FR2628112B1 - Resines thermoresistantes et photosensibles de polyamide aromatique et procede pour leur preparation - Google Patents

Resines thermoresistantes et photosensibles de polyamide aromatique et procede pour leur preparation

Info

Publication number
FR2628112B1
FR2628112B1 FR8902716A FR8902716A FR2628112B1 FR 2628112 B1 FR2628112 B1 FR 2628112B1 FR 8902716 A FR8902716 A FR 8902716A FR 8902716 A FR8902716 A FR 8902716A FR 2628112 B1 FR2628112 B1 FR 2628112B1
Authority
FR
France
Prior art keywords
thermoresistant
preparation
aromatic polyamide
photosensitive resins
photosensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8902716A
Other languages
English (en)
Other versions
FR2628112A1 (fr
Inventor
Tsuguo Yamaoka
Yutaka Maruyama
Kentaro Tsutsumi
Haruhiko Komoriya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Central Glass Co Ltd
Original Assignee
Central Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63048726A external-priority patent/JP2542033B2/ja
Priority claimed from JP63104858A external-priority patent/JP2542041B2/ja
Application filed by Central Glass Co Ltd filed Critical Central Glass Co Ltd
Publication of FR2628112A1 publication Critical patent/FR2628112A1/fr
Application granted granted Critical
Publication of FR2628112B1 publication Critical patent/FR2628112B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/32—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from aromatic diamines and aromatic dicarboxylic acids with both amino and carboxylic groups aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/48—Polymers modified by chemical after-treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polyamides (AREA)
FR8902716A 1988-03-03 1989-03-02 Resines thermoresistantes et photosensibles de polyamide aromatique et procede pour leur preparation Expired - Fee Related FR2628112B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63048726A JP2542033B2 (ja) 1988-03-03 1988-03-03 芳香族ポリアミド樹脂およびこれを用いた耐熱性感光材料
JP63104858A JP2542041B2 (ja) 1988-04-27 1988-04-27 芳香族ポリアミド樹脂およびその製造法およびこれを用いた耐熱性感光材料

Publications (2)

Publication Number Publication Date
FR2628112A1 FR2628112A1 (fr) 1989-09-08
FR2628112B1 true FR2628112B1 (fr) 1992-11-13

Family

ID=26389033

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8902716A Expired - Fee Related FR2628112B1 (fr) 1988-03-03 1989-03-02 Resines thermoresistantes et photosensibles de polyamide aromatique et procede pour leur preparation

Country Status (4)

Country Link
DE (1) DE3906684A1 (fr)
FR (1) FR2628112B1 (fr)
GB (1) GB2216532B (fr)
IT (1) IT1228515B (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5114826A (en) * 1989-12-28 1992-05-19 Ibm Corporation Photosensitive polyimide compositions
DE59010552D1 (de) * 1990-03-29 1996-12-05 Siemens Ag Hochwärmebeständige Negativresists und Verfahren zur Herstellung hochwärmebeständiger Reliefstrukturen
EP0512339B1 (fr) * 1991-05-07 1997-10-15 Siemens Aktiengesellschaft Réserve positive stable à haute température et procédé d'obtention de structures en relief stables à la chaleur
DE4206949A1 (de) * 1992-03-05 1993-09-09 Basf Ag Formmassen auf der basis ungesaettigter copolyamide
DE4206948A1 (de) * 1992-03-05 1993-09-09 Basf Ag Formmassen auf der basis olefinische doppelbindungen enthaltender homo- und copolyamide
CN100347611C (zh) * 2001-07-03 2007-11-07 日立化成工业株式会社 感光树脂组合物以及利用该组合物制作图案的方法和电子元件
CN116768750B (zh) * 2023-06-19 2025-05-30 兰州大学 一种含可光固化肉桂酸酯基团的二酚单体及其制备方法、光敏聚芳醚酮及其制备方法和应用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3066117A (en) * 1957-02-08 1962-11-27 Bayer Ag Light-sensitive water soluble compounds
WO1980000706A1 (fr) * 1978-09-29 1980-04-17 Hitachi Ltd Composition polymere sensible a la lumiere
DE2933828A1 (de) * 1979-08-21 1981-03-12 Siemens AG, 1000 Berlin und 8000 München Polyoxazol-vorstufen sowie deren herstellung.
JPS60180197A (ja) * 1984-02-27 1985-09-13 宇部興産株式会社 多層プリント配線板の製造方法
GB2188936B (en) * 1986-03-06 1988-12-21 Central Glass Co Ltd Aromatic polyamides and polybenoxazoles having diphenylhexafluoropropane units

Also Published As

Publication number Publication date
GB2216532B (en) 1991-07-24
FR2628112A1 (fr) 1989-09-08
GB2216532A (en) 1989-10-11
IT8919593A0 (it) 1989-02-28
IT1228515B (it) 1991-06-20
GB8904786D0 (en) 1989-04-12
DE3906684A1 (de) 1989-09-21

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Legal Events

Date Code Title Description
ST Notification of lapse