FR2714080B1 - Dispositif pour le traitement électrochimique, notamment localisé, d'un substrat conducteur. - Google Patents

Dispositif pour le traitement électrochimique, notamment localisé, d'un substrat conducteur.

Info

Publication number
FR2714080B1
FR2714080B1 FR9315166A FR9315166A FR2714080B1 FR 2714080 B1 FR2714080 B1 FR 2714080B1 FR 9315166 A FR9315166 A FR 9315166A FR 9315166 A FR9315166 A FR 9315166A FR 2714080 B1 FR2714080 B1 FR 2714080B1
Authority
FR
France
Prior art keywords
electrochemical
treatment
conductive substrate
particular localized
localized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9315166A
Other languages
English (en)
Other versions
FR2714080A1 (fr
Inventor
Patrick Kerampran
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dalic Laboratoire SA
Original Assignee
Dalic Laboratoire SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dalic Laboratoire SA filed Critical Dalic Laboratoire SA
Priority to FR9315166A priority Critical patent/FR2714080B1/fr
Priority to US08/364,681 priority patent/US5571389A/en
Priority to DE69402952T priority patent/DE69402952T2/de
Priority to EP94402891A priority patent/EP0663461B1/fr
Publication of FR2714080A1 publication Critical patent/FR2714080A1/fr
Application granted granted Critical
Publication of FR2714080B1 publication Critical patent/FR2714080B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
FR9315166A 1993-12-16 1993-12-16 Dispositif pour le traitement électrochimique, notamment localisé, d'un substrat conducteur. Expired - Lifetime FR2714080B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR9315166A FR2714080B1 (fr) 1993-12-16 1993-12-16 Dispositif pour le traitement électrochimique, notamment localisé, d'un substrat conducteur.
US08/364,681 US5571389A (en) 1993-12-16 1994-12-13 Device for the electrochemical treatment especially the local electrochemical treatment, of conductive substrate
DE69402952T DE69402952T2 (de) 1993-12-16 1994-12-15 Vorrichtung zu einer insbesonderen selektiven elektrochemischen Behandlung eines leitenden Substrats
EP94402891A EP0663461B1 (fr) 1993-12-16 1994-12-15 Dispositif pour le traitement électrochimique, notamment localisé, d'un substrat conducteur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9315166A FR2714080B1 (fr) 1993-12-16 1993-12-16 Dispositif pour le traitement électrochimique, notamment localisé, d'un substrat conducteur.

Publications (2)

Publication Number Publication Date
FR2714080A1 FR2714080A1 (fr) 1995-06-23
FR2714080B1 true FR2714080B1 (fr) 1996-03-01

Family

ID=9454021

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9315166A Expired - Lifetime FR2714080B1 (fr) 1993-12-16 1993-12-16 Dispositif pour le traitement électrochimique, notamment localisé, d'un substrat conducteur.

Country Status (4)

Country Link
US (1) US5571389A (fr)
EP (1) EP0663461B1 (fr)
DE (1) DE69402952T2 (fr)
FR (1) FR2714080B1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109898112A (zh) * 2019-04-24 2019-06-18 浙江宏途电气科技有限公司 一种自动化电刷镀装置

