FR2452178B1 - Dispositif semi-conducteur a faible impedance thermique - Google Patents

Dispositif semi-conducteur a faible impedance thermique

Info

Publication number
FR2452178B1
FR2452178B1 FR8006121A FR8006121A FR2452178B1 FR 2452178 B1 FR2452178 B1 FR 2452178B1 FR 8006121 A FR8006121 A FR 8006121A FR 8006121 A FR8006121 A FR 8006121A FR 2452178 B1 FR2452178 B1 FR 2452178B1
Authority
FR
France
Prior art keywords
semiconductor device
low thermal
thermal impedance
impedance
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8006121A
Other languages
English (en)
Other versions
FR2452178A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2452178A1 publication Critical patent/FR2452178A1/fr
Application granted granted Critical
Publication of FR2452178B1 publication Critical patent/FR2452178B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/621—Structures or relative sizes of strap connectors
    • H10W72/624—Strap connectors having multiple distinct cores
FR8006121A 1979-03-19 1980-03-19 Dispositif semi-conducteur a faible impedance thermique Expired FR2452178B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/021,488 US4278990A (en) 1979-03-19 1979-03-19 Low thermal resistance, low stress semiconductor package

Publications (2)

Publication Number Publication Date
FR2452178A1 FR2452178A1 (fr) 1980-10-17
FR2452178B1 true FR2452178B1 (fr) 1986-04-18

Family

ID=21804515

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8006121A Expired FR2452178B1 (fr) 1979-03-19 1980-03-19 Dispositif semi-conducteur a faible impedance thermique

Country Status (7)

