FR2574991B3 - Conditionnement pour circuits integres, ayant des possibilites de dissipation de chaleur ameliorees, et procede pour augmenter la dissipation de la chaleur - Google Patents

Conditionnement pour circuits integres, ayant des possibilites de dissipation de chaleur ameliorees, et procede pour augmenter la dissipation de la chaleur

Info

Publication number
FR2574991B3
FR2574991B3 FR8518623A FR8518623A FR2574991B3 FR 2574991 B3 FR2574991 B3 FR 2574991B3 FR 8518623 A FR8518623 A FR 8518623A FR 8518623 A FR8518623 A FR 8518623A FR 2574991 B3 FR2574991 B3 FR 2574991B3
Authority
FR
France
Prior art keywords
heat dissipation
packaging
integrated circuits
possibilities
improved heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8518623A
Other languages
English (en)
Other versions
FR2574991A3 (fr
Inventor
Marzio Fusaroli
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
SGS Microelettronica SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS Microelettronica SpA filed Critical SGS Microelettronica SpA
Publication of FR2574991A3 publication Critical patent/FR2574991A3/fr
Application granted granted Critical
Publication of FR2574991B3 publication Critical patent/FR2574991B3/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
FR8518623A 1984-12-18 1985-12-16 Conditionnement pour circuits integres, ayant des possibilites de dissipation de chaleur ameliorees, et procede pour augmenter la dissipation de la chaleur Expired FR2574991B3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8424125A IT1213259B (it) 1984-12-18 1984-12-18 Gruppo a telaio di conduttori per circuiti integrati con capacita' di termodispersione incrementata, erelativo procedimento.

Publications (2)

Publication Number Publication Date
FR2574991A3 FR2574991A3 (fr) 1986-06-20
FR2574991B3 true FR2574991B3 (fr) 1987-01-09

Family

ID=11212097

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8518623A Expired FR2574991B3 (fr) 1984-12-18 1985-12-16 Conditionnement pour circuits integres, ayant des possibilites de dissipation de chaleur ameliorees, et procede pour augmenter la dissipation de la chaleur

Country Status (7)

Country Link
US (1) US4947237A (fr)
JP (1) JPS61144855A (fr)
DE (1) DE8535408U1 (fr)
FR (1) FR2574991B3 (fr)
GB (1) GB2168533B (fr)
IT (1) IT1213259B (fr)
NL (1) NL8503487A (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2751450B2 (ja) * 1989-08-28 1998-05-18 セイコーエプソン株式会社 テープキャリアの実装構造及びその実装方法
JP2567961B2 (ja) * 1989-12-01 1996-12-25 株式会社日立製作所 半導体装置及びリ−ドフレ−ム
DE4021871C2 (de) * 1990-07-09 1994-07-28 Lsi Logic Products Gmbh Hochintegriertes elektronisches Bauteil
JP2816244B2 (ja) * 1990-07-11 1998-10-27 株式会社日立製作所 積層型マルチチップ半導体装置およびこれに用いる半導体装置
US5289032A (en) * 1991-08-16 1994-02-22 Motorola, Inc. Tape automated bonding(tab)semiconductor device and method for making the same
US5471077A (en) * 1991-10-10 1995-11-28 Hughes Aircraft Company High electron mobility transistor and methode of making
DE4137112A1 (de) * 1991-11-12 1993-05-13 Bayerische Motoren Werke Ag Lokale abschirmung von elektronischen bauteilen eines elektronischen steuergeraetes in einem kraftfahrzeug
US5457340A (en) * 1992-12-07 1995-10-10 Integrated Device Technology, Inc. Leadframe with power and ground planes
US7038305B1 (en) 2003-07-15 2006-05-02 Altera Corp. Package for integrated circuit die

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4066839A (en) * 1972-11-16 1978-01-03 Sgs-Ates Componenti Elettronici S.P.A. Molded body incorporating heat dissipator
FR2368868A7 (fr) * 1976-10-21 1978-05-19 Ates Componenti Elettron Dispositif a semi conducteurs en forme de boitier
JPS53135574A (en) * 1977-05-02 1978-11-27 Hitachi Ltd Lead frame
US4141029A (en) * 1977-12-30 1979-02-20 Texas Instruments Incorporated Integrated circuit device
US4331831A (en) * 1980-11-28 1982-05-25 Bell Telephone Laboratories, Incorporated Package for semiconductor integrated circuits
US4527185A (en) * 1981-01-12 1985-07-02 Avx Corporation Integrated circuit device and subassembly
CA1200619A (fr) * 1982-02-16 1986-02-11 William S. Phy Cadre de montage de circuit integre a dissipation de la chaleur amelioree

Also Published As

Publication number Publication date
GB8530654D0 (en) 1986-01-22
NL8503487A (nl) 1986-07-16
GB2168533B (en) 1989-01-11
US4947237A (en) 1990-08-07
DE8535408U1 (de) 1986-10-09
FR2574991A3 (fr) 1986-06-20
IT8424125A0 (it) 1984-12-18
IT1213259B (it) 1989-12-14
JPS61144855A (ja) 1986-07-02
GB2168533A (en) 1986-06-18

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