FR2810768B1 - Procede de fabrication de cartes a puce hybrides et cartes a puce obtenues par ledit procede - Google Patents

Procede de fabrication de cartes a puce hybrides et cartes a puce obtenues par ledit procede

Info

Publication number
FR2810768B1
FR2810768B1 FR0008188A FR0008188A FR2810768B1 FR 2810768 B1 FR2810768 B1 FR 2810768B1 FR 0008188 A FR0008188 A FR 0008188A FR 0008188 A FR0008188 A FR 0008188A FR 2810768 B1 FR2810768 B1 FR 2810768B1
Authority
FR
France
Prior art keywords
chip cards
manufacturing hybrid
manufacturing
hybrid chip
cards obtained
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0008188A
Other languages
English (en)
Other versions
FR2810768A1 (fr
Inventor
Philippe Patrice
Michael Zafrany
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Priority to FR0008188A priority Critical patent/FR2810768B1/fr
Priority to PCT/FR2001/001798 priority patent/WO2002001495A1/fr
Priority to AU2001267626A priority patent/AU2001267626A1/en
Publication of FR2810768A1 publication Critical patent/FR2810768A1/fr
Application granted granted Critical
Publication of FR2810768B1 publication Critical patent/FR2810768B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
FR0008188A 2000-06-26 2000-06-26 Procede de fabrication de cartes a puce hybrides et cartes a puce obtenues par ledit procede Expired - Fee Related FR2810768B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR0008188A FR2810768B1 (fr) 2000-06-26 2000-06-26 Procede de fabrication de cartes a puce hybrides et cartes a puce obtenues par ledit procede
PCT/FR2001/001798 WO2002001495A1 (fr) 2000-06-26 2001-06-08 Carte hybride a ensemble de contact ohmique et puits delocalises
AU2001267626A AU2001267626A1 (en) 2000-06-26 2001-06-08 Hybrid card with ohmic contact and delocalized sinks

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0008188A FR2810768B1 (fr) 2000-06-26 2000-06-26 Procede de fabrication de cartes a puce hybrides et cartes a puce obtenues par ledit procede

Publications (2)

Publication Number Publication Date
FR2810768A1 FR2810768A1 (fr) 2001-12-28
FR2810768B1 true FR2810768B1 (fr) 2003-11-28

Family

ID=8851692

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0008188A Expired - Fee Related FR2810768B1 (fr) 2000-06-26 2000-06-26 Procede de fabrication de cartes a puce hybrides et cartes a puce obtenues par ledit procede

Country Status (3)

Country Link
AU (1) AU2001267626A1 (fr)
FR (1) FR2810768B1 (fr)
WO (1) WO2002001495A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1451893A1 (fr) 2001-12-10 2004-09-01 Fractus, S.A. Dispositif d'identification sans contact
CN1723587A (zh) 2002-11-07 2006-01-18 碎云股份有限公司 含微型天线的集成电路封装
US8330259B2 (en) 2004-07-23 2012-12-11 Fractus, S.A. Antenna in package with reduced electromagnetic interaction with on chip elements
WO2007147629A1 (fr) 2006-06-23 2007-12-27 Fractus, S.A. Module de puce, carte sim, dispositif sans fil et procédé de communication sans fil
FR3013504B1 (fr) 2013-11-18 2022-06-10 Interplex Microtech Procede de fabrication d'un support d'une puce electronique, support de puce et ensemble de tels supports
FR3021145B1 (fr) 2014-05-14 2018-08-31 Linxens Holding Procede de fabrication d'un circuit pour module de carte a puce et circuit pour module de carte a puce
FR3083892B1 (fr) * 2018-07-16 2020-07-03 Smart Packaging Solutions Carte a puce a double interface de communication et son procede de fabrication
FR3123778B1 (fr) * 2021-06-07 2025-01-17 Eyco Procédé de fabrication d’un circuit imprimé intégrant un composant électronique et module de carte à puce obtenu par ledit procédé.
FR3142579B1 (fr) 2022-11-30 2025-08-01 Smart Packaging Solutions Module électronique à puces multiples pour carte à puce sans contact

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19610044C2 (de) * 1996-03-14 2000-02-24 Pav Card Gmbh Kartenkörper und Verfahren zur Herstellung einer Chipkarte
EP0818752A2 (fr) * 1996-07-08 1998-01-14 Fela Holding AG Carte à circuits (Inlet) pour des cartes à puces
FR2753819B1 (fr) * 1996-09-20 1998-11-27 Carte a circuit integre a connexion mixte
FR2769389B1 (fr) * 1997-10-07 2000-01-28 Rue Cartes Et Systemes De Carte a microcircuit combinant des plages de contact exterieur et une antenne, et procede de fabrication d'une telle carte

Also Published As

Publication number Publication date
WO2002001495A1 (fr) 2002-01-03
FR2810768A1 (fr) 2001-12-28
AU2001267626A1 (en) 2002-01-08

Similar Documents

Publication Publication Date Title
FR2798209B1 (fr) Procede de fabrication de cartes a puce
FR2798220B1 (fr) Inductance et procede de fabrication
FR2853115B1 (fr) Procede de fabrication d'antenne de carte a puce sur un support thermoplastique et carte a puce obtenue par ledit procede
EP1657723A4 (fr) Memoire a semi-conducteurs et procede de fonctionnement de memoire a semi-conducteurs
EP1311002A4 (fr) Dispositif luminescent a semi-conducteur et procede de fabrication correspondant
EP1605509A4 (fr) Dispositif a semi-conducteurs, procede de production de celui-ci et dispositif d'imagerie
EP0983136A4 (fr) Procede de fabrication de carte a microprocesseur
NO20004177D0 (no) Intervensjonsmodul for en brønn
FR2825834B1 (fr) Procede de fabrication d'un disositif a semi-conducteur
EP1592053A4 (fr) Procede de fabrication d'un cablage
EP1087447A4 (fr) Puce a semiconducteur photoemettrice
EP1090533A4 (fr) Procede de fabrication d'un module puce de chauffe
EP1335425A4 (fr) Dispositif a semi-conducteurs et procede de production dudit dispositif
FR2788375B1 (fr) Procede de protection de puce de circuit integre
EP1253607A4 (fr) Piece d'inductance et son procede de fabrication
MA26301A1 (fr) Procede et dispositif pour la fabrication de poils
FR2776796B1 (fr) Procede de fabrication de cartes a puce
EP1261040A4 (fr) Dispositif a semiconducteur et son procede de fabrication
FR2810768B1 (fr) Procede de fabrication de cartes a puce hybrides et cartes a puce obtenues par ledit procede
EP1667215A4 (fr) Procede de gravure a sec et procede de fabrication de dispositif a memoire magnetique
FI20001612L (fi) Menetelmä kuitulevyjen valmistamiseksi
EP1164640A4 (fr) Dispositif a semiconducteur et procede de fabrication correspondant
DE60017634D1 (de) Herstellungsverfahren für eine Chip-Induktivität
FR2834922B1 (fr) Procede de fabrication d'un element structurel et element prevu par ledit procede
FR2884645B1 (fr) Procede de realisation d'un circuit integre comprenant un condensateur

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20100226