FR2801122B1 - Carte a memoire du type sans contact et procedes de fabrication d'une telle carte - Google Patents

Carte a memoire du type sans contact et procedes de fabrication d'une telle carte

Info

Publication number
FR2801122B1
FR2801122B1 FR9914342A FR9914342A FR2801122B1 FR 2801122 B1 FR2801122 B1 FR 2801122B1 FR 9914342 A FR9914342 A FR 9914342A FR 9914342 A FR9914342 A FR 9914342A FR 2801122 B1 FR2801122 B1 FR 2801122B1
Authority
FR
France
Prior art keywords
card
manufacturing
methods
contact type
type memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9914342A
Other languages
English (en)
Other versions
FR2801122A1 (fr
Inventor
Benoit Thevenot
Pascal Billebaud
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axalto SA
Original Assignee
Schlumberger Systemes SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger Systemes SA filed Critical Schlumberger Systemes SA
Priority to FR9914342A priority Critical patent/FR2801122B1/fr
Publication of FR2801122A1 publication Critical patent/FR2801122A1/fr
Application granted granted Critical
Publication of FR2801122B1 publication Critical patent/FR2801122B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
FR9914342A 1999-11-16 1999-11-16 Carte a memoire du type sans contact et procedes de fabrication d'une telle carte Expired - Fee Related FR2801122B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9914342A FR2801122B1 (fr) 1999-11-16 1999-11-16 Carte a memoire du type sans contact et procedes de fabrication d'une telle carte

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9914342A FR2801122B1 (fr) 1999-11-16 1999-11-16 Carte a memoire du type sans contact et procedes de fabrication d'une telle carte

Publications (2)

Publication Number Publication Date
FR2801122A1 FR2801122A1 (fr) 2001-05-18
FR2801122B1 true FR2801122B1 (fr) 2004-02-20

Family

ID=9552137

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9914342A Expired - Fee Related FR2801122B1 (fr) 1999-11-16 1999-11-16 Carte a memoire du type sans contact et procedes de fabrication d'une telle carte

Country Status (1)

Country Link
FR (1) FR2801122B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1734799A1 (fr) * 2005-06-13 2006-12-20 MBBS Holding SA Transpondeur passif compact

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4410732C2 (de) * 1994-03-28 1997-05-07 Amatech Gmbh & Co Kg Verfahren zur Anordnung einer zumindest einen Chip und eine Drahtspule aufweisenden Transpondereinheit auf einem Substrat sowie Chipkarte mit entsprechend angeordneter Transpondereinheit
DE4431605C2 (de) * 1994-09-05 1998-06-04 Siemens Ag Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten
DE19642378C2 (de) * 1996-10-14 2000-06-08 Fraunhofer Ges Forschung Kontaktlose Chipkarte
FR2756955B1 (fr) * 1996-12-11 1999-01-08 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact

Also Published As

Publication number Publication date
FR2801122A1 (fr) 2001-05-18

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Legal Events

Date Code Title Description
CA Change of address
CD Change of name or company name
ST Notification of lapse

Effective date: 20090731