FR2822326B1 - Camera electronique a faible cout en technologie des circuits integres - Google Patents

Camera electronique a faible cout en technologie des circuits integres

Info

Publication number
FR2822326B1
FR2822326B1 FR0103626A FR0103626A FR2822326B1 FR 2822326 B1 FR2822326 B1 FR 2822326B1 FR 0103626 A FR0103626 A FR 0103626A FR 0103626 A FR0103626 A FR 0103626A FR 2822326 B1 FR2822326 B1 FR 2822326B1
Authority
FR
France
Prior art keywords
sensor
light images
integrated circuit
optics unit
low cost
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0103626A
Other languages
English (en)
Other versions
FR2822326A1 (fr
Inventor
Pierre Cambou
Gilles Simon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teledyne e2v Semiconductors SAS
Original Assignee
Atmel Grenoble SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atmel Grenoble SA filed Critical Atmel Grenoble SA
Priority to FR0103626A priority Critical patent/FR2822326B1/fr
Priority to EP02718261A priority patent/EP1374315A1/fr
Priority to CA002440947A priority patent/CA2440947A1/fr
Priority to US10/469,873 priority patent/US20040080658A1/en
Priority to JP2002574129A priority patent/JP2004522346A/ja
Priority to PCT/FR2002/000936 priority patent/WO2002075815A1/fr
Publication of FR2822326A1 publication Critical patent/FR2822326A1/fr
Application granted granted Critical
Publication of FR2822326B1 publication Critical patent/FR2822326B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)
FR0103626A 2001-03-16 2001-03-16 Camera electronique a faible cout en technologie des circuits integres Expired - Fee Related FR2822326B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FR0103626A FR2822326B1 (fr) 2001-03-16 2001-03-16 Camera electronique a faible cout en technologie des circuits integres
EP02718261A EP1374315A1 (fr) 2001-03-16 2002-03-15 Camera electronique a faible cout en technologie des circuits integres
CA002440947A CA2440947A1 (fr) 2001-03-16 2002-03-15 Camera electronique a faible cout en technologie des circuits integres
US10/469,873 US20040080658A1 (en) 2001-03-16 2002-03-15 Low cost electronic camera made using integrated circuit technology
JP2002574129A JP2004522346A (ja) 2001-03-16 2002-03-15 集積回路技術による安価な電子カメラ
PCT/FR2002/000936 WO2002075815A1 (fr) 2001-03-16 2002-03-15 Camera electronique a faible cout en technologie des circuits integres

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0103626A FR2822326B1 (fr) 2001-03-16 2001-03-16 Camera electronique a faible cout en technologie des circuits integres

Publications (2)

Publication Number Publication Date
FR2822326A1 FR2822326A1 (fr) 2002-09-20
FR2822326B1 true FR2822326B1 (fr) 2003-07-04

Family

ID=8861230

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0103626A Expired - Fee Related FR2822326B1 (fr) 2001-03-16 2001-03-16 Camera electronique a faible cout en technologie des circuits integres

Country Status (6)

Country Link
US (1) US20040080658A1 (fr)
EP (1) EP1374315A1 (fr)
JP (1) JP2004522346A (fr)
CA (1) CA2440947A1 (fr)
FR (1) FR2822326B1 (fr)
WO (1) WO2002075815A1 (fr)

Families Citing this family (50)

