FR2824640B1 - Couplage optique destine a tester des circuits integres - Google Patents

Couplage optique destine a tester des circuits integres

Info

Publication number
FR2824640B1
FR2824640B1 FR0116591A FR0116591A FR2824640B1 FR 2824640 B1 FR2824640 B1 FR 2824640B1 FR 0116591 A FR0116591 A FR 0116591A FR 0116591 A FR0116591 A FR 0116591A FR 2824640 B1 FR2824640 B1 FR 2824640B1
Authority
FR
France
Prior art keywords
integrated circuits
optical coupling
testing integrated
testing
coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0116591A
Other languages
English (en)
Other versions
FR2824640A1 (fr
Inventor
Kenneth R Wilsher
Steven A Kasapi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schlumberger Technologies Inc
Original Assignee
Schlumberger Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger Technologies Inc filed Critical Schlumberger Technologies Inc
Publication of FR2824640A1 publication Critical patent/FR2824640A1/fr
Application granted granted Critical
Publication of FR2824640B1 publication Critical patent/FR2824640B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Computer Hardware Design (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Optical Couplings Of Light Guides (AREA)
FR0116591A 2000-12-21 2001-12-20 Couplage optique destine a tester des circuits integres Expired - Fee Related FR2824640B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/746,618 US6985219B2 (en) 2000-12-21 2000-12-21 Optical coupling for testing integrated circuits

Publications (2)

Publication Number Publication Date
FR2824640A1 FR2824640A1 (fr) 2002-11-15
FR2824640B1 true FR2824640B1 (fr) 2005-01-28

Family

ID=25001617

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0116591A Expired - Fee Related FR2824640B1 (fr) 2000-12-21 2001-12-20 Couplage optique destine a tester des circuits integres

Country Status (6)

Country Link
US (2) US6985219B2 (fr)
JP (1) JP4260393B2 (fr)
KR (1) KR20020050743A (fr)
DE (1) DE10162222A1 (fr)
FR (1) FR2824640B1 (fr)
TW (1) TW525307B (fr)

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US7519248B2 (en) 2000-03-16 2009-04-14 Lightsmyth Technologies Inc Transmission gratings designed by computed interference between simulated optical signals and fabricated by reduction lithography
KR20030044255A (ko) * 2001-11-29 2003-06-09 한국전자통신연구원 플립칩 본딩 광모듈 패키지 및 그 패키징 방법
KR20030056573A (ko) * 2001-12-28 2003-07-04 한국전자통신연구원 고체 결상 렌즈의 경사각 측정 장치
US6823582B1 (en) * 2002-08-02 2004-11-30 National Semiconductor Corporation Apparatus and method for force mounting semiconductor packages to printed circuit boards
US7030977B2 (en) * 2003-05-06 2006-04-18 Visteon Global Technologies, Inc. Non-contact optical system for production testing of electronic assemblies
US7256055B2 (en) 2003-08-25 2007-08-14 Tau-Metrix, Inc. System and apparatus for using test structures inside of a chip during the fabrication of the chip
GB0406665D0 (en) * 2004-03-25 2004-04-28 Melexis Nv Testing intergrated circuits
WO2005104314A2 (fr) * 2004-04-13 2005-11-03 Sa Intexys Procede de fabrication de circuits electroniques et optoelectroniques
US20070007637A1 (en) * 2004-08-12 2007-01-11 Marinov Valery R Multi-layered substrate assembly with vialess electrical interconnect scheme
US7349599B1 (en) 2005-03-14 2008-03-25 Lightsmyth Technologies Inc Etched surface gratings fabricated using computed interference between simulated optical signals and reduction lithography
TW200717678A (en) * 2005-05-05 2007-05-01 Koninkl Philips Electronics Nv Method for analyzing an integrated circuit, apparatus and integrated circuit
US8068709B2 (en) * 2005-09-12 2011-11-29 Lightsmyth Technologies Inc. Transmission gratings designed by computed interference between simulated optical signals and fabricated by reduction lithography
US8245080B2 (en) 2009-03-19 2012-08-14 International Business Machines Corporation Model-based testing of an application program under test
JP5314634B2 (ja) * 2010-05-17 2013-10-16 株式会社アドバンテスト 試験装置、試験方法、およびデバイスインターフェイス
US8456185B2 (en) * 2010-08-17 2013-06-04 Avago Technologies General Ip (Singapore) Pte. Ltd. Test adapter and method for achieving optical alignment and thermal coupling thereof with a device under test
US20120286818A1 (en) * 2011-05-11 2012-11-15 Qualcomm Incorporated Assembly for optical backside failure analysis of wire-bonded device during electrical testing
US9250213B1 (en) 2011-06-14 2016-02-02 The Boeing Company Ultrasound inspection system for inspecting a test object with non-planar features
US9383342B1 (en) 2012-06-19 2016-07-05 The Boeing Company Ultrasound inspection system for inspecting a test object with non-planar features
US9377594B2 (en) 2011-12-29 2016-06-28 Intel Corporation Two-dimensional, high-density optical connector
US9507086B2 (en) 2011-12-30 2016-11-29 Intel Corporation Optical I/O system using planar light-wave integrated circuit
US9442254B2 (en) 2013-06-10 2016-09-13 Freescale Semiconductor, Inc. Method and apparatus for beam control with optical MEMS beam waveguide
US9094135B2 (en) 2013-06-10 2015-07-28 Freescale Semiconductor, Inc. Die stack with optical TSVs
US9435952B2 (en) 2013-06-10 2016-09-06 Freescale Semiconductor, Inc. Integration of a MEMS beam with optical waveguide and deflection in two dimensions
US9810843B2 (en) 2013-06-10 2017-11-07 Nxp Usa, Inc. Optical backplane mirror
US9091820B2 (en) 2013-06-10 2015-07-28 Freescale Semiconductor, Inc. Communication system die stack
US10230458B2 (en) 2013-06-10 2019-03-12 Nxp Usa, Inc. Optical die test interface with separate voltages for adjacent electrodes
US9261556B2 (en) 2013-06-10 2016-02-16 Freescale Semiconductor, Inc. Optical wafer and die probe testing
US9766409B2 (en) 2013-06-10 2017-09-19 Nxp Usa, Inc. Optical redundancy
CN109849083A (zh) * 2017-11-30 2019-06-07 得力富企业股份有限公司 电路板裁切设备
US10173246B1 (en) * 2018-05-30 2019-01-08 Nanotronics Imaging, Inc. Systems, apparatus, and methods for sorting components using illumination
KR102594414B1 (ko) * 2018-10-24 2023-10-30 삼성전자주식회사 프로브 장치 및 이를 포함하는 테스트 장치
EP3734267A1 (fr) 2019-05-01 2020-11-04 Northrop Grumman Innovation Systems, Inc. Dispositifs d'inspection comportant des émetteurs laser et des microphones optiques et systèmes et procédés associés

