour la realisation de circuits imprimes en forme de plaques incurvees

Info

Publication number
FR2407815A1
FR2407815A1 FR7733222A FR7733222A FR2407815A1 FR 2407815 A1 FR2407815 A1 FR 2407815A1 FR 7733222 A FR7733222 A FR 7733222A FR 7733222 A FR7733222 A FR 7733222A FR 2407815 A1 FR2407815 A1 FR 2407815A1
Authority
FR
France
Prior art keywords
plate
realization
printed circuits
composite part
curved plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7733222A
Other languages
English (en)
Other versions
FR2407815B1 (fr
Inventor
Simon Levine
Alain Nakach
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR7733222A priority Critical patent/FR2407815A1/fr
Priority to DE19782847454 priority patent/DE2847454A1/de
Priority to JP13568978A priority patent/JPS5498972A/ja
Priority to US05/956,894 priority patent/US4216258A/en
Publication of FR2407815A1 publication Critical patent/FR2407815A1/fr
Application granted granted Critical
Publication of FR2407815B1 publication Critical patent/FR2407815B1/fr
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0014Shaping of the substrate, e.g. by moulding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05Flexible printed circuits [FPCs]
    • H05K2201/057Shape retainable
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09018Rigid curved substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302Bending a rigid substrate; Breaking rigid substrates by bending
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/901Printed circuit
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00Superconductor technology: apparatus, material, process
    • Y10S505/80Material per se process of making same
    • Y10S505/812Stock
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Particle Accelerators (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'INVENTION A POUR OBJET UNE PIECE COMPOSITE APTE A ETRE MISE SOUS UNE FORME DONNEE PAR FORMAGE MECANIQUE. CETTE PIECE COMPORTE UNE PLAQUE DE MATERIAU SOUPLE ISOLANT ELECTRIQUE ETOU THERMIQUE, DONT L'UNE AU MOINS DES FACES EST REVETUE EN PARTIE DE METAL FORMANT SUR LADITE PLAQUE DES PARTIES METALLIQUES EN RELIEF ET ELLE SE CARACTERISE EN CE QUE LADITE PLAQUE ET LESDITES PARTIES METALLIQUES ONT RESPECTIVEMENT UNE EPAISSEUR TELLE QUE L'ON PEUT METTRE LADITE PIECE SOUS LA FORME DONNEE EN REALISANT PAR FORMAGE MECANIQUE DE LADITE PIECE UNE DEFORMATION PERMANENTE DESDITES PARTIES METALLIQUES SANS DEPASSER LE DOMAINE DE DEFORMATION ELASTIQUE DE LADITE PLAQUE. APPLICATION A LA REALISATION DE CIRCUITS IMPRIMES PRESENTANT LA FORME D'UNE PLAQUE INCURVEE.
FR7733222A 1977-11-04 1977-11-04 Piece composite formable mecaniquement, utilisable notamment pour la realisation de circuits imprimes en forme de plaques incurvees Granted FR2407815A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR7733222A FR2407815A1 (fr) 1977-11-04 1977-11-04 Piece composite formable mecaniquement, utilisable notamment pour la realisation de circuits imprimes en forme de plaques incurvees
DE19782847454 DE2847454A1 (de) 1977-11-04 1978-11-02 Zusammengesetztes, mechanisch verformbares teil, insbesondere fuer die herstellung von gedruckten schaltungen auf gekruemmten leiterplatten
JP13568978A JPS5498972A (en) 1977-11-04 1978-11-02 Compound member
US05/956,894 US4216258A (en) 1977-11-04 1978-11-02 Mechanically formable composite part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7733222A FR2407815A1 (fr) 1977-11-04 1977-11-04 Piece composite formable mecaniquement, utilisable notamment pour la realisation de circuits imprimes en forme de plaques incurvees

Publications (2)

Publication Number Publication Date
FR2407815A1 true FR2407815A1 (fr) 1979-06-01
FR2407815B1 FR2407815B1 (fr) 1982-11-19

Family

ID=9197271

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7733222A Granted FR2407815A1 (fr) 1977-11-04 1977-11-04 Piece composite formable mecaniquement, utilisable notamment pour la realisation de circuits imprimes en forme de plaques incurvees

Country Status (4)

Country Link
US (1) US4216258A (fr)
JP (1) JPS5498972A (fr)
DE (1) DE2847454A1 (fr)
FR (1) FR2407815A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2569078A1 (fr) * 1984-07-09 1986-02-14 Rogers Corp Materiau de circuit lamifie
EP0652692A1 (fr) * 1993-11-06 1995-05-10 Philips Patentverwaltung GmbH Plaque à circuit imprimé

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0722880Y2 (ja) * 1986-08-05 1995-05-24 工業技術院長 電子蓄積リング
WO1992019786A1 (fr) * 1991-05-08 1992-11-12 Superconductor Technologies, Inc. Procede de fabrication pour metallisations a faible perte deposees sur des dispositifs a couches minces supraconductrices
GB0805021D0 (en) * 2008-03-18 2008-04-16 Renishaw Plc Apparatus and method for electronic circuit manufacture

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1143248B (de) 1961-04-26 1963-02-07 Telefunken Patent Gedruckte Leiterplatte
US3427715A (en) * 1966-06-13 1969-02-18 Motorola Inc Printed circuit fabrication

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2569078A1 (fr) * 1984-07-09 1986-02-14 Rogers Corp Materiau de circuit lamifie
EP0652692A1 (fr) * 1993-11-06 1995-05-10 Philips Patentverwaltung GmbH Plaque à circuit imprimé

Also Published As

Publication number Publication date
FR2407815B1 (fr) 1982-11-19
JPS5498972A (en) 1979-08-04
US4216258A (en) 1980-08-05
DE2847454A1 (de) 1979-05-10

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