FR2425148A1 - - Google Patents

Info

Publication number
FR2425148A1
FR2425148A1 FR7902318A FR7902318A FR2425148A1 FR 2425148 A1 FR2425148 A1 FR 2425148A1 FR 7902318 A FR7902318 A FR 7902318A FR 7902318 A FR7902318 A FR 7902318A FR 2425148 A1 FR2425148 A1 FR 2425148A1
Authority
FR
France
Prior art keywords
contact
probe
arm
piezo
glued
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7902318A
Other languages
English (en)
Other versions
FR2425148B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/893,118 external-priority patent/US4195259A/en
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of FR2425148A1 publication Critical patent/FR2425148A1/fr
Application granted granted Critical
Publication of FR2425148B1 publication Critical patent/FR2425148B1/fr
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

L'INVENTION CONCERNE UN PROCEDE ET UN APPAREIL DE DETERMINATION DU CONTACT D'UNE SONDE AVEC UNE SURFACE. LA SONDE COMPORTE UNE AIGUILLE DE CONTACT FIXEE SUR UN BRAS REGLABLE. UNE MATIERE PIEZO-ELECTRIQUE EST COLLEE SUR LE BRAS ET DELIVRE UN SIGNAL AU MOMENT OU LA POINTE DE L'AIGUILLE ENTRE EN CONTACT AVEC UNE SURFACE. UN DETECTEUR A PLUSIEURS CANAUX RECOIT LES SIGNAUX DE PLUSIEURS SONDES ET PERMET DE DETERMINER SI ELLES SONT TOUTES EN CONTACT AVEC LA SURFACE. L'INVENTION S'APPLIQUE NOTAMMENT AU CONTROLE DES PLAQUETTES SEMI-CONDUCTRICES SUR LESQUELLES SONT FORMEES DES PASTILLES DE CIRCUITS INTEGRES.
FR7902318A 1978-01-30 1979-01-30 Expired FR2425148B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US87356478A 1978-01-30 1978-01-30
US05/893,118 US4195259A (en) 1978-04-04 1978-04-04 Multiprobe test system and method of using same

Publications (2)

Publication Number Publication Date
FR2425148A1 true FR2425148A1 (fr) 1979-11-30
FR2425148B1 FR2425148B1 (fr) 1985-06-28

Family

ID=27128303

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7902318A Expired FR2425148B1 (fr) 1978-01-30 1979-01-30

Country Status (5)

Country Link
JP (1) JPS54145482A (fr)
DE (1) DE2903517A1 (fr)
FR (1) FR2425148B1 (fr)
GB (2) GB2094479B (fr)
IT (1) IT1113297B (fr)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3068052D1 (en) * 1979-11-05 1984-07-05 Texas Instruments Inc Probe assembly for testing integrated circuits
JPS58164236U (ja) * 1982-04-27 1983-11-01 日本電気ホームエレクトロニクス株式会社 半導体ウエ−ハ特性測定装置
IL79820A0 (en) * 1985-09-26 1986-11-30 Tektronix Inc Wafer probe head,and method of assembling same
US4758785A (en) * 1986-09-03 1988-07-19 Tektronix, Inc. Pressure control apparatus for use in an integrated circuit testing station
US4673839A (en) * 1986-09-08 1987-06-16 Tektronix, Inc. Piezoelectric pressure sensing apparatus for integrated circuit testing stations
US5012186A (en) * 1990-06-08 1991-04-30 Cascade Microtech, Inc. Electrical probe with contact force protection
EP0547251A1 (fr) * 1991-12-14 1993-06-23 International Business Machines Corporation Procédé de test d'un micro circuit
US6232789B1 (en) 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
DE19952943C2 (de) * 1999-11-03 2003-07-03 Infineon Technologies Ag Nadelkarten-Justageeinrichtung zur Planarisierung von Nadelsätzen einer Nadelkarte
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech, Inc., Beaverton, Oreg. Wafersonde
JP2005527823A (ja) 2002-05-23 2005-09-15 カスケード マイクロテック インコーポレイテッド デバイスのテスト用プローブ
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7633306B2 (en) 2003-03-14 2009-12-15 Rudolph Technologies, Inc. System and method of measuring probe float
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7427868B2 (en) 2003-12-24 2008-09-23 Cascade Microtech, Inc. Active wafer probe
DE202005021435U1 (de) 2004-09-13 2008-02-28 Cascade Microtech, Inc., Beaverton Doppelseitige Prüfaufbauten
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
EP1932003A2 (fr) 2005-06-13 2008-06-18 Cascade Microtech, Inc. Sonde de signal differentiel active-passive a large bande
DE112007001399T5 (de) 2006-06-09 2009-05-07 Cascade Microtech, Inc., Beaverton Messfühler für differentielle Signale mit integrierter Symmetrieschaltung
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
CN107015137B (zh) * 2017-05-26 2023-12-08 深圳市赛伦北斗科技有限责任公司 一种电路板检测装置、系统及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1063381A (en) * 1963-01-18 1967-03-30 Wilmot Breeden Ltd Improvements in or relating to surface testing apparatus
FR2040836A5 (fr) * 1965-08-11 1971-01-22 Transistor Automation
US3810017A (en) * 1972-05-15 1974-05-07 Teledyne Inc Precision probe for testing micro-electronic units
US3849728A (en) * 1973-08-21 1974-11-19 Wentworth Labor Inc Fixed point probe card and an assembly and repair fixture therefor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5178692A (fr) * 1974-12-29 1976-07-08 Sony Corp

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1063381A (en) * 1963-01-18 1967-03-30 Wilmot Breeden Ltd Improvements in or relating to surface testing apparatus
FR2040836A5 (fr) * 1965-08-11 1971-01-22 Transistor Automation
US3810017A (en) * 1972-05-15 1974-05-07 Teledyne Inc Precision probe for testing micro-electronic units
US3849728A (en) * 1973-08-21 1974-11-19 Wentworth Labor Inc Fixed point probe card and an assembly and repair fixture therefor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/77 *

Also Published As

Publication number Publication date
IT1113297B (it) 1986-01-20
GB2014315B (en) 1983-02-02
FR2425148B1 (fr) 1985-06-28
GB2094479B (en) 1983-03-16
GB2014315A (en) 1979-08-22
JPS54145482A (en) 1979-11-13
JPH039425B2 (fr) 1991-02-08
DE2903517A1 (de) 1979-08-02
IT7947813A0 (it) 1979-01-29
GB2094479A (en) 1982-09-15

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