FR2769923B1 - Procede ameliore de metallisation a chaud - Google Patents

Procede ameliore de metallisation a chaud

Info

Publication number
FR2769923B1
FR2769923B1 FR9713047A FR9713047A FR2769923B1 FR 2769923 B1 FR2769923 B1 FR 2769923B1 FR 9713047 A FR9713047 A FR 9713047A FR 9713047 A FR9713047 A FR 9713047A FR 2769923 B1 FR2769923 B1 FR 2769923B1
Authority
FR
France
Prior art keywords
metallization process
improved hot
hot metallization
improved
metallization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9713047A
Other languages
English (en)
Other versions
FR2769923A1 (fr
Inventor
Sam G Geha
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cypress Semiconductor Corp
Original Assignee
Cypress Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cypress Semiconductor Corp filed Critical Cypress Semiconductor Corp
Priority to FR9713047A priority Critical patent/FR2769923B1/fr
Publication of FR2769923A1 publication Critical patent/FR2769923A1/fr
Application granted granted Critical
Publication of FR2769923B1 publication Critical patent/FR2769923B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
FR9713047A 1997-10-17 1997-10-17 Procede ameliore de metallisation a chaud Expired - Fee Related FR2769923B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9713047A FR2769923B1 (fr) 1997-10-17 1997-10-17 Procede ameliore de metallisation a chaud

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9713047A FR2769923B1 (fr) 1997-10-17 1997-10-17 Procede ameliore de metallisation a chaud

Publications (2)

Publication Number Publication Date
FR2769923A1 FR2769923A1 (fr) 1999-04-23
FR2769923B1 true FR2769923B1 (fr) 2001-12-28

Family

ID=9512376

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9713047A Expired - Fee Related FR2769923B1 (fr) 1997-10-17 1997-10-17 Procede ameliore de metallisation a chaud

Country Status (1)

Country Link
FR (1) FR2769923B1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4970176A (en) * 1989-09-29 1990-11-13 Motorola, Inc. Multiple step metallization process
US5108570A (en) * 1990-03-30 1992-04-28 Applied Materials, Inc. Multistep sputtering process for forming aluminum layer over stepped semiconductor wafer
KR940011708B1 (ko) * 1990-04-09 1994-12-23 니찌덴 아네루바 가부시끼가이샤 기판온도제어기구
JPH07109030B2 (ja) * 1991-02-12 1995-11-22 アプライド マテリアルズ インコーポレイテッド 半導体ウェーハ上にアルミニウム層をスパッタする方法
KR100188454B1 (ko) * 1991-05-28 1999-06-01 이노우에 아키라 기판 처리 장치
US5360524A (en) * 1993-04-13 1994-11-01 Rudi Hendel Method for planarization of submicron vias and the manufacture of semiconductor integrated circuits
US5810933A (en) * 1996-02-16 1998-09-22 Novellus Systems, Inc. Wafer cooling device

Also Published As

Publication number Publication date
FR2769923A1 (fr) 1999-04-23

Similar Documents

Publication Publication Date Title
FI972727A7 (fi) Menetelmä propeenin kopolymeerien valmistamiseksi
DE69631032D1 (de) Beheizte bekleidung
DE69912178D1 (de) Heizjacke
DE69922587D1 (de) Übertragungsverfahren
DE69813177D1 (de) Heissschmelz-tintenstraltintezusammensetzung
ATA192095A (de) Warmwasserheizung
EP1003615A4 (fr) Procede de passivation de couche de metallisation
DE69933650D1 (de) Transfermaschine
DE69939159D1 (de) Miniaturisierte abfallwärmemaschine
FR2773027B1 (fr) Procede de signature numerique
MA24472A1 (fr) Procede
MA24470A1 (fr) Procede
NO974578D0 (no) Fremgangsmåte for fremstilling av et kölleskaft
FI982822L (fi) Lyhyen kierron prosessijärjestely
ATA139397A (de) Heizkreisverteiler
FR2761528B1 (fr) Procede de depot de metallisation
KR960016703U (ko) 열전사기
KR960030079U (ko) 가열식 착유기
FR2752331B1 (fr) Procede de fabrication de siliciure auto-aligne ameliore
KR970021276U (ko) 원적외선 열전사기
IT1290296B1 (it) Deposito perfezionato per produttori-accumulatori di acqua calda sanitaria
KR970000756U (ko) 드럼식 열전사기
ITMI951782A0 (it) Macchina termica ad alimentazione multipla
KR960032128U (ko) 여과기를 겸한 난방용 온수분배기
TW338318U (en) A cold/hot healing bar

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20100630