Country Link
US (1) US4278990A (fr)
JP (1) JPS55133562A (fr)
BR (1) BR8001625A (fr)
CH (1) CH652533A5 (fr)
DE (1) DE3009295A1 (fr)
FR (1) FR2452178B1 (fr)
MX (1) MX148428A (fr)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5032898A (en) * 1979-12-10 1991-07-16 Amp Incorporated Electro-optic device assembly having integral heat sink/retention means
US4336568A (en) * 1980-07-24 1982-06-22 Westinghouse Electric Corp. Packaged solid state power controller with separable mounting for a power switching device, and method of assembly
JPS5753947A (en) * 1980-09-17 1982-03-31 Hitachi Ltd Transistor and electronic device containing it
FR2495846A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de connexion electrique a haute densite de contacts
FR2495838A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de refroidissement amovible pour supports de circuits integres
WO1982002980A1 (fr) * 1981-02-27 1982-09-02 Inc Motorola Module de haute intensite avec conducteurs a multi-niveaux
JPS6038867B2 (ja) * 1981-06-05 1985-09-03 株式会社日立製作所 絶縁型半導体装置
DE3127456A1 (de) * 1981-07-11 1983-02-03 Brown, Boveri & Cie Ag, 6800 Mannheim Stromrichteranordnung
JPS5846663A (ja) * 1981-08-29 1983-03-18 ロ−ベルト・ボツシユ・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 半導体ダイオ−ド薄片を有する整流装置
US4538168A (en) * 1981-09-30 1985-08-27 Unitrode Corporation High power semiconductor package
DE3143339C2 (de) * 1981-10-31 1987-05-14 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
DE3147789A1 (de) * 1981-12-03 1983-06-09 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungsmodul und verfahren zu seiner herstellung
DE3147790A1 (de) * 1981-12-03 1983-06-09 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungsmodul und verfahren zu seiner herstellung
US4634638A (en) * 1981-12-17 1987-01-06 International Business Machines Corporation High melting point copper-gold-tin brazing alloy for chip carriers
US4583283A (en) * 1982-03-26 1986-04-22 Motorola, Inc. Electrically isolated semiconductor power device
US4510519A (en) * 1982-03-26 1985-04-09 Motorola, Inc. Electrically isolated semiconductor power device
US4594770A (en) * 1982-07-15 1986-06-17 Olin Corporation Method of making semiconductor casing
US4480262A (en) * 1982-07-15 1984-10-30 Olin Corporation Semiconductor casing
US4529836A (en) * 1983-07-15 1985-07-16 Sperry Corporation Stress absorption matrix
DE3513530A1 (de) * 1984-06-01 1985-12-05 Bbc Brown Boveri & Cie Verfahren zur herstellung von leistungshalbleitermodulen mit isoliertem aufbau
JPS611852U (ja) * 1984-06-08 1986-01-08 日本インター株式会社 複合半導体装置
USD288557S (en) 1984-09-10 1987-03-03 Motorola, Inc. Semiconductor housing
US4775917A (en) * 1985-12-03 1988-10-04 Wells Manufacturing Company Thermal compensated circuit board interconnect apparatus and method of forming the same
DE3604882A1 (de) * 1986-02-15 1987-08-20 Bbc Brown Boveri & Cie Leistungshalbleitermodul und verfahren zur herstellung des moduls
US5012322A (en) * 1987-05-18 1991-04-30 Allegro Microsystems, Inc. Semiconductor die and mounting assembly
JPS6459947A (en) * 1987-08-31 1989-03-07 Toshiba Corp Semiconductor device
DE3837920A1 (de) * 1988-11-09 1990-05-10 Semikron Elektronik Gmbh Halbleiterelement
DE3839383A1 (de) * 1988-11-22 1990-05-23 Semikron Elektronik Gmbh Verfahren zum herstellen einer halbleiterbaueinheit und vorrichtung zur durchfuehrung des verfahrens
US5182628A (en) * 1989-06-28 1993-01-26 Hitachi, Ltd. Semiconductor device having particular solder interconnection arrangement
US5148264A (en) * 1990-05-02 1992-09-15 Harris Semiconductor Patents, Inc. High current hermetic package
DE4240843A1 (de) * 1992-12-04 1994-06-09 Bosch Gmbh Robert Anordnung zur Verlustwärmeableitung bei Leistungshalbleiterbauelementen
US5563447A (en) * 1993-09-07 1996-10-08 Delco Electronics Corp. High power semiconductor switch module
US5519253A (en) * 1993-09-07 1996-05-21 Delco Electronics Corp. Coaxial switch module
US5444295A (en) * 1993-09-07 1995-08-22 Delco Electronics Corp. Linear dual switch module
KR100322177B1 (ko) 1993-12-27 2002-05-13 이누이 도모지 내연기관용점화장치
US5539254A (en) * 1994-03-09 1996-07-23 Delco Electronics Corp. Substrate subassembly for a transistor switch module
US5517059A (en) * 1994-04-26 1996-05-14 Delco Electronics Corp. Electron and laser beam welding apparatus
US5594355A (en) * 1994-07-19 1997-01-14 Delta Design, Inc. Electrical contactor apparatus for testing integrated circuit devices
US5717252A (en) * 1994-07-25 1998-02-10 Mitsui High-Tec, Inc. Solder-ball connected semiconductor device with a recessed chip mounting area
US5956231A (en) * 1994-10-07 1999-09-21 Hitachi, Ltd. Semiconductor device having power semiconductor elements
US5906310A (en) * 1994-11-10 1999-05-25 Vlt Corporation Packaging electrical circuits
US5876859A (en) * 1994-11-10 1999-03-02 Vlt Corporation Direct metal bonding
JP2732823B2 (ja) * 1995-02-02 1998-03-30 ヴィエルティー コーポレーション はんだ付け方法
SG59997A1 (en) * 1995-06-07 1999-02-22 Ibm Apparatus and process for improved die adhesion to organic chip carries
DE19530264A1 (de) * 1995-08-17 1997-02-20 Abb Management Ag Leistungshalbleitermodul
US5848083A (en) * 1996-10-24 1998-12-08 Sdl, Inc. Expansion-matched high-thermal-conductivity stress-relieved mounting modules
US6127727A (en) * 1998-04-06 2000-10-03 Delco Electronics Corp. Semiconductor substrate subassembly with alignment and stress relief features
US5895974A (en) * 1998-04-06 1999-04-20 Delco Electronics Corp. Durable substrate subassembly for transistor switch module
US6404065B1 (en) 1998-07-31 2002-06-11 I-Xys Corporation Electrically isolated power semiconductor package
US6316737B1 (en) 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board
US6985341B2 (en) * 2001-04-24 2006-01-10 Vlt, Inc. Components having actively controlled circuit elements
US7443229B1 (en) 2001-04-24 2008-10-28 Picor Corporation Active filtering
US6731002B2 (en) 2001-05-04 2004-05-04 Ixys Corporation High frequency power device with a plastic molded package and direct bonded substrate
US6727585B2 (en) 2001-05-04 2004-04-27 Ixys Corporation Power device with a plastic molded package and direct bonded substrate
DE102004054996B4 (de) * 2003-12-06 2013-07-18 Schaeffler Technologies AG & Co. KG Elektronisches Gerät
JP4965187B2 (ja) * 2006-08-09 2012-07-04 株式会社日立製作所 半導体装置
US7875972B2 (en) * 2009-06-25 2011-01-25 International Business Machines Corporation Semiconductor device assembly having a stress-relieving buffer layer
JP2016161410A (ja) * 2015-03-02 2016-09-05 株式会社東芝 歪検出素子、圧力センサ及びマイクロフォン
DE112015007166B4 (de) 2015-12-04 2024-08-29 Mitsubishi Electric Corporation Leistungshalbleitervorrichtung