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT411693B (de) * 2002-07-01 2004-04-26 Fronius Int Gmbh Elektrochemisches verfahren zum reinigen von oberflächen metallischer werkstücke
GB9400855D0 (en) * 1994-01-18 1994-03-16 Univ Warwick Electrochemical deposition device and apparatus and method of electrochemical deposition using the same
DE19809487A1 (de) * 1998-03-06 1999-09-09 Greising Verfahren und Vorrichtung zur Aufbringung einer räumlich begrenzten metallischen Deckschicht auf einer elektrisch leitenden Materialoberfläche
US6939447B2 (en) 1998-04-06 2005-09-06 Tdao Limited Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
GB2336161B (en) 1998-04-06 2003-03-26 John Michael Lowe Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
US6143156A (en) * 1998-07-24 2000-11-07 Cae Vanguard, Inc. Electroplating method and apparatus
DE59810471D1 (de) * 1998-08-07 2004-01-29 Fritz-Herbert Frembgen Verfahren und Vorrichtung zum elektrochemischen Bearbeiten von Werkstücken
DE19848296A1 (de) * 1998-10-12 2000-04-13 Peter Van Treeck Korrosionsstabile Anschlussklemme zur reversiblen Herstellung elektrischer Anschlüsse in Elektrolyten und anderen korrosiven Medien
JP2000232078A (ja) * 1999-02-10 2000-08-22 Toshiba Corp メッキ方法及びメッキ装置
US6538714B1 (en) * 1999-10-25 2003-03-25 3M Innovative Properties Company Dual color guest-host polarizers and devices containing guest-host polarizers
IT1311147B1 (it) * 1999-11-04 2002-03-04 Edk Res Ag Macchina per pulizia localizzata con cella, elettrolitica e/o adultrasuoni, di decapaggio e/o lucidatura
US20060263188A1 (en) * 2005-05-03 2006-11-23 Goldin Martin C Water dispensing system
JP4216892B1 (ja) * 2007-04-13 2009-01-28 優章 荒井 電解水の製造装置、電解水の製造方法および電解水
JP5883562B2 (ja) * 2008-02-27 2016-03-15 スミス アンド ネフュー インコーポレーテッド 蠕動ポンプ装置及び方法
FR2991343B1 (fr) 2012-06-01 2014-05-16 Dalic Dispositif pour le traitement electrochimique, notamment localise, d'un substrat conducteur
CN103160891B (zh) * 2013-03-22 2015-08-12 北京联泰信科铁路信通技术有限公司 铁路钢轨面刷镀导电金属的方法及设备
US9393759B2 (en) * 2013-10-24 2016-07-19 General Electric Company Metal laminate structures with systems and methods for treating
GB2535805A (en) * 2015-02-27 2016-08-31 Biomet Uk Healthcare Ltd Apparatus and method for selectively treating a surface of a component
JP6496015B2 (ja) * 2015-05-08 2019-04-03 株式会社日立製作所 湿式表面処理装置
GB2572402B (en) * 2018-03-29 2020-06-17 Hodges & Drake Design Ltd A pumping apparatus with first and second peristaltic pumps
DE102018109531A1 (de) * 2018-04-20 2019-10-24 Christian-Albrechts-Universität Zu Kiel Klebe-Fügevorrichtung sowie Klebe-Fügeverfahren für eine metallische Oberfläche
US11883626B2 (en) 2019-06-27 2024-01-30 Boston Scientific Scimed, Inc. Detection of an endoscope to a fluid management system
CN118787807A (zh) 2019-10-30 2024-10-18 波士顿科学医疗设备有限公司 流体监测系统
KR102254027B1 (ko) * 2019-11-28 2021-05-20 (주)천우테크 고정식 대형 스테인리스스틸 저장탱크 내부의 표면처리를 할 수 있는 이동식 전해연마 시스템
KR102355394B1 (ko) * 2020-03-09 2022-01-26 (주)한국마루이 휴대용 음극판 구조 및 이를 포함하는 전해연마 장치
KR20250144498A (ko) 2020-07-30 2025-10-10 보스톤 싸이엔티픽 싸이메드 인코포레이티드 레이저 섬유 냉각이 통합된 유체 관리 시스템
US12139809B2 (en) 2021-01-13 2024-11-12 Corrdesa, LLC Electrochemical treatment system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3294664A (en) * 1963-09-03 1966-12-27 Hoover Co Electrolytic appliance for treating surfaces
FI821438A7 (fi) * 1982-04-26 1983-10-27 Labsystems Oy Nestekäsittelijä.
JPS62211396A (ja) * 1985-11-11 1987-09-17 Electroplating Eng Of Japan Co コネクタ−端子の微小部分のメツキ装置
DE3839223C2 (de) * 1988-11-19 1994-10-20 Degussa Vorrichtung zur selektiven galvanischen Beschichtung
CH684840A5 (fr) * 1991-06-11 1995-01-13 Electroplating Eng Eesa Cellule pour plaquer par voie électrolytique sélectivement des zones choisies de pièces métalliques disposées en bande.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109898112A (zh) * 2019-04-24 2019-06-18 浙江宏途电气科技有限公司 一种自动化电刷镀装置
CN109898112B (zh) * 2019-04-24 2020-07-21 温岭市中天自动化设备有限公司 一种自动化电刷镀装置

Also Published As

Publication number Publication date
DE69402952D1 (de) 1997-06-05
US5571389A (en) 1996-11-05
EP0663461A1 (fr) 1995-07-19
FR2714080A1 (fr) 1995-06-23
EP0663461B1 (fr) 1997-05-02
DE69402952T2 (de) 1997-11-27

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