FR2420845A1 - Adaptateur de contraintes pour dispositif semi-conducteur - Google Patents

Adaptateur de contraintes pour dispositif semi-conducteur

Info

Publication number
FR2420845A1
FR2420845A1 FR7907271A FR7907271A FR2420845A1 FR 2420845 A1 FR2420845 A1 FR 2420845A1 FR 7907271 A FR7907271 A FR 7907271A FR 7907271 A FR7907271 A FR 7907271A FR 2420845 A1 FR2420845 A1 FR 2420845A1
Authority
FR
France
Prior art keywords
adapter
metallic element
strands
bonded
thermal stresses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7907271A
Other languages
English (en)
Other versions
FR2420845B1 (fr
Inventor
Douglas Eugene Houston
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2420845A1 publication Critical patent/FR2420845A1/fr
Application granted granted Critical
Publication of FR2420845B1 publication Critical patent/FR2420845B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H10W70/22—Conductive package substrates serving as an interconnection, e.g. metal plates having an heterogeneous or anisotropic structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Adapteur en cuivre structuré n'induisant pas de contraintes thermiques importantes. Il comprend un paquet de brins de cuivre droits 16 tous à peu près de la même longueur, portant un revêtement non-collant, sauf à leurs extrémités, et parallèles les uns aux autres; un premier et un deuxième élément métallique 12, 14 qui présentent chacun une surface relativement plane, qui sont liés chacun respectivement à un groupe d'extrémités en commun des brins de cuivre, le second élément métallique étant conçu pour être lié à un dispositif semi-conducteur 40 de manière à ce que l'adaptateur puisse dissiper efficacement la chaleur du dispositif sans provoquer de contraintes thermiques à l'interface entre le second élément métallique et le dispositif, chacun des deux groupes d'extrémités en commun de brins étant lié par diffusion à l'élément métallique correspondant Application aux diodes
FR7907271A 1978-03-22 1979-03-22 Adaptateur de contraintes pour dispositif semi-conducteur Expired FR2420845B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US88910078A 1978-03-22 1978-03-22
US05/944,372 US4385310A (en) 1978-03-22 1978-09-21 Structured copper strain buffer

Publications (2)

Publication Number Publication Date
FR2420845A1 true FR2420845A1 (fr) 1979-10-19
FR2420845B1 FR2420845B1 (fr) 1986-05-09

Family

ID=27128904

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7907271A Expired FR2420845B1 (fr) 1978-03-22 1979-03-22 Adaptateur de contraintes pour dispositif semi-conducteur

Country Status (8)

Country Link
US (1) US4385310A (fr)
JP (1) JPS54148375A (fr)
AR (1) AR216582A1 (fr)
BR (1) BR7901763A (fr)
DE (1) DE2910959C2 (fr)
FR (1) FR2420845B1 (fr)
GB (1) GB2017408B (fr)
SE (1) SE433021B (fr)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2855493A1 (de) * 1978-12-22 1980-07-03 Bbc Brown Boveri & Cie Leistungs-halbleiterbauelement
WO1980001967A1 (fr) * 1979-03-08 1980-09-18 Gen Electric Liaison par thermocompression d'un semi-conducteur sur un tampon contraint
SE420964B (sv) * 1980-03-27 1981-11-09 Asea Ab Kompositmaterial och sett for dess framstellning
DE3031912A1 (de) * 1980-08-23 1982-04-01 Brown, Boveri & Cie Ag, 6800 Mannheim Anordnung zur potentialunabhaengigen waermeabfuehrung
US4574299A (en) * 1981-03-02 1986-03-04 General Electric Company Thyristor packaging system
US4481403A (en) * 1983-03-04 1984-11-06 Honeywell Inc. Temperature control of solid state circuit chips
US4949896A (en) * 1984-10-19 1990-08-21 The United States Of America As Represented By The Secretary Of The Air Force Technique of assembling structures using vapor phase soldering
US5262718A (en) * 1985-08-05 1993-11-16 Raychem Limited Anisotropically electrically conductive article
US5637925A (en) * 1988-02-05 1997-06-10 Raychem Ltd Uses of uniaxially electrically conductive articles
US5631447A (en) * 1988-02-05 1997-05-20 Raychem Limited Uses of uniaxially electrically conductive articles
US5139887A (en) * 1988-12-27 1992-08-18 Barnes Group, Inc. Superplastically formed cellular article
US5258649A (en) * 1989-05-20 1993-11-02 Hitachi, Ltd. Semiconductor device and electronic apparatus using semiconductor device
US5069978A (en) * 1990-10-04 1991-12-03 Gte Products Corporation Brazed composite having interlayer of expanded metal
DE19843309A1 (de) * 1998-09-22 2000-03-23 Asea Brown Boveri Kurzschlussfestes IGBT Modul
EP1167559B1 (fr) * 1998-12-07 2006-03-08 Hitachi, Ltd. Materiau composite et son utilisation
DE10022341B4 (de) * 2000-05-08 2005-03-31 eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG Elektronisches Leistungsmodul
EP1182701A1 (fr) * 2000-08-21 2002-02-27 Abb Research Ltd. Procédé de fabrication d'un élément tampon pour la réduction de tensions mécaniques
EP1246242A1 (fr) * 2001-03-26 2002-10-02 Abb Research Ltd. Module de transistors bipolaires à grille isolée (IGBT) avec protection contre des courts-circuits
US20030146499A1 (en) 2001-12-18 2003-08-07 Yasuo Kondo Composite material including copper and cuprous oxide and application thereof
US8405996B2 (en) * 2009-06-30 2013-03-26 General Electric Company Article including thermal interface element and method of preparation
CA3110802C (fr) 2013-03-15 2023-05-23 All-Clad Metalcrafters Llc Ustensile de cuisson dote de couches collees de maniere selective
US10081163B2 (en) 2013-03-15 2018-09-25 All-Clad Metalcrafters Llc Cooking utensil having a graphite core
US9585514B2 (en) 2013-03-15 2017-03-07 All-Clad Metalsrafters, LLC Heat zone pan
US10292255B2 (en) 2016-05-18 2019-05-14 Raytheon Company Expanding thermal device and system for effecting heat transfer within electronics assemblies
US11364706B2 (en) 2018-12-19 2022-06-21 All-Clad Metalcrafters, L.L.C. Cookware having a graphite core
DE102022208360A1 (de) 2022-08-11 2023-07-06 Zf Friedrichshafen Ag Leistungsmodul und verfahren zur montage eines leistungsmoduls