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US160407A (en) 1875-03-02 Improvement in umbrellas
US4627731A (en) * 1985-09-03 1986-12-09 United Technologies Corporation Common optical path interferometric gauge
US5152962A (en) * 1988-07-22 1992-10-06 Ord Corp. Immunoassay apparatus
US5751159A (en) 1995-09-05 1998-05-12 Motorola, Inc. Semiconductor array and switches formed on a common substrate for array testing purposes
JP2970505B2 (ja) * 1995-11-21 1999-11-02 日本電気株式会社 半導体デバイスの配線電流観測方法、検査方法および装置
US5631571A (en) 1996-04-03 1997-05-20 The United States Of America As Represented By The Secretary Of The Air Force Infrared receiver wafer level probe testing
US5812708A (en) 1996-12-31 1998-09-22 Intel Corporation Method and apparatus for distributing an optical clock in an integrated circuit
JPH11176714A (ja) * 1997-12-08 1999-07-02 Toshiba Corp チャンバ内堆積膜測定装置とメンテナンス管理システム
US6052498A (en) * 1997-12-19 2000-04-18 Intel Corporation Method and apparatus providing an optical input/output bus through the back side of an integrated circuit die
JP3185878B2 (ja) * 1998-09-25 2001-07-11 日本電気株式会社 光学的検査装置
US6501288B1 (en) * 2000-09-28 2002-12-31 Schlumberger Technologies, Inc. On-chip optically triggered latch for IC time measurements

Also Published As

Publication number Publication date
JP2002303654A (ja) 2002-10-18
KR20020050743A (ko) 2002-06-27
US6985219B2 (en) 2006-01-10
FR2824640A1 (fr) 2002-11-15
JP4260393B2 (ja) 2009-04-30
US20020113958A1 (en) 2002-08-22
US20050128471A1 (en) 2005-06-16
DE10162222A1 (de) 2002-07-11
US7042563B2 (en) 2006-05-09
TW525307B (en) 2003-03-21

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Legal Events

Date Code Title Description
CD Change of name or company name
TP Transmission of property
TP Transmission of property
ST Notification of lapse

Effective date: 20100831