FR2818404B1 - Procede de programmation de l'adresse d'un peripherique et peripherique pour sa mise en oeuvre - Google Patents

Procede de programmation de l'adresse d'un peripherique et peripherique pour sa mise en oeuvre

Info

Publication number
FR2818404B1
FR2818404B1 FR0016566A FR0016566A FR2818404B1 FR 2818404 B1 FR2818404 B1 FR 2818404B1 FR 0016566 A FR0016566 A FR 0016566A FR 0016566 A FR0016566 A FR 0016566A FR 2818404 B1 FR2818404 B1 FR 2818404B1
Authority
FR
France
Prior art keywords
programming
address
implementation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0016566A
Other languages
English (en)
Other versions
FR2818404A1 (fr
Inventor
Christophe Bruzy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Climatisation SA
Original Assignee
Valeo Climatisation SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Climatisation SA filed Critical Valeo Climatisation SA
Priority to FR0016566A priority Critical patent/FR2818404B1/fr
Priority to PCT/FR2001/003952 priority patent/WO2002050906A1/fr
Publication of FR2818404A1 publication Critical patent/FR2818404A1/fr
Application granted granted Critical
Publication of FR2818404B1 publication Critical patent/FR2818404B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/029—Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/641—Adaptable interconnections, e.g. fuses or antifuses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09927—Machine readable code, e.g. bar code
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Air-Conditioning For Vehicles (AREA)
FR0016566A 2000-12-19 2000-12-19 Procede de programmation de l'adresse d'un peripherique et peripherique pour sa mise en oeuvre Expired - Fee Related FR2818404B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0016566A FR2818404B1 (fr) 2000-12-19 2000-12-19 Procede de programmation de l'adresse d'un peripherique et peripherique pour sa mise en oeuvre
PCT/FR2001/003952 WO2002050906A1 (fr) 2000-12-19 2001-12-11 Procede de programmation de l'adresse d'un peripherique et peripherique pour sa mise en oeuvre

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0016566A FR2818404B1 (fr) 2000-12-19 2000-12-19 Procede de programmation de l'adresse d'un peripherique et peripherique pour sa mise en oeuvre

Publications (2)

Publication Number Publication Date
FR2818404A1 FR2818404A1 (fr) 2002-06-21
FR2818404B1 true FR2818404B1 (fr) 2003-03-21

Family

ID=8857851

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0016566A Expired - Fee Related FR2818404B1 (fr) 2000-12-19 2000-12-19 Procede de programmation de l'adresse d'un peripherique et peripherique pour sa mise en oeuvre

Country Status (2)

Country Link
FR (1) FR2818404B1 (fr)
WO (1) WO2002050906A1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51138179A (en) * 1975-05-23 1976-11-29 Seiko Instr & Electronics Ltd Semi-conductor device
JPH04280695A (ja) * 1991-03-08 1992-10-06 Hitachi Ltd 高集積半導体装置及びそれを用いた半導体モジュール
JP2776365B2 (ja) * 1996-04-04 1998-07-16 日本電気株式会社 多段接続型半導体用キャリヤーとそれを用いた半導体装置、及びその製造方法
JP2956647B2 (ja) * 1997-04-21 1999-10-04 日本電気株式会社 半導体装置用キャリヤ及びそれを用いた半導体装置

Also Published As

Publication number Publication date
WO2002050906A1 (fr) 2002-06-27
FR2818404A1 (fr) 2002-06-21

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Legal Events

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Year of fee payment: 16

PLFP Fee payment

Year of fee payment: 17

ST Notification of lapse

Effective date: 20180831