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1153461B (de) * 1960-06-23 1963-08-29 Siemens Ag Halbleiteranordnung
US3256598A (en) * 1963-07-25 1966-06-21 Martin Marietta Corp Diffusion bonding
US3295089A (en) * 1963-10-11 1966-12-27 American Mach & Foundry Semiconductor device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE537167A (fr) * 1954-04-07
DE1141029B (de) * 1960-06-23 1962-12-13 Siemens Ag Halbleiteranordnung und Verfahren zu ihrer Herstellung
US3365787A (en) * 1963-06-19 1968-01-30 Hexcel Corp Method of making metal honeycomb sandwich structure
US3273029A (en) * 1963-08-23 1966-09-13 Hoffman Electronics Corp Method of attaching leads to a semiconductor body and the article formed thereby
GB1004020A (en) * 1964-04-24 1965-09-08 Standard Telephones Cables Ltd Improvements in or relating to the mounting of electrical components
US3787958A (en) * 1965-08-18 1974-01-29 Atomic Energy Commission Thermo-electric modular structure and method of making same
US3871014A (en) * 1969-08-14 1975-03-11 Ibm Flip chip module with non-uniform solder wettable areas on the substrate
CA892844A (en) * 1970-08-14 1972-02-08 Microsystems International Limited Semiconductor heat sink
US3761783A (en) * 1972-02-02 1973-09-25 Sperry Rand Corp Duel-mesa ring-shaped high frequency diode
JPS5039066A (fr) * 1973-08-08 1975-04-10
JPS5295172A (en) * 1976-02-06 1977-08-10 Mitsubishi Electric Corp Semi-conductor
JPS52147064A (en) * 1976-06-01 1977-12-07 Mitsubishi Electric Corp Semiconductor device
US4067104A (en) * 1977-02-24 1978-01-10 Rockwell International Corporation Method of fabricating an array of flexible metallic interconnects for coupling microelectronics components
GB1598174A (en) * 1977-05-31 1981-09-16 Ibm Cooling electrical apparatus
US4089456A (en) * 1977-06-28 1978-05-16 United Technologies Corporation Controlled-pressure diffusion bonding and fixture therefor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1153461B (de) * 1960-06-23 1963-08-29 Siemens Ag Halbleiteranordnung
US3256598A (en) * 1963-07-25 1966-06-21 Martin Marietta Corp Diffusion bonding
US3295089A (en) * 1963-10-11 1966-12-27 American Mach & Foundry Semiconductor device

Also Published As

Publication number Publication date
BR7901763A (pt) 1979-11-20
FR2420845B1 (fr) 1986-05-09
AR216582A1 (es) 1979-12-28
GB2017408A (en) 1979-10-03
DE2910959C2 (de) 1993-11-11
US4385310A (en) 1983-05-24
SE7902586L (sv) 1979-09-23
SE433021B (sv) 1984-04-30
GB2017408B (en) 1982-07-21
JPS54148375A (en) 1979-11-20
JPS6336136B2 (fr) 1988-07-19
DE2910959A1 (de) 1979-10-18

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Legal Events

Date Code Title Description
ST Notification of lapse