FR2809228B1 - Moule d'injection pour la fabrication d'un boitier semi- conducteur optique et boitier semi-conducteur optique - Google Patents

Moule d'injection pour la fabrication d'un boitier semi- conducteur optique et boitier semi-conducteur optique

Info

Publication number
FR2809228B1
FR2809228B1 FR0006513A FR0006513A FR2809228B1 FR 2809228 B1 FR2809228 B1 FR 2809228B1 FR 0006513 A FR0006513 A FR 0006513A FR 0006513 A FR0006513 A FR 0006513A FR 2809228 B1 FR2809228 B1 FR 2809228B1
Authority
FR
France
Prior art keywords
semiconductor package
optical semiconductor
manufacture
injection mold
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0006513A
Other languages
English (en)
Other versions
FR2809228A1 (fr
Inventor
Christophe Prior
Jonathan Abela
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to FR0006513A priority Critical patent/FR2809228B1/fr
Priority to US09/862,984 priority patent/US6858933B2/en
Publication of FR2809228A1 publication Critical patent/FR2809228A1/fr
Application granted granted Critical
Publication of FR2809228B1 publication Critical patent/FR2809228B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
FR0006513A 2000-05-22 2000-05-22 Moule d'injection pour la fabrication d'un boitier semi- conducteur optique et boitier semi-conducteur optique Expired - Fee Related FR2809228B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0006513A FR2809228B1 (fr) 2000-05-22 2000-05-22 Moule d'injection pour la fabrication d'un boitier semi- conducteur optique et boitier semi-conducteur optique
US09/862,984 US6858933B2 (en) 2000-05-22 2001-05-22 Injection mold for an optical semiconductor package and corresponding optical semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0006513A FR2809228B1 (fr) 2000-05-22 2000-05-22 Moule d'injection pour la fabrication d'un boitier semi- conducteur optique et boitier semi-conducteur optique

Publications (2)

Publication Number Publication Date
FR2809228A1 FR2809228A1 (fr) 2001-11-23
FR2809228B1 true FR2809228B1 (fr) 2003-10-17

Family

ID=8850475

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0006513A Expired - Fee Related FR2809228B1 (fr) 2000-05-22 2000-05-22 Moule d'injection pour la fabrication d'un boitier semi- conducteur optique et boitier semi-conducteur optique

Country Status (2)

Country Link
US (1) US6858933B2 (fr)
FR (1) FR2809228B1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2820240B1 (fr) * 2001-01-26 2004-07-16 St Microelectronics Sa Substrat support de puce a circuits integres adapte pour etre place dans un moule
SG132533A1 (en) 2005-11-21 2007-06-28 St Microelectronics Asia Ultra-thin quad flat no-lead (qfn) package and method of fabricating the same
TWI570857B (zh) * 2014-12-10 2017-02-11 矽品精密工業股份有限公司 封裝結構及其製法
US9355870B1 (en) 2015-01-15 2016-05-31 Silicon Laboratories Inc. Integrated circuit with sensor area and resin dam

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4644384A (en) * 1984-02-02 1987-02-17 National Semiconductor Corporation Apparatus and method for packaging eprom integrated circuits
JPH01255514A (ja) * 1988-04-05 1989-10-12 Pioneer Electron Corp トランスファーモールド金型
FR2650530B1 (fr) * 1989-08-07 1991-11-29 Schlumberger Ind Sa Procede de realisation de corps de carte avec graphisme
JP3161142B2 (ja) * 1993-03-26 2001-04-25 ソニー株式会社 半導体装置
JPH07214600A (ja) * 1994-02-02 1995-08-15 Fuji Electric Co Ltd 透明樹脂封止型半導体装置の成形用金型
JPH07254623A (ja) * 1994-03-16 1995-10-03 Sony Corp 光電変換装置及びその製造方法
JP3329145B2 (ja) * 1995-06-28 2002-09-30 株式会社デンソー 光センサの製造方法
JPH09191022A (ja) * 1996-01-09 1997-07-22 Sony Corp 半導体樹脂封止用金型及び半導体製造方法
DE19607212C1 (de) * 1996-02-26 1997-04-10 Richard Herbst Verbundkörper, Verfahren und Kunststoff-Spritzgießwerkzeug zur Herstellung eines solchen

Also Published As

Publication number Publication date
US20020043703A1 (en) 2002-04-18
US6858933B2 (en) 2005-02-22
FR2809228A1 (fr) 2001-11-23

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20080131