FR2584863B1 - Composant electronique durci vis-a-vis des radiations - Google Patents

Composant electronique durci vis-a-vis des radiations

Info

Publication number
FR2584863B1
FR2584863B1 FR8510722A FR8510722A FR2584863B1 FR 2584863 B1 FR2584863 B1 FR 2584863B1 FR 8510722 A FR8510722 A FR 8510722A FR 8510722 A FR8510722 A FR 8510722A FR 2584863 B1 FR2584863 B1 FR 2584863B1
Authority
FR
France
Prior art keywords
radiation
respect
electronic component
component hardened
hardened
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8510722A
Other languages
English (en)
Other versions
FR2584863A1 (fr
Inventor
Christian Val
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
D INFORMATIQUE MILITAIRE SPATIALE ET AERONAUTIQUE Cie
Original Assignee
D INFORMATIQUE MILITAIRE SPATIALE ET AERONAUTIQUE Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by D INFORMATIQUE MILITAIRE SPATIALE ET AERONAUTIQUE Cie filed Critical D INFORMATIQUE MILITAIRE SPATIALE ET AERONAUTIQUE Cie
Priority to FR8510722A priority Critical patent/FR2584863B1/fr
Publication of FR2584863A1 publication Critical patent/FR2584863A1/fr
Application granted granted Critical
Publication of FR2584863B1 publication Critical patent/FR2584863B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/25—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons against alpha rays, e.g. for outer space applications
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
FR8510722A 1985-07-12 1985-07-12 Composant electronique durci vis-a-vis des radiations Expired FR2584863B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8510722A FR2584863B1 (fr) 1985-07-12 1985-07-12 Composant electronique durci vis-a-vis des radiations

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8510722A FR2584863B1 (fr) 1985-07-12 1985-07-12 Composant electronique durci vis-a-vis des radiations

Publications (2)

Publication Number Publication Date
FR2584863A1 FR2584863A1 (fr) 1987-01-16
FR2584863B1 true FR2584863B1 (fr) 1988-10-21

Family

ID=9321255

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8510722A Expired FR2584863B1 (fr) 1985-07-12 1985-07-12 Composant electronique durci vis-a-vis des radiations

Country Status (1)

Country Link
FR (1) FR2584863B1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8018739B2 (en) 2003-07-16 2011-09-13 Maxwell Technologies, LLC Apparatus for shielding integrated circuit devices

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2597652B1 (fr) * 1986-04-16 1988-07-29 Aerospatiale Boitier de protection de circuits electroniques, durci vis-a-vis des rayons x
FR2667442B1 (fr) * 1989-10-23 1995-02-10 Commissariat Energie Atomique Semi-conducteurs pour composants microelectroniques a haute resistance contre les radiations ionisantes.
US5880403A (en) 1994-04-01 1999-03-09 Space Electronics, Inc. Radiation shielding of three dimensional multi-chip modules
US5635754A (en) * 1994-04-01 1997-06-03 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US6613978B2 (en) 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US5532122A (en) * 1993-10-12 1996-07-02 Biotraces, Inc. Quantitation of gamma and x-ray emitting isotopes
US6261508B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US6368899B1 (en) 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US7382043B2 (en) 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
FR2940521B1 (fr) 2008-12-19 2011-11-11 3D Plus Procede de fabrication collective de modules electroniques pour montage en surface

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1614876A1 (de) * 1967-10-14 1970-12-23 Telefunken Patent Halbleiteranordnung
JPS55163850A (en) * 1979-06-08 1980-12-20 Fujitsu Ltd Semiconductor device
JPS55166943A (en) * 1979-06-15 1980-12-26 Fujitsu Ltd Semiconductor device
FR2495837A1 (fr) * 1980-12-09 1982-06-11 Thomson Csf Embase de microboitier d'encapsulation et microboitier comportant une telle embase
DE3214991A1 (de) * 1982-04-22 1983-11-03 Siemens AG, 1000 Berlin und 8000 München Halbleiterbaustein mit diskretem kondensator
US4528212A (en) * 1982-07-22 1985-07-09 International Business Machines Corporation Coated ceramic substrates for mounting integrated circuits
FR2547113B1 (fr) * 1983-06-03 1986-11-07 Inf Milit Spatiale Aeronaut Boitier d'encapsulation de composant electronique, durci vis-a-vis des radiations

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8018739B2 (en) 2003-07-16 2011-09-13 Maxwell Technologies, LLC Apparatus for shielding integrated circuit devices

Also Published As

Publication number Publication date
FR2584863A1 (fr) 1987-01-16

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Legal Events

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