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JP3821652B2 (ja) * 2001-02-26 2006-09-13 三菱電機株式会社 撮像装置
JP2005533451A (ja) * 2002-07-18 2005-11-04 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ カメラモジュール、カメラモジュール中で使用されるホルダ、カメラシステム及びカメラモジュールの製造方法
CN100380924C (zh) 2002-07-18 2008-04-09 皇家飞利浦电子股份有限公司 照相机模块,供照相机模块中使用的固定器,照相机系统以及制造照相机模块的方法
US7473218B2 (en) 2002-08-06 2009-01-06 Olympus Corporation Assembling method of capsule medical apparatus
US20040061799A1 (en) 2002-09-27 2004-04-01 Konica Corporation Image pickup device and portable terminal equipped therewith
WO2004057677A2 (fr) * 2002-12-20 2004-07-08 Em Microelectronic-Marin Sa Structure a circuit integre ayant une partie optoelectronique recouverte par un capot a passage de lumiere
FR2854496B1 (fr) * 2003-04-29 2005-09-16 St Microelectronics Sa Boitier semi-conducteur
FR2854498B1 (fr) 2003-04-29 2005-09-16 St Microelectronics Sa Boitier semi-conducteur a capteur optique s'installant a l'interieur d'un objet.
US6934065B2 (en) 2003-09-18 2005-08-23 Micron Technology, Inc. Microelectronic devices and methods for packaging microelectronic devices
DE10344760A1 (de) * 2003-09-26 2005-05-04 Siemens Ag Optisches Modul und optisches System
FR2861217B1 (fr) * 2003-10-21 2006-03-17 St Microelectronics Sa Dispositif optique pour boitier semi-conducteur optique et procede de fabrication.
US7583862B2 (en) * 2003-11-26 2009-09-01 Aptina Imaging Corporation Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7091571B1 (en) * 2003-12-11 2006-08-15 Amkor Technology, Inc. Image sensor package and method for manufacture thereof
US7821564B2 (en) * 2003-12-30 2010-10-26 Given Imaging Ltd. Assembly for aligning an optical system
US7253397B2 (en) 2004-02-23 2007-08-07 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US8092734B2 (en) 2004-05-13 2012-01-10 Aptina Imaging Corporation Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers
US7253957B2 (en) 2004-05-13 2007-08-07 Micron Technology, Inc. Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers
US20050275750A1 (en) 2004-06-09 2005-12-15 Salman Akram Wafer-level packaged microelectronic imagers and processes for wafer-level packaging
US7498647B2 (en) 2004-06-10 2009-03-03 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7262405B2 (en) 2004-06-14 2007-08-28 Micron Technology, Inc. Prefabricated housings for microelectronic imagers
US7199439B2 (en) 2004-06-14 2007-04-03 Micron Technology, Inc. Microelectronic imagers and methods of packaging microelectronic imagers
US7232754B2 (en) 2004-06-29 2007-06-19 Micron Technology, Inc. Microelectronic devices and methods for forming interconnects in microelectronic devices
US7294897B2 (en) 2004-06-29 2007-11-13 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7416913B2 (en) 2004-07-16 2008-08-26 Micron Technology, Inc. Methods of manufacturing microelectronic imaging units with discrete standoffs
US7189954B2 (en) 2004-07-19 2007-03-13 Micron Technology, Inc. Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
US7402453B2 (en) 2004-07-28 2008-07-22 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US7364934B2 (en) 2004-08-10 2008-04-29 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US7397066B2 (en) 2004-08-19 2008-07-08 Micron Technology, Inc. Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers
US7223626B2 (en) 2004-08-19 2007-05-29 Micron Technology, Inc. Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers
US7425499B2 (en) 2004-08-24 2008-09-16 Micron Technology, Inc. Methods for forming interconnects in vias and microelectronic workpieces including such interconnects
US7115961B2 (en) 2004-08-24 2006-10-03 Micron Technology, Inc. Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
US7429494B2 (en) 2004-08-24 2008-09-30 Micron Technology, Inc. Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers
US7276393B2 (en) 2004-08-26 2007-10-02 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US7511262B2 (en) 2004-08-30 2009-03-31 Micron Technology, Inc. Optical device and assembly for use with imaging dies, and wafer-label imager assembly
US20070148807A1 (en) 2005-08-22 2007-06-28 Salman Akram Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers
US7646075B2 (en) 2004-08-31 2010-01-12 Micron Technology, Inc. Microelectronic imagers having front side contacts
US7300857B2 (en) 2004-09-02 2007-11-27 Micron Technology, Inc. Through-wafer interconnects for photoimager and memory wafers
US7271482B2 (en) 2004-12-30 2007-09-18 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US7303931B2 (en) 2005-02-10 2007-12-04 Micron Technology, Inc. Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces
US7190039B2 (en) 2005-02-18 2007-03-13 Micron Technology, Inc. Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers
US7795134B2 (en) 2005-06-28 2010-09-14 Micron Technology, Inc. Conductive interconnect structures and formation methods using supercritical fluids
US7288757B2 (en) 2005-09-01 2007-10-30 Micron Technology, Inc. Microelectronic imaging devices and associated methods for attaching transmissive elements
US7262134B2 (en) 2005-09-01 2007-08-28 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
KR100700507B1 (ko) * 2006-06-02 2007-03-28 (주)모비솔 초소형 일체형 광학장치
EP2529333A4 (fr) * 2010-01-28 2013-10-23 Pathway Innovations And Technologies Inc Système d'imagerie documentaire comportant un appareil caméra-scanneur et un logiciel de traitement basé sur un ordinateur personnel
DE102010047106A1 (de) * 2010-10-01 2012-04-05 Conti Temic Microelectronic Gmbh Optische Vorrichtung mit Justageelement
FR3037190B1 (fr) * 2015-06-02 2017-06-16 Radiall Sa Module optoelectronique pour liaison optique sans contact mecanique, ensemble de modules, systeme d'interconnexion, procede de realisation et de connexion a une carte associes
FR3057434B1 (fr) * 2016-10-11 2018-11-02 Aptiv Technologies Limited Dispositif de camera comportant un systeme d'alignement avec un capteur d'image
US20180315894A1 (en) * 2017-04-26 2018-11-01 Advanced Semiconductor Engineering, Inc. Semiconductor device package and a method of manufacturing the same
US10948682B2 (en) * 2018-03-23 2021-03-16 Amazon Technologies, Inc. Self-aligning lens holder and camera assembly

Family Cites Families (7)

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Publication number Priority date Publication date Assignee Title
DE58909888C5 (de) * 1989-05-31 2017-03-02 Osram Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen eines oberflächenmontierbaren Opto-Bauelements und oberflächenmontierbares Opto-Bauelement
US5216805A (en) * 1990-12-12 1993-06-08 Eastman Kodak Company Method of manufacturing an optoelectronic device package
US5302778A (en) * 1992-08-28 1994-04-12 Eastman Kodak Company Semiconductor insulation for optical devices
JPH09181287A (ja) * 1995-10-24 1997-07-11 Sony Corp 受光装置とその製造方法
JP3836235B2 (ja) * 1997-12-25 2006-10-25 松下電器産業株式会社 固体撮像装置及びその製造方法
JP4311783B2 (ja) * 1998-03-05 2009-08-12 オリンパス株式会社 光学装置
US6117193A (en) * 1999-10-20 2000-09-12 Amkor Technology, Inc. Optical sensor array mounting and alignment

Also Published As

Publication number Publication date
WO2002075815A1 (fr) 2002-09-26
JP2004522346A (ja) 2004-07-22
FR2822326A1 (fr) 2002-09-20
EP1374315A1 (fr) 2004-01-02
US20040080658A1 (en) 2004-04-29
CA2440947A1 (fr) 2002-09-26

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20121130