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3089067A (en) * 1957-09-30 1963-05-07 Gen Motors Corp Semiconductor device
FR1357210A (fr) * 1962-05-10 1964-04-03 Bosch Gmbh Robert Nouveau dispositif à semi-conducteur
US3274456A (en) * 1962-11-21 1966-09-20 Gen Instrument Corp Rectifier assembly and method of making same
US3258661A (en) * 1962-12-17 1966-06-28 Sealed semiconductor device
FR1553893A (fr) * 1967-11-28 1969-01-17
US3593070A (en) * 1968-12-17 1971-07-13 Texas Instruments Inc Submount for semiconductor assembly
DE1815989A1 (de) * 1968-12-20 1970-07-02 Semikron Gleichrichterbau Halbleiter-Anordnung
US3609471A (en) * 1969-07-22 1971-09-28 Gen Electric Semiconductor device with thermally conductive dielectric barrier
US3699402A (en) * 1970-07-27 1972-10-17 Gen Electric Hybrid circuit power module
JPS5228547B2 (fr) * 1972-07-10 1977-07-27
DE2337694C2 (de) * 1973-07-25 1984-10-25 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichteranordnung hoher Strombelastbarkeit
US4009485A (en) * 1974-12-23 1977-02-22 General Electric Company Semiconductor pellet assembly mounted on ceramic substrate
DE7512573U (de) * 1975-04-19 1975-09-04 Semikron Gesellschaft Fuer Gleichri Halbleitergleichrichteranordnung
US3994430A (en) * 1975-07-30 1976-11-30 General Electric Company Direct bonding of metals to ceramics and metals
DE2617335A1 (de) * 1976-04-21 1977-11-03 Siemens Ag Halbleiterbauelement
DE2731211A1 (de) * 1977-07-11 1979-01-25 Semikron Gleichrichterbau Halbleiterbaueinheit

Also Published As

Publication number Publication date
DE3009295A1 (de) 1980-10-02
JPS55133562A (en) 1980-10-17
BR8001625A (pt) 1980-11-18
MX148428A (es) 1983-04-20
CH652533A5 (de) 1985-11-15
FR2452178A1 (fr) 1980-10-17
US4278990A (en) 1981-07-14

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Legal Events

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ST Notification of lapse